公开(公告)号：US06506982B1

公开(公告)日：2003-01-14

申请号：US09501596

申请日：2000-02-10

申请人： Hidetaka Shigi ,  Naoya Kitamura ,  Masashi Nishiki ,  Tetsuya Yamazaki ,  Takehiko Hasebe ,  Masayuki Kyooi ,  Yukio Maeda

发明人： Hidetaka Shigi ,  Naoya Kitamura ,  Masashi Nishiki ,  Tetsuya Yamazaki ,  Takehiko Hasebe ,  Masayuki Kyooi ,  Yukio Maeda

IPC分类号： H05K111

CPC分类号： H05K3/403 ,  H01L2224/16237 ,  H05K1/056 ,  H05K3/045 ,  H05K3/42 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/09636 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/09854

摘要： A multi-layer wiring substrate capable of high density packaging, and a method of manufacturing the same, in which a carrier substrate, in which through holes can be easily formed in high density corresponding substantially to a pitch of connecting terminals in a semiconductor chip, and build-up layers are formed on the substrate with the application of a conventional build-up technique. When the build-up technique for repeatedly forming insulating layers and wiring layers on a carrier substrate is used to manufacture a multi-layer wiring substrate, the carrier substrate is formed in the following manner. First, an insulating resin layer is formed in a copper foil, in which a plurality of first windows are regularly provided, to cover the copper foil, and the resin layer fills the interior of the windows. Subsequently, second windows of a particular shape are provided in regions of layers of the insulating resin filled in the windows, and independent conducting paths are formed through the second windows to extend from front sides of the second windows to back sides thereof. The conducting paths are formed radially to be spaced a substantially equal distance from centers of the respective second windows.

公开(公告)号：US20070030791A1

公开(公告)日：2007-02-08

申请号：US11483093

申请日：2006-07-10

申请人： Takehiko Hasebe ,  Yasushi Goto ,  Kiyoko Yamanaka

发明人： Takehiko Hasebe ,  Yasushi Goto ,  Kiyoko Yamanaka

IPC分类号： G11B9/00

CPC分类号： G11B9/1436 ,  B82Y10/00

摘要： In a probe memory device, a technique of realizing consistency of high-density recording and high-speed reading/writing is provided. A recording medium is placed to a probe array chip on which a plurality of probes are arranged in such a way as to maintain a constant spacing thereto by adopting a high-stiffness elastic support structure. The recording medium is equipped with a stage scanner that is driven continuously while drawing a constant trajectory on an X-Y plane almost in parallel to a probe array chip plane. The probes are equipped with respective actuators each being driven in a Z direction almost perpendicular to the X-Y plane. Each of the probes is made to write or read by altering a distance between the probe and the recording medium in parallel processing. The X-Y actuator is controlled so that the probe may continue a predetermined cyclic movement. Moreover, a tracking area is provided in a portion of the recording medium, and a trajectory of the probe by actuation is controlled so as to have a fixed geometry.

摘要翻译： 在探针存储装置中，提供了实现高密度记录和高速读/写一致性的技术。 将记录介质放置在探针阵列芯片上，通过采用高刚度弹性支撑结构，多个探针以其保持恒定间隔的方式布置在其上。 记录介质配备有台式扫描仪，其在与探针阵列芯片平面几乎平行的X-Y平面上绘制恒定轨迹的同时连续驱动。 探头配备有各自的致动器，每个致动器沿着几乎垂直于X-Y平面的Z方向驱动。 通过在并行处理中改变探头和记录介质之间的距离，使每个探针进行写入或读取。 控制X-Y致动器，使得探头可以继续预定的循环运动。 此外，在记录介质的一部分中设置有跟踪区域，并且通过致动来控制探测器的轨迹以具有固定的几何形状。

公开(公告)号：US06744135B2

公开(公告)日：2004-06-01

申请号：US10147073

申请日：2002-05-17

申请人： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

发明人： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

IPC分类号： H01L2334

CPC分类号： H01L24/16 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29139 ,  H01L2224/2929 ,  H01L2224/32057 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/056 ,  H05K1/144 ,  H05K3/384 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10734 ,  H01L2924/05432 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

摘要翻译： 本发明提供一种电子设备，其具有包括金属板的金属芯基板，形成在金属板上的绝缘层和形成在绝缘层上的导电层，以及电子部件，并且导电层和导体层的端子 电子部件连接。 在电子设备中，具有高导热性的部件被布置成与金属板和电子部件两者接触。 因此，电子设备的散热性提高。

公开(公告)号：US08992665B2

公开(公告)日：2015-03-31

申请号：US13574253

申请日：2010-11-19

申请人： Yoshihide Yamaguchi ,  Takehiko Hasebe ,  Yasuko Yamada

发明人： Yoshihide Yamaguchi ,  Takehiko Hasebe ,  Yasuko Yamada

IPC分类号： C22B26/12 ,  C22B5/00 ,  B01D61/24 ,  C22B7/00 ,  H01M10/54 ,  B01D61/30 ,  B01D63/16

CPC分类号： C22B26/12 ,  B01D61/246 ,  B01D61/30 ,  B01D63/16 ,  B01D2315/02 ,  C22B7/006 ,  C22B7/007 ,  H01M10/54 ,  Y02P10/234 ,  Y02W30/84

摘要： Provided is a valuable-metal recovery method for recovering metals from lithium ion batteries using comparatively simple equipment and without using a cumbersome process. In said method, a positive electrode material from lithium ion batteries, containing lithium and a transition metal, is dissolved in an acidic solution, thereby generating lithium ions and ions of the transition metal in the acidic solution. Said acidic solution and a recovery liquid are then made to flow with an anion-permeable membrane interposed therebetween, causing the lithium ions to permeate from the acidic solution to recovery solution. Lithium ions are then recovered from the recovery liquid containing dissolved lithium ions.

摘要翻译： 提供了一种用于使用相对简单的设备从不使用麻烦的方法从锂离子电池中回收金属的有价值的金属回收方法。 在所述方法中，将含有锂和过渡金属的锂离子电池的正极材料溶解在酸性溶液中，从而在酸性溶液中产生过渡金属的锂离子和离子。 然后使所述酸性溶液和回收液体与其间插入阴离子可渗透膜流动，导致锂离子从酸性溶液渗透到回收溶液中。 然后从含有溶解的锂离子的回收液中回收锂离子。

公开(公告)号：US20080088208A1

公开(公告)日：2008-04-17

申请号：US11907057

申请日：2007-10-09

申请人： Kiyoka Yamanaka ,  Yasushi Goto ,  Takehiko Hasebe

发明人： Kiyoka Yamanaka ,  Yasushi Goto ,  Takehiko Hasebe

IPC分类号： H01L41/047

CPC分类号： H02N2/028 ,  B82Y10/00 ,  G11B9/1436 ,  H02N2/021

摘要： An actuator using a piezoelectric element is stably operated at high speed. The actuator includes driving units provided to face a carrier stage and moving the carrier stage in an X-axis direction, piezoelectric elements provided to the driving units respectively and expanding and contracting in the X-axis direction, a carrier electrode provided on a surface of the carrier stage on a driving-unit side, and driving electrodes provided on surfaces of the driving units on a carrier stage side and electrostatically adsorbing the carrier electrode. Signals not synchronized with each other are applied to the piezoelectric elements.

摘要翻译： 使用压电元件的致动器稳定地高速运转。 致动器包括驱动单元，其被设置为面向载物台并沿着X轴方向移动载物台，分别设置在驱动单元上并沿X轴方向扩张和收缩的压电元件，设置在载体台的表面上的载体电极 驱动单元侧的载体台和设置在载体台一侧的驱动单元的表面上的驱动电极，并静电吸附载体电极。 不同步的信号被施加到压电元件。

公开(公告)号：US07351597B2

公开(公告)日：2008-04-01

申请号：US11750371

申请日：2007-05-18

申请人： Yuji Wada ,  Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akira Yabushita ,  Terutaka Mori ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Teruo Shoji ,  Masakazu Sueyoshi

发明人： Yuji Wada ,  Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akira Yabushita ,  Terutaka Mori ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Teruo Shoji ,  Masakazu Sueyoshi

IPC分类号： H01L21/66

CPC分类号： G01R1/07314 ,  G01R31/2872 ,  Y10T29/41 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49798

摘要： The fabrication of a semiconductor integrated circuit device involves testing using a pushing mechanism that is constructed by forming, over the upper surface of a thin film probe, a reinforcing material having a linear expansion coefficient (thermal expansion coefficient) almost equal to that of a wafer to be tested; forming a groove in the reinforcing material above a contact terminal; placing an elastomer in the groove so that a predetermined amount projects out of the groove; and disposing a pusher and another elastomer to sandwich the pusher between the elastomers. With the use of such a probe, it is possible to improve the throughput of wafer-level electrical testing of a semiconductor integrated circuit.

摘要翻译： 半导体集成电路器件的制造包括使用推压机构进行测试，所述推压机构通过在薄膜探针的上表面上形成具有几乎等于晶片的线性膨胀系数（热膨胀系数）的增强材料而构成 待测 在接触端子上方的增强材料中形成凹槽; 将弹性体放置在所述槽中，使得预定量突出到所述凹槽中; 并且设置推进器和另一种弹性体以将推进器夹在弹性体之间。 通过使用这样的探针，可以提高半导体集成电路的晶片级电气测试的吞吐量。

公开(公告)号：US07219422B2

公开(公告)日：2007-05-22

申请号：US10765917

申请日：2004-01-29

申请人： Yuji Wada ,  Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akira Yabushita ,  Terutaka Mori ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Teruo Shoji ,  Masakazu Sueyoshi

发明人： Yuji Wada ,  Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akira Yabushita ,  Terutaka Mori ,  Akio Hasebe ,  Yasuhiro Motoyama ,  Teruo Shoji ,  Masakazu Sueyoshi

IPC分类号： H05K3/00 ,  H01R9/00

CPC分类号： G01R1/07314 ,  G01R31/2872 ,  Y10T29/41 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49798

摘要： The fabrication of a semiconductor integrated circuit device involves testing using a pushing mechanism that is constructed by forming, over the upper surface of a thin film probe, a reinforcing material having a linear expansion coefficient (thermal expansion coefficient) almost equal to that of a wafer to be tested; forming a groove in the reinforcing material above a contact terminal; placing an elastomer in the groove so that a predetermined amount projects out of the groove; and disposing a pusher and another elastomer to sandwich the pusher between the elastomers. With the use of such a probe, it is possible to improve the throughput of wafer-level electrical testing of a semiconductor integrated circuit.

摘要翻译： 半导体集成电路器件的制造包括使用推压机构进行测试，所述推压机构通过在薄膜探针的上表面上形成具有几乎等于晶片的线性膨胀系数（热膨胀系数）的增强材料而构成 待测 在接触端子上方的增强材料中形成凹槽; 将弹性体放置在所述槽中，使得预定量突出到所述凹槽中; 并且设置推进器和另一种弹性体以将推进器夹在弹性体之间。 通过使用这样的探针，可以提高半导体集成电路的晶片级电气测试的吞吐量。

公开(公告)号：US07145231B2

公开(公告)日：2006-12-05

申请号：US10844392

申请日：2004-05-13

申请人： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

发明人： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

IPC分类号： H01L23/34

CPC分类号： H01L24/16 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29139 ,  H01L2224/2929 ,  H01L2224/32057 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/056 ,  H05K1/144 ,  H05K3/384 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10734 ,  H01L2924/05432 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

公开(公告)号：US07049837B2

公开(公告)日：2006-05-23

申请号：US10676609

申请日：2003-10-02

申请人： Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akio Hasebe

发明人： Susumu Kasukabe ,  Takehiko Hasebe ,  Yasunori Narizuka ,  Akio Hasebe

IPC分类号： G01R31/02

CPC分类号： G01R1/06744 ,  G01R1/06711 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2874 ,  H01L24/05 ,  H01L2224/04042 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01033

摘要： A probe card has first contact terminals electrically connected to the fine-pitch electrodes of a test target; wirings drawn from the first contact terminals; and second contact terminals electrically connected to the wirings, wherein the first contact terminals are formed each using an anisotropically etched hole in a crystalline substrate, and a semiconductor device test method (fabrication method) using the probe card.

摘要翻译： 探针卡具有电连接到测试对象的细间距电极的第一接触端子; 从第一接触端子抽出的接线; 以及电连接到所述布线的第二接触端子，其中，使用所述探针卡的半导体器件测试方法（制造方法）在所述晶体衬底中各自使用各向异性蚀刻的孔来形成所述第一接触端子。

公开(公告)号：US07567019B2

公开(公告)日：2009-07-28

申请号：US11907057

申请日：2007-10-09

申请人： Kiyoko Yamanaka ,  Yasushi Goto ,  Takehiko Hasebe

发明人： Kiyoko Yamanaka ,  Yasushi Goto ,  Takehiko Hasebe

IPC分类号： H01L41/08

CPC分类号： H02N2/028 ,  B82Y10/00 ,  G11B9/1436 ,  H02N2/021

摘要： An actuator using a piezoelectric element is stably operated at high speed. The actuator includes driving units provided to face a carrier stage and moving the carrier stage in an X-axis direction, piezoelectric elements provided to the driving units respectively and expanding and contracting in the X-axis direction, a carrier electrode provided on a surface of the carrier stage on a driving-unit side, and driving electrodes provided on surfaces of the driving units on a carrier stage side and electrostatically adsorbing the carrier electrode. Signals not synchronized with each other are applied to the piezoelectric elements.

摘要翻译： 使用压电元件的致动器稳定地高速运转。 致动器包括驱动单元，其被设置为面向载物台并沿着X轴方向移动载物台，分别设置在驱动单元上并沿X轴方向扩张和收缩的压电元件，设置在载体台的表面上的载体电极 驱动单元侧的载体台和设置在载体台一侧的驱动单元的表面上的驱动电极，并静电吸附载体电极。 不同步的信号被施加到压电元件。