公开(公告)号：US08149584B2

公开(公告)日：2012-04-03

申请号：US12410685

申请日：2009-03-25

Applicant: Hitoshi Saita ,  Kenji Horino ,  Yasunobu Oikawa ,  Shinichiro Kakei

Inventor： Hitoshi Saita ,  Kenji Horino ,  Yasunobu Oikawa ,  Shinichiro Kakei

IPC: H05K1/18

CPC classification number: H05K1/162 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2201/098

Abstract: In a dielectric element, the angle θ made by either the top face or the bottom face and the side faces is either 0°

Abstract translation: 在电介质元件中，角度和角度; 由顶面或底面和侧面制成的角度为0°<θ; <89°，或91°<θ; <180°，并且为89°＆lt; l1E以外的角度;＆Thetas;＆nlE; 91°。 通过这种方式，介电元件的侧面与玻璃环氧树脂基板和绝缘材料的接触面积增加，与树脂基板的粘附性提高，并且当埋在两个树脂之间时，可以提高强度和可靠性 底物。

公开(公告)号：US08130507B2

公开(公告)日：2012-03-06

申请号：US12409143

申请日：2009-03-23

Applicant: Makoto Origuchi ,  Tsuneaki Takashima

Inventor： Makoto Origuchi ,  Tsuneaki Takashima

IPC: H05K7/00

CPC classification number: H05K1/185 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/162 ,  H05K3/4602 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09718 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A component built-in wiring board is provided. The component built-in wiring board 10 includes a core substrate 11, a first component 61, a first built-up layer 31 and a capacitor 101. The core substrate 11 has a housing hole 90 and the first component 61 is housed in the housing hole 90. A component mounting region 20 capable of mounting a second component 21 is provided in a surface 39 of the first built-up layer 31. The capacitor 101 has electrode layers 102 and 103 and a dielectric layer 104. The capacitor 101 is embedded in the first built-up layer 31 such that a first front surface 105 and a second front surface 106 in the electrode layer 102 and a first front surface 107 and a second front surface 108 in the electrode layer 103 are disposed in parallel with the surface 39 of the first built-up layer 31.

Abstract translation: 提供组件内置接线板。 部件内置布线板10包括芯基板11，第一部件61，第一累积层31和电容器101.芯基板11具有容纳孔90，第一部件61容纳在壳体 在第一累积层31的表面39中设置能够安装第二部件21的部件安装区域20.电容器101具有电极层102和103以及电介质层104.电容器101被嵌入 在第一堆叠层31中使得电极层102中的第一前表面105和第二前表面106以及电极层103中的第一前表面107和第二前表面108平行于该表面 39是第一组合层31。

公开(公告)号：US08116091B2

公开(公告)日：2012-02-14

申请号：US12873815

申请日：2010-09-01

Applicant: Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

Inventor： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L24/17 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/185 ,  H05K1/186 ,  H05K1/187 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A printed circuit board has a core substrate including a resin substrate having an opening, a capacitor formed in the opening and having a first electrode structure having a portion facing to the upper surface of the core substrate and a second electrode structure having a portion facing to the lower surface of the core substrate, an upper insulating layer formed over the upper surface of the core substrate and having a conductive circuit formed over the upper insulating layer and a via hole electrically connecting the portion of the first electrode structure and the conductive circuit of the upper insulating layer, and a lower insulating layer formed over the lower surface of the core substrate and having a conductive circuit formed over the lower insulating layer and a via hole electrically connecting the portion of the second electrode structure and the conductive circuit of the lower insulating layer.

Abstract translation: 印刷电路板具有包括具有开口部的树脂基板的芯基板，形成在开口部的电容器，具有第一电极结构，具有与芯基板的上表面相对的部分，第二电极结构体具有面向 芯基板的下表面，形成在芯基板的上表面上方并具有形成在上绝缘层上的导电电路的上绝缘层和将第一电极结构的部分与导电电路电连接的通孔， 上绝缘层和下绝缘层，形成在芯基板的下表面上，并且具有形成在下绝缘层上的导电电路和将第二电极结构的部分与下部绝缘层的导电电路电连接的通孔 绝缘层。

公开(公告)号：US20120018207A1

公开(公告)日：2012-01-26

申请号：US12879312

申请日：2010-09-10

Applicant: Chen-Yueh Kung

Inventor： Chen-Yueh Kung

IPC: H05K1/11 ,  H05K3/20

CPC classification number: H05K3/465 ,  H05K1/0298 ,  H05K3/045 ,  H05K3/108 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0554 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A circuit substrate includes a base layer, a first patterned conductive layer, a dielectric layer, a conductive block and a second patterned conductive layer. The first patterned conductive layer is disposed on the base layer and has a first pad. The dielectric layer is disposed on the base layer and covers the first patterned conductive layer, wherein the dielectric layer has an opening and the first pad is exposed by the opening. The conductive block is disposed in the opening and covers the first pad. The second patterned conductive layer is disposed on a surface of the dielectric layer and has a second pad, wherein the second pad and the conductive block are integrally formed. In addition, a fabricating process of a circuit substrate is also provided.

Abstract translation: 电路基板包括基底层，第一图案化导电层，电介质层，导电块和第二图案化导电层。 第一图案化导电层设置在基底层上并具有第一焊盘。 电介质层设置在基底层上并覆盖第一图案化导电层，其中电介质层具有开口，第一焊盘由开口露出。 导电块设置在开口中并覆盖第一焊盘。 第二图案化导电层设置在电介质层的表面上并具有第二焊盘，其中第二焊盘和导电块一体形成。 此外，还提供了电路基板的制造工艺。

公开(公告)号：US08097946B2

公开(公告)日：2012-01-17

申请号：US12263174

申请日：2008-10-31

Applicant: Kouichi Saitou ,  Mayumi Nakasato ,  Ryosuke Usui

Inventor： Kouichi Saitou ,  Mayumi Nakasato ,  Ryosuke Usui

IPC: H01L23/053 ,  H01L23/12

CPC classification number: H01L23/49811 ,  H01L23/145 ,  H01L23/3733 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H05K1/0366 ,  H05K1/112 ,  H05K3/0041 ,  H05K3/3436 ,  H05K3/3457 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2203/1152 ,  H01L2224/05599

Abstract: A device mounting board includes an insulating layer formed of an insulating resin, a glass cloth covering the surface of the insulating layer, and an electrode provided in a through hole extending through the glass cloth. The angle of contact with solder of the glass cloth is larger than that of the resin. Thus, solder bumps are formed on the electrode 14 of the device mounting board 10 with high precision.

Abstract translation: 装置安装板包括由绝缘树脂形成的绝缘层，覆盖绝缘层表面的玻璃布和设置在穿过玻璃布的通孔中的电极。 玻璃布与焊料的接触角大于树脂的接触角。 因此，在装置安装基板10的电极14上高精度地形成焊锡凸块。

公开(公告)号：US20110291694A1

公开(公告)日：2011-12-01

申请号：US12953180

申请日：2010-11-23

Applicant: Tsuyoshi Kozai ,  Nobuhiro Yamamoto

Inventor： Tsuyoshi Kozai ,  Nobuhiro Yamamoto

IPC: G01R31/28

CPC classification number: H05K1/0268 ,  G06F1/1637 ,  H01L23/49822 ,  H01L2924/0002 ,  H04N5/64 ,  H05K3/4069 ,  H05K3/42 ,  H05K2201/09509 ,  H05K2201/096 ,  H01L2924/00

Abstract: According to one embodiment, a television apparatus includes a circuit board, a conductive portion, and an easily broken portion. The circuit board is mounted with an electronic component. The conductive portion is located on a surface or the inside of the circuit board. A breakage detection mechanism detects breakage of the conductive portion by conduction. The easily broken portion is provided to at least part of the conductive portion. The easily broken portion is broken easier than other portions of the conductive portion when a stress is applied to the circuit board.

Abstract translation: 根据一个实施例，电视设备包括电路板，导电部分和容易断开的部分。 电路板安装有电子元件。 导电部分位于电路板的表面或内部。 破损检测机构通过导电检测导电部分的断裂。 容易断开的部分被提供给导电部分的至少一部分。 当对电路板施加应力时，容易断裂的部分比导电部分的其它部分容易断裂。

公开(公告)号：US20110289773A1

公开(公告)日：2011-12-01

申请号：US13209052

申请日：2011-08-12

Applicant: Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

Inventor： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC: H05K3/30

CPC classification number: H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83132 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K1/036 ,  H05K1/188 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0352 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49165

Abstract: A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

Abstract translation: 通过提供具有第一绝缘层，第二绝缘层和导电膜的基底基板的方法制造印刷线路板。 在基于对准标记确定的位置处将电子部件放置在第一绝缘层上。 在将电子部件封闭在第二绝缘层的开口内之后，在基于对准标记确定的位置处形成暴露电子部件的端子的通孔，该位置用于确定电子部件的位置。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US20110271524A1

公开(公告)日：2011-11-10

申请号：US13185295

申请日：2011-07-18

Applicant: Hironori TANAKA ,  Keisuke Shimizu

Inventor： Hironori TANAKA ,  Keisuke Shimizu

IPC: H05K3/30

CPC classification number: H05K1/162 ,  H05K1/09 ,  H05K3/4602 ,  H05K2201/0352 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09718 ,  Y10T29/4913

Abstract: A multilayer printed wiring board includes a core substrate, a resin insulation layer laminated on the core substrate and a capacitor section coupled to the resin insulating layer. The capacitor section includes a first electrode including a first metal and configured to be charged by a negative charge, and a second electrode including a second metal and opposing the first electrode, the second electrode configured to be charged by a positive charge. A dielectric layer is interposed between the first electrode and second electrode, and an ionization tendency of the first metal is larger than and ionization tendency of the second metal.

Abstract translation: 多层印刷线路板包括芯基板，层叠在芯基板上的树脂绝缘层和耦合到树脂绝缘层的电容器部分。 电容器部分包括第一电极，其包括第一金属并被构造为通过负电荷充电;以及第二电极，包括第二金属并与第一电极相对，第二电极被配置为通过正电荷充电。 电介质层插入在第一电极和第二电极之间，第一金属的电离倾向大于第二金属的离子化倾向。

公开(公告)号：US20110260299A1

公开(公告)日：2011-10-27

申请号：US12765110

申请日：2010-04-22

Applicant: Robert D. Edwards ,  Frank D. Egitto ,  Luis J. Matienzo ,  Susan Pitely ,  Daniel C. Van Hart

Inventor： Robert D. Edwards ,  Frank D. Egitto ,  Luis J. Matienzo ,  Susan Pitely ,  Daniel C. Van Hart

IPC: H01L23/50 ,  H05K3/00 ,  H01L21/441

CPC classification number: H05K3/0055 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K2201/015 ,  H05K2201/09509 ,  H05K2203/095 ,  H01L2924/00

Abstract: A semiconductor printed circuit board assembly (PCBA) and method for making same for use in electronic packages having a core layer of copper-invar-copper (CIC) with a layer of dielectric substrate placed on the core layer. A second layer of dielectric substrate is placed on the lower surface of the core layer of CIC. The layers are laminated together. Blind vias are laser drilled into the layers of dielectric substrate. The partially completed PCBA is subjected to a reactive ion etch (RIE) plasma as a first step to clean blind vias in the PCBA. After the plasma etch, an acidic etchant liquid solution is used on the blind vias. Pre-plating cleaning of blind vias removes a majority of oxides from the blind vias. Seed copper layers are then applied to the PCBA, followed by a layer of copper plating that can be etched to meet the requirements of the PCBA.

Abstract translation: 一种半导体印刷电路板组件（PCBA）及其制造方法，用于具有放置在芯层上的介电基片层的具有铜 - 铜 - 铜（CIC）芯层的电子封装。 第二层电介质基片放置在CIC芯层的下表面上。 层叠在一起。 盲孔通过激光钻入电介质基片的层中。 部分完成的PCBA经受反应离子蚀刻（RIE）等离子体作为清洁PCBA中的盲孔的第一步骤。 在等离子体蚀刻之后，在盲孔上使用酸性蚀刻剂液体溶液。 盲孔的电镀前清洁从盲孔中除去大部分氧化物。 然后将种子铜层施加到PCBA，随后是可以被蚀刻以满足PCBA的要求的一层镀铜层。

公开(公告)号：US08035214B1

公开(公告)日：2011-10-11

申请号：US09830949

申请日：1999-11-17

Applicant: Naohiro Hirose ,  Hitoshi Ito ,  Yoshiyuki Iwata ,  Masanori Kawade ,  Hajime Yazu

Inventor： Naohiro Hirose ,  Hitoshi Ito ,  Yoshiyuki Iwata ,  Masanori Kawade ,  Hajime Yazu

IPC: H01L23/48 ,  H01L21/4763

CPC classification number: H01L23/49811 ,  H01L2224/05001 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/15312 ,  H05K1/111 ,  H05K1/112 ,  H05K3/28 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0979 ,  H05K2201/10318 ,  Y10T428/239

Abstract: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.

Abstract translation: 一种包含衬底的封装衬底310，该衬底设置有导体层5，导电连接销100被布置成与母板建立电连接并固定到衬底的表面，其中提供用于固定导电连接销的衬垫16 用于封装衬底310.衬垫16被具有开口18的有机树脂绝缘层15覆盖，衬垫16通过该开口部分地暴露于外部。 导电连接销100通过导电粘合剂17通过开口固定到暴露于外部的焊盘，从而防止例如当执行安装时发生例如导电连接销100从基板的溶液。