公开(公告)号：US20120098120A1

公开(公告)日：2012-04-26

申请号：US12908946

申请日：2010-10-21

申请人： Chen-Hua Yu ,  Hao-Yi Tsai ,  Jiun Yi Wu ,  Tin-Hao Kuo

发明人： Chen-Hua Yu ,  Hao-Yi Tsai ,  Jiun Yi Wu ,  Tin-Hao Kuo

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/16 ,  H01L24/13 ,  H01L24/17 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05567 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/1601 ,  H01L2224/16104 ,  H01L2224/16105 ,  H01L2224/16237 ,  H01L2224/1712 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01025 ,  H01L2924/00012 ,  H01L2924/00

摘要： A low-stress chip package is disclosed. The package includes two substrates. The first substrate includes an array of first conductive structures in the corner area of the chip, and an array of second conductive structures in the peripheral edge area of the chip. The first and second conductive structures each has a conductive pillar having elongated cross section in the plane parallel to the first substrate and a solder bump over the pillar. The package also includes a second substrate having an array of metal traces. The elongated pillars each form a coaxial bump-on-trace interconnect with a metal trace respectively. The long axis of the elongated cross section of a pillar in the corner area of the chip points to chip's center area, and the long axis of the elongated cross section of a pillar in chip's peripheral edge area aligns perpendicular to the edge.

摘要翻译： 公开了一种低应力芯片封装。 该封装包括两个基板。 第一衬底包括在芯片的拐角区域中的第一导电结构的阵列和芯片的周边边缘区域中的第二导电结构的阵列。 第一和第二导电结构各自具有在与第一基板平行的平面中具有细长横截面的导电柱和在柱上的焊料凸块。 该封装还包括具有金属迹线阵列的第二衬底。 细长的柱分别与金属迹线形成同轴的跟踪轨迹互连。 芯片角部区域中的柱的细长截面的长轴指向芯片的中心区域，并且芯片的周缘区域中的柱的细长截面的长轴与边缘垂直排列。

公开(公告)号：US20120217632A1

公开(公告)日：2012-08-30

申请号：US13035586

申请日：2011-02-25

申请人： Yu-Feng Chen ,  Yuh Chern Shieh ,  Tsung-Shu Lin ,  Han-Ping Pu ,  Jiun Yi Wu ,  Tin-Hao Kuo

发明人： Yu-Feng Chen ,  Yuh Chern Shieh ,  Tsung-Shu Lin ,  Han-Ping Pu ,  Jiun Yi Wu ,  Tin-Hao Kuo

IPC分类号： H01L23/498

CPC分类号： H01L24/16 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/17 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16013 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： A device includes a work piece, and a metal trace on a surface of the work piece. A Bump-on-Trace (BOT) is formed at the surface of the work piece. The BOT structure includes a metal bump, and a solder bump bonding the metal bump to a portion of the metal trace. The metal trace includes a metal trace extension not covered by the solder bump.

摘要翻译： 一种装置包括工件和工件表面上的金属迹线。 在工件的表面形成凸起跟踪（BOT）。 BOT结构包括金属凸块和将金属凸块接合到金属迹线的一部分的焊料凸块。 金属迹线包括未被焊料凸块覆盖的金属迹线延伸。

公开(公告)号：US08970033B2

公开(公告)日：2015-03-03

申请号：US13035586

申请日：2011-02-25

申请人： Yu-Feng Chen ,  Yuh Chern Shieh ,  Tsung-Shu Lin ,  Han-Ping Pu ,  Jiun Yi Wu ,  Tin-Hao Kuo

发明人： Yu-Feng Chen ,  Yuh Chern Shieh ,  Tsung-Shu Lin ,  Han-Ping Pu ,  Jiun Yi Wu ,  Tin-Hao Kuo

IPC分类号： H01L23/498 ,  H01L23/00

CPC分类号： H01L24/16 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/17 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16013 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： A device includes a work piece, and a metal trace on a surface of the work piece. A Bump-on-Trace (BOT) is formed at the surface of the work piece. The BOT structure includes a metal bump, and a solder bump bonding the metal bump to a portion of the metal trace. The metal trace includes a metal trace extension not covered by the solder bump.

摘要翻译： 一种装置包括工件和工件表面上的金属迹线。 在工件的表面形成凸起跟踪（BOT）。 BOT结构包括金属凸块和将金属凸块接合到金属迹线的一部分的焊料凸块。 金属迹线包括未被焊料凸块覆盖的金属迹线延伸。

公开(公告)号：US09768105B2

公开(公告)日：2017-09-19

申请号：US13452589

申请日：2012-04-20

申请人： Mirng-Ji Lii ,  Chen-Hua Yu ,  Chien-Hsiun Lee ,  Yung Ching Chen ,  Jiun Yi Wu

发明人： Mirng-Ji Lii ,  Chen-Hua Yu ,  Chien-Hsiun Lee ,  Yung Ching Chen ,  Jiun Yi Wu

IPC分类号： H01L25/07 ,  H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L23/528 ,  H01L25/10

CPC分类号： H01L23/49838 ,  H01L23/49811 ,  H01L23/5283 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/20 ,  H01L24/24 ,  H01L25/105 ,  H01L2224/16238 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： System and method are disclosed for creating a rigid interconnect between two substrate mounted packages to create a package-on-package assembly. A solid interconnect may have a predetermined length configured to provide a predetermined package separation, may be cylindrical, conical or stepped, may be formed by extrusion, casting, drawing or milling and may have an anti-oxidation coating. The interconnect may be attached to mounting pads on the top and bottom packages via an electrically conductive adhesive, including, but not limited to solder and solder paste. A solder preservative or other anti-oxidation coating may be applied to the mounting pad. A package-on-package assembly with solid interconnects may have a top package configured to accept at least one electronic device, with the solid interconnects mounted between the top package and a bottom package to rigidly hold the package about parallel to each other.

公开(公告)号：US20140021605A1

公开(公告)日：2014-01-23

申请号：US13552375

申请日：2012-07-18

申请人： Chen-Hua Yu ,  Yung Ching Chen ,  Chien-Hsun Lee ,  Jiun Yi Wu ,  Mirng-Ji Lii ,  Ming-Da Cheng

发明人： Chen-Hua Yu ,  Yung Ching Chen ,  Chien-Hsun Lee ,  Jiun Yi Wu ,  Mirng-Ji Lii ,  Ming-Da Cheng

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L25/0657 ,  H01L21/4853 ,  H01L21/68778 ,  H01L23/3142 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/16058 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643 ,  H01L2924/20644 ,  H01L2924/20645 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2924/014

摘要： Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a stick region, a first ball region coupled to a first end of the stick region, and a second ball region coupled to a second end of the stick region. The metal stud bumps include a portion that is partially embedded in a solder joint.

摘要翻译： 封装封装（PoP）器件和封装半导体管芯的方法被公开。 PoP器件包括第一封装管芯和耦合到第一封装管芯的第二封装管芯。 在第一封装模具和第二封装模具之间设置金属凸块凸块。 金属柱凸块包括一个棒状区域，一个耦合到该棒状区域的第一端的第一球形区域和一个耦合到该棒状区域的第二端的第二球形区域。 金属柱凸块包括部分嵌入焊点中的部分。

公开(公告)号：US20110285012A1

公开(公告)日：2011-11-24

申请号：US12784298

申请日：2010-05-20

申请人： Chen-Hua Yu ,  Jiun Yi Wu

发明人： Chen-Hua Yu ,  Jiun Yi Wu

IPC分类号： H01L23/485 ,  H01L21/768

CPC分类号： H01L24/11 ,  H01L21/563 ,  H01L23/3192 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/0381 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/13006 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/05552

摘要： An under-bump metallization (UBM) structure for a substrate, such as an organic substrate, a ceramic substrate, a silicon or glass interposer, a high density interconnect, a printed circuit board, or the like, is provided. A buffer layer is formed over a contact pad on the substrate such that at least a portion of the contact pad is exposed. A conductor pad is formed within the opening and extends over at least a portion of the buffer layer. The conductor pad may have a uniform thickness and/or a non-planar surface. The substrate may be attached to another substrate and/or a die.

摘要翻译： 提供了用于诸如有机衬底，陶瓷衬底，硅或玻璃插入件，高密度互连，印刷电路板等的衬底的凸块下金属化（UBM）结构。 缓冲层形成在衬底上的接触焊盘上，使得接触焊盘的至少一部分被暴露。 导体焊盘形成在开口内并在缓冲层的至少一部分上延伸。 导体焊盘可以具有均匀的厚度和/或非平面表面。 衬底可以附接到另一衬底和/或模具。

公开(公告)号：US20140042621A1

公开(公告)日：2014-02-13

申请号：US13570065

申请日：2012-08-08

申请人： Chen-Hua Yu ,  Mirng-Ji Lii ,  Chien-Hsun Lee ,  Yung Ching Chen ,  Jiun Yi Wu

发明人： Chen-Hua Yu ,  Mirng-Ji Lii ,  Chien-Hsun Lee ,  Yung Ching Chen ,  Jiun Yi Wu

IPC分类号： H01L23/498 ,  H01L21/28 ,  H01L21/50

CPC分类号： H01L24/05 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85375 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/2075 ,  H01L2924/20751

摘要： An embodiment is a package-on-package (PoP) device comprising a first package on a first substrate and a second package over the first package. A plurality of wire sticks disposed between the first package and the second package and the plurality of wire sticks couple the first package to the second package. Each of the plurality of wire sticks comprise a conductive wire of a first height affixed to a bond pad on the first substrate and each of the plurality of wire sticks is embedded in a solder joint.

摘要翻译： 一个实施例是一种封装封装（PoP）器件，其包括在第一衬底上的第一封装和在第一封装上的第二封装。 设置在第一封装和第二封装之间的多个线棒，并且多个线棒将第一封装耦合到第二封装。 多个线棒中的每一个包括固定到第一基板上的接合焊盘的第一高度的导线，并且多个线棒中的每一个嵌入焊接接头中。

公开(公告)号：US20130277841A1

公开(公告)日：2013-10-24

申请号：US13452589

申请日：2012-04-20

申请人： Mirng-Ji Lii ,  Chen-Hua Yu ,  Chien-Hsiun Lee ,  Yung Ching Chen ,  Jiun Yi Wu

发明人： Mirng-Ji Lii ,  Chen-Hua Yu ,  Chien-Hsiun Lee ,  Yung Ching Chen ,  Jiun Yi Wu

IPC分类号： H01L25/07 ,  H01L21/60

CPC分类号： H01L23/49838 ,  H01L23/49811 ,  H01L23/5283 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/20 ,  H01L24/24 ,  H01L25/105 ,  H01L2224/16238 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： System and method are disclosed for creating a rigid interconnect between two substrate mounted packages to create a package-on-package assembly. A solid interconnect may have a predetermined length configured to provide a predetermined package separation, may be cylindrical, conical or stepped, may be formed by extrusion, casting, drawing or milling and may have an anti-oxidation coating. The interconnect may be attached to mounting pads on the top and bottom packages via an electrically conductive adhesive, including, but not limited to solder and solder paste. A solder preservative or other anti-oxidation coating may be applied to the mounting pad. A package-on-package assembly with solid interconnects may have a top package configured to accept at least one electronic device, with the solid interconnects mounted between the top package and a bottom package to rigidly hold the package about parallel to each other.

摘要翻译： 公开了用于在两个基板安装的封装之间创建刚性互连以产生封装封装组件的系统和方法。 固体互连可以具有预定长度，其被配置为提供预定的包装分离，可以是圆柱形，圆锥形或阶梯形，可以通过挤出，浇铸，拉拔或研磨形成，并且可以具有抗氧化涂层。 互连可以经由导电粘合剂附接到顶部和底部封装上的安装焊盘，包括但不限于焊料和焊膏。 可以将焊料防腐剂或其它抗氧化涂层施加到安装垫。 具有固体互连的封装封装组件可以具有被配置为接纳至少一个电子器件的顶部封装，其中固体互连件安装在顶部封装和底部封装之间，以使封装彼此平行地刚性地保持。

公开(公告)号：US09171790B2

公开(公告)日：2015-10-27

申请号：US13552375

申请日：2012-07-18

申请人： Chen-Hua Yu ,  Yung Ching Chen ,  Chien-Hsun Lee ,  Jiun Yi Wu ,  Mirng-Ji Lii ,  Ming-Da Cheng

发明人： Chen-Hua Yu ,  Yung Ching Chen ,  Chien-Hsun Lee ,  Jiun Yi Wu ,  Mirng-Ji Lii ,  Ming-Da Cheng

IPC分类号： H01L25/065 ,  H01L23/498 ,  H01L21/48 ,  H01L25/10 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01L21/4853 ,  H01L21/68778 ,  H01L23/3142 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/16058 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643 ,  H01L2924/20644 ,  H01L2924/20645 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2924/014

摘要： Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a stick region, a first ball region coupled to a first end of the stick region, and a second ball region coupled to a second end of the stick region. The metal stud bumps include a portion that is partially embedded in a solder joint.

摘要翻译： 封装封装（PoP）器件和封装半导体管芯的方法被公开。 PoP器件包括第一封装管芯和耦合到第一封装管芯的第二封装管芯。 在第一封装模具和第二封装模具之间设置金属凸块凸块。 金属柱凸块包括一个棒状区域，一个耦合到该棒状区域的第一端的第一球形区域和一个耦合到该棒状区域的第二端的第二球形区域。 金属柱凸块包括部分嵌入焊点中的部分。

公开(公告)号：US08803323B2

公开(公告)日：2014-08-12

申请号：US13539048

申请日：2012-06-29

申请人： Chen-Hua Yu ,  Jiun Yi Wu ,  Tsung-Ding Wang

发明人： Chen-Hua Yu ,  Jiun Yi Wu ,  Tsung-Ding Wang

IPC分类号： H01L29/72

CPC分类号： H01L21/56 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/81895 ,  H01L2224/83104 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

摘要： A device includes a first package component and the second package component. The first package component includes a first plurality of connectors at a top surface of the first package component, and a second plurality of connectors at the top surface. The second package component is over and bonded to the first plurality of connectors, wherein the second plurality of connectors is not bonded to the second package component. A solder resist is on the top surface of the first package component. A trench is disposed in the solder resist, wherein a portion of the trench spaces the second plurality of connectors apart from the first plurality of connectors.

摘要翻译： 一种装置包括第一包装件和第二包装件。 第一包装部件包括在第一包装部件的顶表面处的第一多个连接器和在顶部表面处的第二多个连接器。 第二包装部件结束并结合到第一多个连接器，其中第二多个连接器不结合到第二包装部件。 阻焊剂在第一包装部件的顶表面上。 沟槽设置在阻焊剂中，其中沟槽的一部分将第二多个连接器与第一多个连接器分开。