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公开(公告)号：US09066435B2
公开(公告)日：2015-06-23
申请号：US13853227
申请日：2013-03-29
Applicant: IBIDEN CO., LTD.
Inventor： Makoto Terui , Daiki Komatsu , Masatoshi Kunieda , Takashi Kariya
IPC: H05K7/10 , H05K1/11 , H05K3/10 , H01L23/498 , H01L21/56 , H01L23/538 , H05K3/46 , H01L23/00
CPC classification number: H05K3/305 , H01L21/563 , H01L23/49816 , H01L23/49827 , H01L23/49894 , H01L23/5382 , H01L23/5383 , H01L23/5384 , H01L24/03 , H01L24/16 , H01L24/81 , H01L25/50 , H01L2224/0401 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2924/12042 , H01L2924/1436 , H01L2924/15192 , H01L2924/15311 , H05K1/115 , H05K3/10 , H05K3/103 , H05K3/20 , H05K3/32 , H05K3/4602 , H05K3/4658 , H05K3/4694 , H05K2201/10159 , H05K2201/10378 , H05K2201/1053 , Y10T29/49128 , Y10T29/49165 , H01L2924/00 , H01L2924/014
Abstract: A wiring board includes a first insulation layer, a second insulation layer formed on the first insulation layer, a wiring structure interposed between the first insulation layer and the second insulation layer and including an insulation layer and conductive patterns formed on the insulation layer, second conductive patterns formed on the second insulation layer, and a via conductor formed through the second insulation layer and connected to one of the second conductive patterns on the second insulation layer.
Abstract translation: 布线板包括第一绝缘层，形成在第一绝缘层上的第二绝缘层，插入在第一绝缘层和第二绝缘层之间的布线结构，并且包括绝缘层和形成在绝缘层上的导电图案，第二导电 形成在第二绝缘层上的图案，以及通过第二绝缘层形成并连接到第二绝缘层上的第二导电图案之一的通路导体。
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2.发明申请PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE 有权印刷线路板，其制造方法和半导体器件公开(公告)号：US20160066422A1
公开(公告)日：2016-03-03
申请号：US14840693
申请日：2015-08-31
Applicant: IBIDEN CO., LTD.
Inventor： Hajime Sakamoto , Masatoshi Kunieda , Makoto Terui , Takashi Kariya
CPC classification number: H05K1/181 , H01L23/5383 , H01L23/5384 , H01L23/5385 , H01L2224/1403 , H01L2224/16238 , H01L2924/15192 , H01L2924/15313 , H05K1/141 , H05K2201/10522 , H05K2201/1053 , H05K2201/10674 , Y02P70/611
Abstract: A printed wiring board includes a first resin insulating layer, a first conductor pattern including first mounting pads formed on the first resin insulating layer, and a wiring structure positioned on the first resin insulating layer and including a second resin insulating layer and a second conductor pattern such that the second resin insulating layer and second conductor pattern are positioned adjacent to the first conductor pattern and that the second conductor pattern includes second mounting pads. The second mounting pads are embedded in the second resin insulating layer such that the second mounting pads have mounting surfaces exposed on an exposed surface of the second resin insulating layer, and the first mounting pads have mounting surfaces such that the mounting surfaces of the first and second mounting pads are formed on a same plane.
Abstract translation: 印刷电路板包括第一树脂绝缘层，包括形成在第一树脂绝缘层上的第一安装焊盘的第一导体图案和位于第一树脂绝缘层上的布线结构，并且包括第二树脂绝缘层和第二导体图案 使得第二树脂绝缘层和第二导体图案位于第一导体图案附近，并且第二导体图案包括第二安装垫。 第二安装焊盘嵌入在第二树脂绝缘层中，使得第二安装焊盘具有暴露在第二树脂绝缘层的暴露表面上的安装表面，并且第一安装焊盘具有安装表面，使得第一和 第二安装焊盘形成在同一平面上。
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公开(公告)号：US20150136459A1
公开(公告)日：2015-05-21
申请号：US14549951
申请日：2014-11-21
Applicant: IBIDEN Co., Ltd.
Inventor： Masatoshi KUNIEDA , Makoto Terui , Ryoujiro Tominaga , Takashi Kariya
CPC classification number: H05K3/4682 , H01L2224/16227 , H05K1/0256 , H05K1/0265 , H05K1/09 , H05K1/112 , H05K1/113 , H05K1/114 , H05K1/185 , H05K3/243 , H05K3/244 , H05K3/3436 , H05K2201/0352 , H05K2201/0391 , H05K2201/0761 , H05K2201/0769 , H05K2201/094 , H05K2201/09736 , H05K2201/0989 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , H05K2201/2081 , H05K2203/1394 , Y02P70/611 , Y10T29/49155
Abstract: A wiring board includes a first resin insulating layer, conductor pads on the first insulating layer including first and second conductor pads, a second resin insulating layer on the first insulating layer covering the first and second pads, an outermost conductor layer on the second insulating layer including first and second outermost wiring layers, via conductors through the second insulating layer including a first via conductor connecting the first wiring layer and first pad and a second via conductor connecting the second wiring layer and second pad, and a solder resist layer on the second insulating layer such that the solder resist layer is covering the first wiring layer and has one or more openings exposing the second wiring layer. The first wiring layer includes first main metal, and the second wiring layer includes second main metal which is different from the first metal of the first wiring layer.
Abstract translation: 布线基板包括第一树脂绝缘层，第一绝缘层上包括第一和第二导体焊盘的导体焊盘，覆盖第一和第二焊盘的第一绝缘层上的第二树脂绝缘层，第二绝缘层上的最外层导体层 包括第一和第二最外面布线层，通过第二绝缘层的通孔导体包括连接第一布线层和第一焊盘的第一通孔导体和连接第二布线层和第二焊盘的第二通孔导体，以及在第二绝缘层上的阻焊层 绝缘层，使得阻焊层覆盖第一布线层并且具有暴露第二布线层的一个或多个开口。 第一布线层包括第一主金属，第二布线层包括与第一布线层的第一金属不同的第二主金属。
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公开(公告)号：US20140102768A1
公开(公告)日：2014-04-17
申请号：US14053854
申请日：2013-10-15
Applicant: IBIDEN CO., LTD.
Inventor： Yoshinori SHIZUNO , Makoto Terui , Masatoshi Kunieda , Takashi Kariya
CPC classification number: H05K1/0298 , H01L24/14 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/12042 , H01L2924/15192 , H01L2924/15311 , H05K3/3436 , H05K3/4007 , H05K3/4644 , H05K3/4694 , H05K2201/10159 , H01L2924/00
Abstract: A wiring board includes a first insulation layer, a first conductive pattern structure formed on the first insulation layer, a wiring structure formed on the first insulation layer and including a second insulation layer and a second conductive pattern structure on the second insulation layer, and a third insulation layer formed on the first insulation layer and the first conductive pattern structure and having first and second openings such that the first opening is exposing at least a portion of a surface of the wiring structure and the second opening is exposing at least a portion of the first conductive pattern structure. The wiring structure includes a third conductive pattern structure forming an outermost layer of the wiring structure and including a mounting pad structure which mounts a semiconductor device. The first opening is formed such that the first opening is exposing pad formation area of the mounting pad structure.
Abstract translation: 布线基板包括第一绝缘层，形成在第一绝缘层上的第一导电图形结构，形成在第一绝缘层上的布线结构，并且在第二绝缘层上包括第二绝缘层和第二导电图案结构， 第三绝缘层，形成在第一绝缘层和第一导电图案结构上，并且具有第一和第二开口，使得第一开口暴露出布线结构的表面的至少一部分，并且第二开口暴露出至少一部分 第一导电图案结构。 布线结构包括形成布线结构的最外层的第三导电图案结构，并且包括安装半导体器件的安装焊盘结构。 第一开口形成为使得第一开口暴露安装垫结构的焊盘形成区域。
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公开(公告)号：US09613893B2
公开(公告)日：2017-04-04
申请号：US14799846
申请日：2015-07-15
Applicant: IBIDEN CO., LTD.
Inventor： Makoto Terui , Ryojiro Tominaga , Masatoshi Kunieda , Noriki Sawada
IPC: H05K1/16 , H01L23/498 , H01L21/48 , C23C18/32 , C23C18/42 , C23C18/31 , C23C18/16 , H01L23/538 , C25D7/00 , H05K3/40 , H01L25/065 , H01L23/14 , H01L23/15 , H05K3/46 , H05K1/18
CPC classification number: H01L23/49822 , C23C18/1651 , C23C18/1653 , C23C18/31 , C23C18/32 , C23C18/42 , C25D7/00 , H01L21/4857 , H01L21/486 , H01L23/145 , H01L23/15 , H01L23/49827 , H01L23/49894 , H01L23/5389 , H01L25/0655 , H01L2224/16227 , H01L2924/15192 , H01L2924/15313 , H05K1/186 , H05K3/4007 , H05K3/4644 , H05K3/4694 , H05K3/4697 , H05K2201/10378
Abstract: A wiring substrate includes a first outermost conductor layer, a first outermost insulating layer covering the first conductor layer, a second outermost conductor layer formed on opposite side of the first conductor layer, and a second outermost insulating layer covering the second conductor layer. The first insulating layer has first openings such that the first openings are exposing first conductor pads including portions of the first conductor layer, the second insulating layer has second openings such that the second openings are exposing second conductor pads including portions of the second conductor layer, each of the first conductor pads has a first plating layer recessed with respect to outer surface of the first insulating layer, and each of the second conductor pads has a second plating layer formed flush with outer surface of the second insulating layer or having bump shape protruding from the outer surface of the second insulating layer.
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Patent Agency Ranking
公开(公告)号：US20150060127A1
公开(公告)日：2015-03-05
申请号：US14473110
申请日：2014-08-29
Applicant: IBIDEN CO., LTD.
Inventor： Makoto Terui , Takashi Kariya , Yoshinori Shizuno , Masatoshi Kunieda
CPC classification number: H05K1/141 , H01L2224/16225 , H01L2224/81193 , H01L2924/15192 , H01L2924/15311 , H01L2924/19107 , H05K1/0243 , H05K3/1241 , H05K3/323 , H05K3/3436 , H05K2201/041 , H05K2203/173 , Y10T29/49128
Abstract: A combined printed wiring board includes a multilayer printed wiring board, and a wiring film fixed to a surface of the multilayer printed wiring board and including a first wiring structure formed to connect multiple semiconductor elements and a second wiring structure formed to connect the multilayer printed wiring board and each of the semiconductor elements.
Abstract translation: 组合印刷线路板包括多层印刷线路板和固定到多层印刷线路板的表面上的布线膜，并且包括形成为连接多个半导体元件的第一布线结构和形成为连接多层印刷布线的第二布线结构 板和每个半导体元件。
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7.发明授权公开(公告)号：US09832878B2
公开(公告)日：2017-11-28
申请号：US14819579
申请日：2015-08-06
Applicant: IBIDEN CO., LTD.
Inventor： Keisuke Shimizu , Makoto Terui , Ryojiro Tominaga , Yuichi Nakamura
CPC classification number: H05K1/185 , H05K1/0224 , H05K3/305 , H05K3/429 , H05K3/4694 , H05K2201/09536 , H05K2201/09745 , H05K2201/10378 , H05K2201/2072
Abstract: A wiring board with a cavity for a built-in electronic component includes a conductor layer including a conductor circuit layer and a plane layer, and an insulating layer laminated on the conductor layer and having a cavity such that the cavity is forming an exposed portion of the plane layer and formed to mount a built-in electronic component on the exposed portion of the plane layer. The plane layer has a recess structure formed in an outer peripheral portion in the exposed portion of the plane layer.
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公开(公告)号：US09723728B2
公开(公告)日：2017-08-01
申请号：US14817388
申请日：2015-08-04
Applicant: IBIDEN CO., LTD.
Inventor： Keisuke Shimizu , Makoto Terui , Ryojiro Tominaga , Keigo Kamoshita , Tsutomu Yamauchi
CPC classification number: H05K3/4697 , H05K1/186 , H05K3/4007 , H05K3/429 , H05K3/4644 , H05K2201/096
Abstract: A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity, a conductive layer formed on the substrate and extending over the electronic component in the cavity, and a solder-resist layer formed on the conductive layer and having first and second openings such that the first openings are forming first pads including the conductive layer exposed by the first openings and that the second openings are forming second pads including the conductive layer exposed by the second openings. The second pads include portions of the conductive layer formed directly over the electronic component, respectively, and connected to the electronic component, the first pads include portions of the conductive layer formed on outer side with respect to the electronic component, respectively, and each second opening has an opening diameter which is formed smaller than an opening diameter of each first opening.
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公开(公告)号：US09706663B2
公开(公告)日：2017-07-11
申请号：US14840693
申请日：2015-08-31
Applicant: IBIDEN CO., LTD.
Inventor： Hajime Sakamoto , Masatoshi Kunieda , Makoto Terui , Takashi Kariya
IPC: H01L23/538 , H05K1/18 , H05K1/14
CPC classification number: H05K1/181 , H01L23/5383 , H01L23/5384 , H01L23/5385 , H01L2224/1403 , H01L2224/16238 , H01L2924/15192 , H01L2924/15313 , H05K1/141 , H05K2201/10522 , H05K2201/1053 , H05K2201/10674 , Y02P70/611
Abstract: A printed wiring board includes a first resin insulating layer, a first conductor pattern including first mounting pads formed on the first resin insulating layer, and a wiring structure positioned on the first resin insulating layer and including a second resin insulating layer and a second conductor pattern such that the second resin insulating layer and second conductor pattern are positioned adjacent to the first conductor pattern and that the second conductor pattern includes second mounting pads. The second mounting pads are embedded in the second resin insulating layer such that the second mounting pads have mounting surfaces exposed on an exposed surface of the second resin insulating layer, and the first mounting pads have mounting surfaces such that the mounting surfaces of the first and second mounting pads are formed on a same plane.
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公开(公告)号：US09565756B2
公开(公告)日：2017-02-07
申请号：US13853338
申请日：2013-03-29
Applicant: IBIDEN CO., LTD.
Inventor： Makoto Terui , Daiki Komatsu , Masatoshi Kunieda
CPC classification number: H05K1/0298 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15192 , H05K3/3436 , H05K3/4644 , H05K3/4694 , H05K2201/10159 , H01L2924/00
Abstract: A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer, a second insulation layer formed on the first insulation layer and the first conductive patterns and having an opening portion, a wiring structure accommodated in the opening portion of the second insulation layer and including an insulation layer and conductive patterns on the insulation layer, second conductive patterns formed on the second insulation layer; and a via conductor formed in the second insulation layer and connecting one of the first conductive patterns and one of the second conductive patterns.
Abstract translation: 布线板包括第一绝缘层，形成在第一绝缘层上的第一导电图案，形成在第一绝缘层上的第二绝缘层和第一导电图案，并具有开口部分，布置结构容纳在第一绝缘层的开口部分中 第二绝缘层，并且在绝缘层上包括绝缘层和导电图案，形成在第二绝缘层上的第二导电图案; 以及形成在所述第二绝缘层中并连接所述第一导电图案中的一个和所述第二导电图案中的一个的通孔导体。
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