公开(公告)号：US5052103A

公开(公告)日：1991-10-01

申请号：US430270

申请日：1989-11-02

Applicant: Hideo Saitou

Inventor： Hideo Saitou

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K3/427 ,  H05K3/0055 ,  H05K1/0366 ,  H05K2201/0769 ,  H05K2201/09581 ,  Y10T29/49165

Abstract: A method of manufacturing a printed wiring board includes a step of providing a plurality of pierced holes in prescribed positions of a laminate which is formed by adhering electrolytic conductive metal foils on front and rear surfaces of a laminate mainly composed of resin, a step of dipping the laminate completely provided with the pierced holes in unhardened liquid thermosetting resin, a step of removing excessive parts of the thermosetting resin applied onto the front and rear surfaces of the laminate and inner peripheral walls surfaces of the pierced holes, a step of heating and hardening the applied thermosetting resin, a step of removing parts of the thermosetting resin hardened on the conductive metal foils provided on the front and rear surfaces of the laminate, and a step of forming plating layers of a conductive metal on the front and rear surfaces of the laminate and the inner peripheral wall surfaces of the pierced holes. A printed wiring board having an excellent insulation property between through-holes can be manufactured through the aforementioned steps.

Abstract translation: 一种制造印刷电路板的方法包括在层叠体的规定位置设置多个穿孔的步骤，该层叠体通过在主要由树脂构成的层叠体的前表面和后表面上附着电解导电金属箔而形成，浸渍步骤 层压板在未硬化的液体热固性树脂中完全设置有穿孔，除去施加在层压体的前表面和后表面上的多余的热固性树脂和穿孔的内周壁表面的步骤，加热和硬化的步骤 涂布的热固性树脂，除去设置在层叠体的前表面和后表面上的导电金属箔上硬化的热固性树脂的部分的步骤，以及在该表面上形成导电金属的镀层的步骤 层压板和穿孔的内周壁表面。 可以通过上述步骤制造通孔之间绝缘性优异的印刷电路板。

公开(公告)号：US20180072897A1

公开(公告)日：2018-03-15

申请号：US15558956

申请日：2016-03-18

Applicant: LOUGHBOROUGH UNIVERSITY

Inventor： Mark Andrew ASHWORTH ,  Helen Elizabeth PEARSON ,  Xujin BAO ,  Geoffrey David WILCOX

IPC: C09D7/12 ,  C09D5/00 ,  C09D175/04 ,  H05K3/28

CPC classification number: C09D7/70 ,  C08K3/346 ,  C08K7/00 ,  C08K9/02 ,  C08K9/04 ,  C08K2201/004 ,  C08K2201/005 ,  C08K2201/011 ,  C09D5/00 ,  C09D7/61 ,  C09D7/62 ,  C09D175/04 ,  H05K1/0373 ,  H05K3/28 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0769 ,  H05K2201/09872

Abstract: A nanocomposite coating composition for use in the mitigation of whisker growth from a metallic surface (82) includes a polymer matrix (86) comprising a base polymer and insulating material nanoplatelets (85), for example clay nanoplatelets, within the polymer matrix (86). A conformal coating (84) for application to a metal surface (82) is formed from the coating composition. The conformal coating mitigates the spontaneous growth of whiskers (83), in particular tin whiskers, from the coated surface (82), reducing the risk of short-circuits caused by such whiskers bridging gaps within electronic devices. Methods are provided for the preparation of coating compositions and coatings.

公开(公告)号：US20170348805A1

公开(公告)日：2017-12-07

申请号：US15536344

申请日：2015-12-09

Applicant: SENJU METAL INDUSTRY CO., LTD. ,  DDK Ltd.

Inventor： Kaichi TSURUTA ,  Osamu MUNEKATA ,  Hiroyuki IWAMOTO ,  Atsushi IKEDA ,  Hiroyuki MORIUCHI ,  Shinichi KAYAMA ,  Yoshihiro TADOKORO

IPC: B23K35/26 ,  C22C13/00 ,  H05K1/11 ,  H05K1/09 ,  H05K3/40 ,  B23K101/36 ,  H05K3/18

CPC classification number: B23K35/262 ,  B23K2101/36 ,  C22C13/00 ,  C23C2/04 ,  C23C2/08 ,  C23C30/00 ,  H05K1/09 ,  H05K1/111 ,  H05K1/118 ,  H05K3/18 ,  H05K3/4007 ,  H05K2201/0769

Abstract: The disclosed solder alloy is useful for plating and for use with electronic components, which are capable of suppressing the formation of external stress-type whiskers. This solder alloy for plating contains Sn and Ni, with the Ni content being 0.06-5.0 mass % inclusive and the remainder including Sn, and is used in electrical contacts that are electrically connected through mechanical joining.

公开(公告)号：US20170187131A1

公开(公告)日：2017-06-29

申请号：US15458582

申请日：2017-03-14

Applicant: CONTINENTAL AUTOMOTIVE GMBH

Inventor： Michael Decker ,  Thomas Riepl ,  Holger Schlotter

IPC: H01R12/58 ,  H05K1/11

CPC classification number: H01R12/58 ,  H05K1/02 ,  H05K1/115 ,  H05K3/306 ,  H05K2201/0116 ,  H05K2201/0769 ,  H05K2201/10303 ,  H05K2201/10424

Abstract: An arrangement for an electronic device is disclosed. A plurality of electrically conductive pins is positioned in respective vias of the circuit carrier, the pins extend from a first face of the circuit carrier to a contact end in order to electrically contact one or more components. The arrangement is equipped with an electrically insulating layer on a circuit carrier face, which is the first or a second face, in the region of the pin, the insulating layer having a prefabricated element which is positioned on the face of the circuit carrier. A portion of each pin, the portion being arranged adjacently to the respective via on the face, is surrounded by the material of the insulating layer in a continuously lateral manner.

公开(公告)号：US09693453B2

公开(公告)日：2017-06-27

申请号：US14019863

申请日：2013-09-06

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Takahiro Hayashi ,  Seiji Mori ,  Tatsuya Ito

IPC: H05K1/00 ,  H05K1/09 ,  H01L23/00 ,  H05K3/28 ,  H05K3/40 ,  H01L21/56 ,  H05K3/24

CPC classification number: H05K1/092 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16238 ,  H01L2224/27013 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81411 ,  H01L2224/81455 ,  H01L2224/92125 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0769 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0597 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A wiring board includes a base layer, a plurality of connection terminals and a surface layer. The base layer is electrically insulative. The plurality of connection terminals are conductive and formed on the base layer. The surface layer is electrically insulative, and fills gaps between the plurality of connection terminals on the base layer. The connection terminals include a base portion made of a conductive first metal and a coating portion made of a conductive second metal that is different from the first metal. The coating portion penetrates the surface layer, and coats the base portion to the base layer.

公开(公告)号：US20170127514A1

公开(公告)日：2017-05-04

申请号：US15354668

申请日：2016-11-17

Applicant: Waseda University ,  Fuji Electric Co., Ltd.

Inventor： Yoshimichi Ohki ,  Yuichi Hirose ,  Genta Wada ,  Toshikatsu Tanaka ,  Kenji Okamoto

IPC: H05K1/05 ,  C09D163/00 ,  C09D7/12 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/056 ,  C09D7/67 ,  C09D7/68 ,  C09D7/69 ,  C09D163/00 ,  H05K1/0201 ,  H05K1/0204 ,  H05K1/0256 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0769 ,  H05K2201/10106 ,  Y10T428/24893

Abstract: A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 μm with an average particle diameter (D50) of 500 nm to 20 μm, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.

公开(公告)号：US20160293330A1

公开(公告)日：2016-10-06

申请号：US15177493

申请日：2016-06-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroshi ABE ,  Yoshiyuki NOMURA ,  Junichi SAITO

IPC: H01G4/224 ,  H05K3/34 ,  H01G4/30 ,  H01G4/232 ,  H05K1/18 ,  H01G4/248

CPC classification number: H01G4/224 ,  H01G2/065 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H01G13/003 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/0769 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component includes a main body, first and second external electrodes, and a water-repellent film. The first and second external electrodes are provided on a portion of a surface of the main body. The water-repellent film is provided on another portion of the surface of the main body and on a surface of the first external electrode. The water-repellent film contains a non-cross-linked silicone resin. An angle of contact of water of about 25° C. with the water-repellent film is not less than about 100° and not greater than about 160°.

公开(公告)号：US09390858B2

公开(公告)日：2016-07-12

申请号：US14667928

申请日：2015-03-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroshi Abe ,  Yoshiyuki Nomura ,  Junichi Saito

IPC: H05K1/16 ,  H01G4/224 ,  H01G2/06 ,  H01G4/232 ,  H01G4/30 ,  H05K3/34

CPC classification number: H01G4/224 ,  H01G2/065 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H01G13/003 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/0769 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component includes a main body, first and second external electrodes, and a water-repellent film. The first and second external electrodes are provided on a portion of a surface of the main body. The water-repellent film is provided on another portion of the surface of the main body and on a surface of the first external electrode. The water-repellent film contains a non-cross-linked silicone resin. An angle of contact of water of about 25° C. with the water-repellent film is not less than about 100° and not greater than about 160°.

Abstract translation: 电子部件包括主体，第一和第二外部电极以及防水膜。 第一外部电极和第二外部电极设置在主体的表面的一部分上。 防水膜设置在主体的表面的另一部分和第一外部电极的表面上。 防水膜含有非交联的有机硅树脂。 约25℃的水与防水膜的接触角度不小于约100°且不大于约160°。

公开(公告)号：US09332642B2

公开(公告)日：2016-05-03

申请号：US14481188

申请日：2014-09-09

Applicant: Panasonic Corporation

Inventor： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/10 ,  H05K3/18 ,  H05K3/40 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/119 ,  H01L2224/81385 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/0032 ,  H05K3/0044 ,  H05K3/0076 ,  H05K3/0079 ,  H05K3/0085 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4007 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0239 ,  H05K2201/0376 ,  H05K2201/0769 ,  H05K2201/09227 ,  H05K2201/09472 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/09972 ,  H05K2203/0108 ,  H05K2203/013 ,  H05K2203/0143 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/0285 ,  H05K2203/0565 ,  H05K2203/0706 ,  H05K2203/0776 ,  H05K2203/1163 ,  Y02P70/611

Abstract: One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate.

Abstract translation: 本发明的一个方面涉及一种包括绝缘基底的电路板; 以及电路层，其由导体形成，并且设置在所述绝缘基底基板的表面上，其中所述绝缘基底具有表面粗糙度Ra为0.5μm以下的平滑表面，并且所述导体至少部分地 嵌入形成在绝缘性基板的表面的布线槽。

公开(公告)号：US09200168B2

公开(公告)日：2015-12-01

申请号：US13932903

申请日：2013-07-01

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Yutaka Morii

IPC: C23C22/48 ,  C09D7/12 ,  C23C18/48 ,  C23C22/58 ,  C25D3/32 ,  C25D3/60 ,  H05K3/22 ,  C23C22/00 ,  H05K3/24 ,  H05K3/34 ,  H01L21/48

CPC classification number: C09D7/1233 ,  C09D7/63 ,  C23C18/48 ,  C23C22/58 ,  C25D3/32 ,  C25D3/60 ,  H01L21/4835 ,  H05K3/22 ,  H05K3/244 ,  H05K3/3473 ,  H05K2201/0769 ,  H05K2203/0789 ,  H05K2203/122

Abstract: A tin or tin alloy plating film surface treatment aqueous solution that can reduce whiskers on the surface of a tin or tin alloy plating film, and can provide a favorable tin or tin alloy plating film using a simple method for tin or tin alloy plating films that are used on electronic components.

Abstract translation: 一种锡或锡合金电镀薄膜表面处理水溶液，可以减少锡或锡合金镀膜表面的晶须，并可以使用锡或锡合金镀膜的简单方法提供有利的锡或锡合金镀膜， 用于电子元件。