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公开(公告)号：US07814649B2
公开(公告)日：2010-10-19
申请号：US11482945
申请日：2006-07-10
CPC分类号： H05K3/44 , H05K1/056 , H05K3/0047 , H05K3/0052 , H05K3/429 , H05K3/4641 , H05K2203/0323 , H05K2203/1476 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155
摘要： A method of making a circuitized substrate which includes a plurality of contiguous open segments along a side edge portion of the at least one electrically conductive layer thereof, these open segments isolated by a barrier of dielectric material which substantially fills the open segments, e.g., during a lamination process which bonds two dielectric layers of the substrate to the conductive layer.
摘要翻译： 一种制造电路化衬底的方法，该衬底包括沿着其至少一个导电层的侧边缘部分的多个邻接的开放段，这些开放段通过电介质材料的屏障隔开，其基本上填充开放段，例如在 层压工艺，其将基板的两个电介质层粘合到导电层。
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82.发明授权Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same 失效具有内部层叠半导体芯片的电路化基板，其制造方法，使用其的电气组件以及利用其的信息处理系统公开(公告)号：US07800916B2
公开(公告)日：2010-09-21
申请号：US11783306
申请日：2007-04-09
IPC分类号： H01R12/16
CPC分类号： H05K1/186 , H01L23/4985 , H01L25/105 , H01L2224/16225 , H01L2224/16235 , H01L2224/16238 , H01L2224/73204 , H01L2224/81192 , H01L2224/81193 , H01L2224/81385 , H01L2224/82039 , H01L2224/82047 , H01L2224/92125 , H01L2225/06513 , H01L2225/06524 , H01L2225/06541 , H01L2924/00011 , H01L2924/00014 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/30107 , H01L2924/3011 , H05K3/4611 , H05K2201/09509 , H05K2201/09518 , H05K2201/10515 , H05K2201/10681 , Y10T29/49126 , Y10T29/49151 , H01L2924/00 , H01L2224/48 , H01L2224/0401
摘要： A circuitized substrate assembly comprised of at least two circuitized substrates each including a thin dielectric layer and a conductive layer with a plurality of conductive members as part thereof, the conductive members of each substrate being electrically coupled to the conductive sites of a semiconductor chip. A dielectric layer is positioned between both substrates and the substrates are bonded together, such that the chips are internally located within the assembly and oriented in a stacked orientation. A method of making such an assembly is also provided, as is an electrical assembly utilizing same and an information handling system adapted for having such an electrical assembly as part thereof.
摘要翻译： 电路化衬底组件由至少两个电路化衬底组成，每个衬底均包括薄介电层和具有多个导电构件作为其一部分的导电层，每个衬底的导电构件电耦合到半导体芯片的导电部位。 电介质层位于两个基板之间，并且基板接合在一起，使得芯片在内部位于组件内并且以堆叠取向定向。 还提供了制造这种组件的方法，以及使用其的电组件以及适于将这种电组件作为其一部分的信息处理系统。
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83.发明授权Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same 失效具有减少热膨胀的无卤素电路化基板，其制造方法，利用其的多层基板结构以及利用其的信息处理系统公开(公告)号：US07687722B2
公开(公告)日：2010-03-30
申请号：US11541776
申请日：2006-10-03
IPC分类号： H05K1/03
CPC分类号： H05K3/4688 , H01L23/145 , H01L23/3733 , H01L23/49833 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/3011 , H05K1/0366 , H05K1/0373 , H05K3/4652 , H05K3/4655 , H05K2201/0209 , H05K2201/0278 , H05K2201/09309 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , H01L2224/0401
摘要： A circuitized substrate including a composite layer comprising a first dielectric sub-layer comprised of a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein. A method of making such a substrate is also provided, as is a multilayered assembly including one or more such circuitized substrates, possibly in combination with other substrates. An information handling system designed for having one or more such circuitized substrates is also provided.
摘要翻译： 一种电路化基板，包括复合层，该复合层包括由不含卤素的树脂和分散在其中的纤维构成的第一介电子层和不含纤维的第二电介质子层，并且还包括无卤素树脂和无机颗粒。 还提供了制造这种基板的方法，以及包括一个或多个这样的电路化基板的多层组件，可能与其它基板组合。 还提供了设计用于具有一个或多个这样的电路化基板的信息处理系统。
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公开(公告)号：US07627947B2
公开(公告)日：2009-12-08
申请号：US11797232
申请日：2007-05-02
申请人： Thomas J. Davis , Subahu D. Desai , John M. Lauffer , James J. McNamara, Jr. , Voya R. Markovich
发明人： Thomas J. Davis , Subahu D. Desai , John M. Lauffer , James J. McNamara, Jr. , Voya R. Markovich
CPC分类号： H05K3/429 , H05K3/0032 , H05K3/0038 , H05K3/427 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0355 , H05K2201/09536 , H05K2201/096 , H05K2203/0143 , H05K2203/0554 , H05K2203/1545 , H05K2203/1572 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A method of making a multilayered circuitized substrate in which a continuous process is used to form electrically conductive layers which each will form part of a sub-composite. The sub-composites are then aligned such that openings within the conductive layers are also aligned, the sub-composites are then bonded together, and a plurality of holes are then laser drilled through the entire thickness of the bonded structure. The dielectric layers used in the sub-composites do not include continuous or semi-continuous fibers therein, thus expediting hole formation there-through.
摘要翻译： 制造多层电路化基板的方法，其中使用连续工艺来形成每个将形成子复合材料的一部分的导电层。 然后对准次级复合材料，使得导电层内的开口也对准，然后将该次级复合材料结合在一起，然后在结合结构的整个厚度上激光钻出多个孔。 在次级复合材料中使用的电介质层不包括其中的连续或半连续的纤维，因此加速了孔的形成。
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85.发明申请Circuitized substrate with P-aramid dielectric layers and method of making same 审中-公开具有P型芳族聚酰胺介电层的电路基板及其制造方法公开(公告)号：US20090258161A1
公开(公告)日：2009-10-15
申请号：US12380637
申请日：2009-03-02
CPC分类号： H01L23/145 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L2224/16225 , H01L2924/12044 , H01L2924/15311 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K3/4652 , H05K2201/0209 , H05K2201/0278
摘要： A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on the dielectric layer. A method of making this substrate is also provided.
摘要翻译： 一种电路化基板，包括具有浸渍有无卤低吸湿树脂的对芳族聚酰胺纸，并且不包括作为其一部分的连续或半连续玻璃纤维纤维的介电层和位于介电层上的第一电路层。 还提供了制造该基板的方法。
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86.发明授权Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same 有权用于电路化基板和包括其的电路化基板的含氟聚合物电介质组合物公开(公告)号：US07429789B2
公开(公告)日：2008-09-30
申请号：US11390386
申请日：2006-03-28
CPC分类号： H01L23/145 , H01L21/44 , H01L21/48 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L29/40 , H01L2924/0002 , H05K1/0373 , H05K3/4602 , H05K2201/015 , H05K2201/0209 , Y10T428/1303 , H01L2924/00
摘要： A dielectric composition for forming a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like, the composition including at least two fluoropolymers and two inorganic fillers. A circuitized substrate including at least one such dielectric layer and at least one conductive layer thereon is also provided.
摘要翻译： 一种电介质组合物，用于形成可用于诸如PCB，芯片载体等的电路化基底中的介电层，所述组合物包含至少两种含氟聚合物和两种无机填料。 还提供了包括至少一个这样的电介质层和其上的至少一个导电层的电路化衬底。
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87.发明申请MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYMER DIELECTRIC 有权使用液晶聚合物电介质的多层互连结构公开(公告)号：US20080217050A1
公开(公告)日：2008-09-11
申请号：US11873435
申请日：2007-10-17
CPC分类号： H01L21/4853 , H01L23/3735 , H01L23/49822 , H01L2224/16225 , H01L2924/01004 , H01L2924/01019 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01322 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H05K1/114 , H05K3/429 , H05K3/4602 , H05K3/4608 , H05K3/462 , H05K3/4623 , H05K3/4626 , H05K3/4632 , H05K3/4641 , H05K3/4688 , H05K2201/0141 , H05K2201/0191 , H05K2201/068 , H05K2201/09509 , H05K2201/09536 , H05K2201/09554 , H05K2201/0959 , H05K2201/096 , H05K2201/10378 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T156/1092
摘要： A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.
摘要翻译： 多层互连结构和形成方法。 在第一实施例中，第一和第二液晶聚合物（LCP）电介质层分别直接接合到导热层的第一和第二相对表面，没有外在粘合材料将导热层与第一或第二液晶聚合物 LCP电介质层。 在第二实施例中，第一和第二2S1P子结构分别直接接合到LCP电介质接合层的第一和第二相对表面，没有外部粘合材料将LCP电介质接合层与第一或第二2S1P子结构结合。
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公开(公告)号：US07381587B2
公开(公告)日：2008-06-03
申请号：US11324432
申请日：2006-01-04
IPC分类号： H01L21/00
CPC分类号： H05K3/4641 , H05K3/429 , H05K2203/068
摘要： A method of making a circuitized substrate and an electrical assembly utilizing same in which the substrate is comprised of at least two sub-composites in which the dielectric material of at least one of these sub-composites is heated during bonding (e.g., lamination) to the other sufficiently to cause the dielectric material to flow into and substantially fill openings in a conductive layer for the bonded structure. Conductive thru-holes are formed within the bonded structure to couple selected ones of the structure's conductive layers. Formation of an electrical assembly is possible by positioning one or more electrical components (e.g., semiconductor chips or chip carriers) on the final structure and electrically coupling these to the structure's external circuitry.
摘要翻译： 一种制造电路化基板的方法和使用其的电气组件，其中基板由至少两个亚复合材料构成，其中这些亚复合材料中的至少一个的介电材料在粘合（例如，层压）期间被加热到 另一个足以使电介质材料流入并基本上填充用于接合结构的导电层中的开口。 导电通孔形成在接合结构内，以耦合所选择的结构导电层。 通过将一个或多个电气部件（例如，半导体芯片或芯片载体）定位在最终结构上并将其电耦合到结构的外部电路，可以形成电组件。
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89.发明授权Method of making circuitized substrate with split conductive layer and information handling system utilizing same 有权制造具有分裂导电层的电路化基板的方法和利用其的信息处理系统公开(公告)号：US07377033B2
公开(公告)日：2008-05-27
申请号：US11641810
申请日：2006-12-20
IPC分类号： H01K3/10
CPC分类号： H01L23/49811 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H05K1/0216 , H05K1/0256 , H05K1/056 , H05K3/0047 , H05K3/429 , H05K3/44 , H05K3/4641 , H05K2201/093 , H05K2201/09345 , H05K2201/09481 , H05K2201/09663 , H05K2201/0969 , H05K2203/0323 , H05K2203/1476 , Y10T29/49126 , Y10T29/49155 , Y10T29/49162 , Y10T29/49165 , Y10T29/49176 , H01L2224/0401
摘要： A method of making circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within a product (e.g., electrical assembly) which includes the substrate as part thereof. An information handling system, e.g., a mainframe computer, which represents one of the products in which the substrate may be utilized, is also provided.
摘要翻译： 一种制造电路化衬底的方法，其包括多个邻接的开放段，其限定导电层内的相对边缘部分以隔离导电层的分离部分，使得该层可用于不同的功能，例如电力和地面 元件，在包括基板作为其一部分的产品（例如，电气组件）内。 还提供了代表其中可以使用衬底的产品之一的信息处理系统，例如主机计算机。
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90.发明申请Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing 失效具有减少的热膨胀的无卤素电路基板，制造方法，利用其的多层基板结构以及利用其的信息处理系统公开(公告)号：US20080078570A1
公开(公告)日：2008-04-03
申请号：US11541776
申请日：2006-10-03
CPC分类号： H05K3/4688 , H01L23/145 , H01L23/3733 , H01L23/49833 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/3011 , H05K1/0366 , H05K1/0373 , H05K3/4652 , H05K3/4655 , H05K2201/0209 , H05K2201/0278 , H05K2201/09309 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , H01L2224/0401
摘要： A circuitized substrate including a composite layer comprising a first dielectric sub-layer comprised of a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein. A method of making such a substrate is also provided, as is a multilayered assembly including one or more such circuitized substrates, possibly in combination with other substrates. An information handling system designed for having one or more such circuitized substrates is also provided.
摘要翻译： 一种电路化基板，包括复合层，该复合层包括由不含卤素的树脂和分散在其中的纤维构成的第一介电子层和不含纤维的第二电介质子层，并且还包括无卤素树脂和无机颗粒。 还提供了制造这种基板的方法，以及包括一个或多个这样的电路化基板的多层组件，可能与其它基板组合。 还提供了设计用于具有一个或多个这样的电路化基板的信息处理系统。
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