公开(公告)号：US20120105760A1

公开(公告)日：2012-05-03

申请号：US13282646

申请日：2011-10-27

申请人： Yoshio TORIYAMA ,  Tetsuya Enomoto

发明人： Yoshio TORIYAMA ,  Tetsuya Enomoto

IPC分类号： G02F1/13357

CPC分类号： G02F1/133308 ,  G02F2001/133311 ,  G02F2001/133612

摘要： A liquid crystal display device is provided, where dust can be prevented from entering into the display device and the quality of the display can be prevented from lowering even in the case where a fan in the main body of the equipment blows air against the rear surface of the display device. The display device having a liquid crystal panel and a backlight illuminating the liquid crystal panel that are integrated with an upper frame that covers a periphery of the front surface of the liquid crystal panel and sides of the backlight is characterized in that a cable for supplying power to a light source provided inside the backlight is led out between a side of the backlight (side mold) and the upper frame, and a portion through which the cable is led out is covered by a sheet.

摘要翻译： 提供了一种液晶显示装置，其中可以防止灰尘进入显示装置，并且即使在设备主体中的风扇将空气吹向后表面的情况下也可以防止显示器的质量下降 的显示装置。 具有液晶面板和照亮液晶面板的背光源的显示装置，其特征在于，用于供电的电缆 设置在背光源内部的光源从背光（侧模）的一侧和上框架之间引出，并且电缆被引出的部分被片材覆盖。

公开(公告)号：US07704799B2

公开(公告)日：2010-04-27

申请号：US11683714

申请日：2007-03-08

申请人： Hidehiro Nakamura ,  Tetsuya Enomoto ,  Toshio Yamazaki ,  Hiroshi Kawazoe

发明人： Hidehiro Nakamura ,  Tetsuya Enomoto ,  Toshio Yamazaki ,  Hiroshi Kawazoe

IPC分类号： H01L21/50

CPC分类号： H01L21/568 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/4007 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A wiring substrate (1) comprises an insulating base (10) with connection holes (11), buried conductors (12) provided in the connection holes (11) without reaching a rear surface of the insulating base (10), and wiring layers 14 connected to the buried conductors (12). The buried conductors (12) thicken the wiring layers (14), and can form aligning parts (110) on the rear surface of the connection holes (11) to be used for three-dimensional mounting structure. Each wiring layer (14) includes thin terminals (14A), wirings (14B) and thick electrodes (14C). Not only the terminals (14A) and wirings (14B) but also the buried conductors (12) are raised by the same manufacturing process. A semiconductor element (2) is attached to the electrodes (14C) of the wiring substrate (1).

摘要翻译： 布线基板（1）包括具有连接孔（11）的绝缘基座（10），设置在连接孔（11）中的埋入导体（12），而不到达绝缘基座（10）的后表面，并且布线层14 连接到埋地导体（12）。 掩埋导体（12）使布线层（14）变厚，并且可以在用于三维安装结构的连接孔（11）的后表面上形成对准部分（110）。 每个布线层（14）包括薄端子（14A），布线（14B）和厚电极（14C）。 不仅端子（14A）和配线（14B）以及埋地导体（12）都通过相同的制造工艺升高。 半导体元件（2）附着到布线基板（1）的电极（14C）上。

公开(公告)号：US20080010819A1

公开(公告)日：2008-01-17

申请号：US11775294

申请日：2007-07-10

申请人： Hidehiro NAKAMURA ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

发明人： Hidehiro NAKAMURA ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC分类号： H05K3/30

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

摘要翻译： 本发明提供一种由一层或两层以上的绝缘树脂组合物层形成的连接板，以及形成为在其绝缘树脂组合物层的厚度方向上形成的连接导体， 连接导体电路，并且使用多层布线板，半导体封装用基板和使用该连接基板的半导体封装，以及其制造方法。

公开(公告)号：US06336210B1

公开(公告)日：2002-01-01

申请号：US09258193

申请日：1999-02-26

申请人： Kenji Taima ,  Teruhiro Yamada ,  Tetsuya Enomoto ,  Satoshi Takemoto ,  Ryuhei Amano

发明人： Kenji Taima ,  Teruhiro Yamada ,  Tetsuya Enomoto ,  Satoshi Takemoto ,  Ryuhei Amano

IPC分类号： G06F945

CPC分类号： G06F8/34

摘要： A panel-presentation-software creation method for creating a software which provides presentation of plural edit panels by using a template with an image fitting region and an editor-designated fitting image to be fitted in the image fitting region, the method comprises the steps of creating a reference file containing the description of reference information including link information designating each image file containing the fitting image, and creating a panel presentation software at least including a panel presentation program, a template file containing the template, and the reference file.

摘要翻译： 一种面板呈现软件创建方法，用于创建通过使用具有图像拟合区域的模板和拟合在图像拟合区域中的编辑器指定的拟合图像来提供多个编辑面板的呈现的软件，该方法包括以下步骤： 创建包含参考信息的描述的参考文件，包括指定包含装配图像的每个图像文件的链接信息，以及创建至少包括面板呈现程序，包含模板的模板文件和参考文件的面板呈现软件。

公开(公告)号：US6133683A

公开(公告)日：2000-10-17

申请号：US98740

申请日：1998-06-17

申请人： Tetsuya Enomoto ,  Hidemasa Komoro ,  Shoji Shirai

发明人： Tetsuya Enomoto ,  Hidemasa Komoro ,  Shoji Shirai

IPC分类号： H01J29/48 ,  H01J29/96 ,  H01J29/50

CPC分类号： H01J29/485 ,  H01J29/96 ,  H01J2229/966

摘要： A color cathode ray tube includes an evacuated envelope having a panel portion with a phosphor screen formed on an inner surface thereof, a neck portion, and a funnel portion connecting the panel portion and the neck portion, and an electron gun housed in the neck portion. The electron gun has a cathode and a plurality of focus grid electrodes including grid electrodes for forming a multistage focus lens for focusing an electron beam emitted from the cathode. The cathode and the focus grid electrodes are fixed in predetermined axially spaced relationship by a pair of bead glass. The electron gun is provided with a voltage divider for producing at least one voltage other than a voltage supplied from outside the evacuated envelope, the voltage divider is made of at least one resistor and is fabricated as a separate element from the bead glass, and at least one of bead glass is provided with a recess for receiving the voltage divider in a surface thereof on a side thereof facing away from the cathode and the focus grid electrodes.

摘要翻译： 彩色阴极射线管包括：抽真空的外壳，具有在其内表面上形成有荧光屏的面板部分，颈部和连接面板部分和颈部的漏斗部分，以及容纳在颈部中的电子枪 。 电子枪具有阴极和多个聚焦栅格电极，包括用于形成用于聚焦从阴极发射的电子束的多层聚焦透镜的栅格电极。 阴极和焦点栅极通过一对珠玻璃以预定的轴向间隔的关系固定。 电子枪设置有分压器，用于产生除了从真空外壳外部提供的电压以外的至少一个电压，分压器由至少一个电阻器制成，并且被制造为与珠玻璃分开的元件，并且在 珠玻璃中的至少一个设置有用于在其背离阴极和焦点栅极的一侧的表面中接收分压器的凹部。

公开(公告)号：US09431314B2

公开(公告)日：2016-08-30

申请号：US13040079

申请日：2011-03-03

申请人： Tetsuya Enomoto ,  Emi Miyazawa ,  Kazutaka Honda ,  Akira Nagai ,  Keisuke Ookubo

发明人： Tetsuya Enomoto ,  Emi Miyazawa ,  Kazutaka Honda ,  Akira Nagai ,  Keisuke Ookubo

IPC分类号： C08L63/00 ,  H01L21/56 ,  H01L23/29 ,  C08G59/42 ,  C08G59/62

CPC分类号： H01L23/295 ,  C08G59/42 ,  C08G59/621 ,  C08L63/00 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00

摘要： A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm.

摘要翻译： 用于半导体底部填充的热固性树脂组合物，其包含作为必要成分的热固性树脂，固化剂，助熔剂和两种或更多种不同平均粒度的无机填料，其中无机填料包括具有平均值的无机填料 粒径不大于100nm的平均粒度大于100nm的无机填料。

公开(公告)号：US06553184B1

公开(公告)日：2003-04-22

申请号：US09008806

申请日：1998-01-20

申请人： Takahisa Ando ,  Teruhiro Yamada ,  Nobuaki Uwa ,  Tetsuya Enomoto

发明人： Takahisa Ando ,  Teruhiro Yamada ,  Nobuaki Uwa ,  Tetsuya Enomoto

IPC分类号： H04N577

CPC分类号： H04N13/261 ,  H04N13/189 ,  H04N2013/0085

摘要： The present invention relates to a method of converting two-dimensional images into three-dimensional images. In the present invention, a first image which forms the basis and a second image obtained by horizontally shifting the first image are produced from the original two-dimensional image. One of the first image and the second image is taken as a left eye image, and the other image is taken as a right eye image. If the left eye image and the right eye image obtained are displayed on a display almost simultaneously, and the left eye image and the right eye image displayed are viewed with the left eye and the right eye of a viewer, therefore, the original two-dimensional image is recognized as an image having a three-dimensional effect by the viewer even when it is a still image.

摘要翻译： 本发明涉及将二维图像转换为三维图像的方法。 在本发明中，从原始二维图像生成形成基础的第一图像和通过水平移动第一图像而获得的第二图像。 将第一图像和第二图像中的一个作为左眼图像，将另一图像作为右眼图像。 所获得的左眼图像和右眼图像几乎同时显示在显示器上，并且用观看者的左眼和右眼观察显示的左眼图像和右眼图像，因此， 即使是静止图像，三维图像被识别为具有观看者的三维效果的图像。

公开(公告)号：US09024455B2

公开(公告)日：2015-05-05

申请号：US12788110

申请日：2010-05-26

申请人： Kazutaka Honda ,  Tetsuya Enomoto ,  Yuuki Nakamura

发明人： Kazutaka Honda ,  Tetsuya Enomoto ,  Yuuki Nakamura

IPC分类号： H01L23/29 ,  C09J163/00 ,  H01L21/56

CPC分类号： H01L23/293 ,  C08K3/014 ,  C08K5/13 ,  C08L79/08 ,  C09J163/00 ,  H01L21/563 ,  H01L2224/73204 ,  H01L2224/83192 ,  C08K3/0041

摘要： A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant.

摘要翻译： 一种半导体封装胶粘剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）抗氧化剂。

公开(公告)号：US08674502B2

公开(公告)日：2014-03-18

申请号：US12838291

申请日：2010-07-16

申请人： Kazutaka Honda ,  Tetsuya Enomoto ,  Yuuki Nakamura

发明人： Kazutaka Honda ,  Tetsuya Enomoto ,  Yuuki Nakamura

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L21/563 ,  C08G59/42 ,  C08L63/00 ,  C09J163/00 ,  C09J163/04 ,  C09J179/08 ,  H01L23/293 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81455 ,  H01L2224/81805 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.

摘要翻译： 本发明涉及半导体封装胶粘剂，半导体封装膜状粘合剂，半导体装置的制造方法以及半导体装置。 本发明提供了包含（a）环氧树脂和（b）由与环氧树脂反应的有机酸和固化促进剂形成的化合物的半导体封装粘合剂。

公开(公告)号：US08034659B2

公开(公告)日：2011-10-11

申请号：US12306285

申请日：2007-06-20

申请人： Akira Nagai ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Tetsuya Enomoto

发明人： Akira Nagai ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Tetsuya Enomoto

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/67092 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/6834 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2224/83885 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product 60 in which a dicing tape 9, an adhesive layer 3, and a semiconductor wafer 6 are stacked in this order so that a circuit surface 6a of the semiconductor wafer 6 may face the dicing tape 9 side. A cutting position is recognized by recognizing a circuit pattern P in the circuit surface 6a from a rear surface 6b of the semiconductor wafer 6. At least the semiconductor wafer 6 and the adhesive layer 3 are cut in the thickness direction of the layered product 60. The dicing tape 9 is cured to peel off the dicing tape 9 and the adhesive layer 3. A projection electrode 4 of a semiconductor chip 26 is aligned with a wiring 12 of a wiring substrate 40. The wiring substrate 40 and the semiconductor chip 26 are bonded via an adhesive layer 23 so that the wiring 12 and the projection electrode 4 may be electrically connected to each other.

摘要翻译： 为了提供一种制造半导体器件的方法，该方法能够有效地获得附着有粘合剂的单片半导体芯片，并且还能够将半导体芯片优良地接合到布线基板，并且提供粘合膜。 依次层叠有切割带9，粘合层3和半导体晶片6的层叠体60，使半导体晶片6的电路面6a面向切割带9侧。 通过从半导体晶片6的后表面6b识别电路表面6a中的电路图案P来识别切割位置。至少半导体晶片6和粘合剂层3在层叠体60的厚度方向上被切割。 将切割胶带9固化以剥离切割胶带9和粘合剂层3.半导体芯片26的投影电极4与布线基板40的布线12对准。布线基板40和半导体芯片26是 通过粘合剂层23粘合，使得布线12和突起电极4可以彼此电连接。