公开(公告)号：US09263627B2

公开(公告)日：2016-02-16

申请号：US14563763

申请日：2014-12-08

Applicant: LuxVue Technology Corporation

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L21/00 ,  B23P19/00 ,  H01L33/00 ,  H01L33/44 ,  H01L23/31 ,  H01L33/06 ,  H01L33/42 ,  H01L33/62 ,  H01L21/56

CPC classification number: H01L25/167 ,  H01L21/56 ,  H01L23/3171 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/005 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US09252375B2

公开(公告)日：2016-02-02

申请号：US13842925

申请日：2013-03-15

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Charles R. Griggs ,  James Michael Perkins

IPC: H01L51/50 ,  G09G3/00 ,  H01L23/00 ,  H01L21/683

CPC classification number: H01L51/50 ,  G09G3/006 ,  G09G3/3208 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/32 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L24/97 ,  H01L27/1214 ,  H01L27/156 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/2401 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/245 ,  H01L2224/29005 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32237 ,  H01L2224/32503 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/7565 ,  H01L2224/75725 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83805 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/97 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/053 ,  H01L2924/0549 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0103 ,  H01L2924/01013 ,  H01L2924/01042 ,  H01L2924/01022 ,  H01L2924/01074 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

Abstract translation: 描述了显示面板和制造方法。 在一个实施例中，显示基板包括像素区域和非像素区域。 子像素阵列和相应的底电极阵列位于像素区域中。 微型LED器件的阵列结合到底部电极阵列。 形成与微型LED器件的阵列电接触的一个或多个顶部电极层。 在一个实施例中，冗余的一对微型LED器件被结合到底部电极阵列。 在一个实施例中，微型LED器件的阵列被成像以检测不规则。

公开(公告)号：US09240397B2

公开(公告)日：2016-01-19

申请号：US14603960

申请日：2015-01-23

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L27/12 ,  H01L25/075 ,  H01L33/48 ,  H01L33/44 ,  H01L33/20 ,  H01L33/08 ,  H01L33/52 ,  H01L33/60 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

Abstract translation: 描述了将微型LED器件集成到发光器件中的发光器件和方法。 在一个实施例中，发光器件包括在堤层内的反射堤岸结构，以及位于堤层顶部并在反射堤岸结构上方升高的导电线。 微型LED器件在反射堤结构内，钝化层位于堤层之上，并且侧向围绕反射堤坝结构内的微型LED器件。 微型LED器件的一部分和在堤层顶部的导电线突出于钝化层的顶表面之上。

公开(公告)号：US09236815B2

公开(公告)日：2016-01-12

申请号：US13710442

申请日：2012-12-10

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H02N13/00 ,  B81C99/00

CPC classification number: H02N13/00 ,  B81C99/002 ,  Y10T279/23

Abstract: Compliant monopolar and bipolar micro device transfer head arrays and methods of formation from SOI substrates are described. In an embodiment, an array of compliant transfer heads are formed over a base substrate and deflectable toward the base substrate, and a patterned metal layer includes a metal interconnect layer electrically connected with an array of the metal electrodes in the array of compliant transfer heads.

Abstract translation: 描述了合适的单极和双极微器件转移头阵列和从SOI衬底形成的方法。 在一个实施例中，柔性传送头阵列形成在基底基板上并且可朝向基底基板偏转，并且图案化金属层包括金属互连层，金属互连层与柔性传送头阵列中的金属电极阵列电连接。

公开(公告)号：US09214494B2

公开(公告)日：2015-12-15

申请号：US14640979

申请日：2015-03-06

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L27/15 ,  H01L27/12 ,  H01L25/075 ,  H01L33/20 ,  H01L33/42 ,  G09G3/32

CPC classification number: H01L27/156 ,  G09G3/32 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/124 ,  H01L33/20 ,  H01L33/42 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.

Abstract translation: 描述显示面板和形成显示面板的方法。 显示面板可以包括包括像素区域和非像素区域的薄膜晶体管基板。 像素区域包括堤开口的阵列和堤开口阵列内的一组底部电极。 接地线位于非像素区域中，并且阵列阵列在像素区域中的堤开口之间延伸并且电连接到非像素区域中的接地线。

公开(公告)号：US20150356918A1

公开(公告)日：2015-12-10

申请号：US14830486

申请日：2015-08-19

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Kelly McGroddy

IPC: G09G3/32 ,  H01L25/16 ,  H01L25/075

CPC classification number: G09G3/3426 ,  G09G3/2088 ,  G09G3/32 ,  G09G3/3216 ,  G09G3/3233 ,  G09G3/3266 ,  G09G2300/0828 ,  G09G2300/0842 ,  G09G2300/0857 ,  G09G2310/08 ,  G09G2320/029 ,  G09G2330/028 ,  H01L25/0753 ,  H01L25/167 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.

Abstract translation: 描述发光组件。 在一个实施例中，一个或多个发光二极管（LED）器件和一个或多个微控制器被结合到衬底的同一侧，一个或多个微控制器用于切换和驱动一个或多个LED器件。

公开(公告)号：US20150333221A1

公开(公告)日：2015-11-19

申请号：US14278778

申请日：2014-05-15

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Dariusz Golda

IPC: H01L33/20 ,  H01L33/52 ,  H01L33/62 ,  H01L33/44 ,  H01L33/08 ,  H01L27/15

CPC classification number: H01L25/167 ,  G09F9/301 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1266 ,  H01L27/15 ,  H01L27/153 ,  H01L27/156 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/24101 ,  H01L2224/24105 ,  H01L2224/24227 ,  H01L2224/245 ,  H01L2224/27462 ,  H01L2224/2747 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32227 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81424 ,  H01L2224/81438 ,  H01L2224/81444 ,  H01L2224/81466 ,  H01L2224/81486 ,  H01L2224/8149 ,  H01L2224/81805 ,  H01L2224/81825 ,  H01L2224/8183 ,  H01L2224/82005 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/82106 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83424 ,  H01L2224/83438 ,  H01L2224/83444 ,  H01L2224/83466 ,  H01L2224/83486 ,  H01L2224/8349 ,  H01L2224/83805 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15156 ,  H01L2924/18161 ,  H01L2924/18162 ,  H05K1/189 ,  H05K3/4682 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01074 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0781 ,  H01L2924/01038 ,  H01L2924/053 ,  H01L2924/06 ,  H01L2924/01006 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01042 ,  H01L2924/01022 ,  H01L2924/01071 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2224/83

Abstract: A flexible display panel and method of formation with a sacrificial release layer are described. The method of manufacturing a flexible display system includes forming a sacrificial layer on a carrier substrate. A flexible display substrate is formed on the sacrificial layer, with a plurality of release openings that extend through the flexible display substrate to the sacrificial layer. An array of LEDs and a plurality of microchips are transferred onto the flexible display substrate to form a flexible display panel. The sacrificial layer is selectively removed such that the flexible display panel attaches to the carrier substrate by a plurality of support posts. The flexible display panel is removed from the carrier substrate and is electrically coupled with display components to form a flexible display system.

Abstract translation: 描述了柔性显示面板及其形成方法。 柔性显示系统的制造方法包括在载体基板上形成牺牲层。 在牺牲层上形成柔性显示基板，其中多个释放开口延伸穿过柔性显示基板至牺牲层。 将LED阵列和多个微芯片转移到柔性显示基板上以形成柔性显示面板。 选择性地去除牺牲层，使得柔性显示面板通过多个支撑柱附接到载体基板。 柔性显示面板从载体基板移除并与显示部件电耦合以形成柔性显示系统。

公开(公告)号：US09159700B2

公开(公告)日：2015-10-13

申请号：US13842721

申请日：2013-03-15

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L23/00 ,  H01L27/12

CPC classification number: H01L25/167 ,  H01L24/24 ,  H01L24/29 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L24/95 ,  H01L27/1214 ,  H01L33/06 ,  H01L33/38 ,  H01L33/42 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/73267 ,  H01L2224/75281 ,  H01L2224/75282 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83193 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/92244 ,  H01L2924/01322 ,  H01L2924/10156 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area.

Abstract translation: 描述显示面板和形成显示面板的方法。 显示面板可以包括包括像素区域和非像素区域的薄膜晶体管基板。 像素区域包括堤开口的阵列和堤开口阵列内的一组底部电极。 一组微型LED器件结合到阵列阵列内的相应阵列的底部电极。 形成将微型LED器件的阵列电连接到非像素区域中的接地线的顶部电极层的阵列。

公开(公告)号：US20150273700A1

公开(公告)日：2015-10-01

申请号：US14723231

申请日：2015-05-27

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu

IPC: B25J15/00

CPC classification number: B41J2/385 ,  B25J15/0052 ,  B25J15/0085 ,  B41J2/39 ,  B81B2201/038 ,  B81C99/002 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0079 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

Abstract translation: 公开了一种兼容的微器件传送头和头阵列。 在一个实施例中，微装置转移头包括可偏转到基底基板和弹簧部分之间的空间中的弹簧部分。

公开(公告)号：US20150216042A1

公开(公告)日：2015-07-30

申请号：US14681707

申请日：2015-04-08

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H01L21/683 ,  H05K1/11

CPC classification number: H01L21/6833 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L2221/68368 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/03 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/09036

Abstract: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.

Abstract translation: 描述了从SOI衬底形成微器件传输阵列的微器件转移头阵列和方法。 在一个实施例中，微器件传送头阵列包括基底衬底和基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括突出在硅互连上方的台面结构。 介电层覆盖每个台面结构的顶面。