公开(公告)号：US20070145550A1

公开(公告)日：2007-06-28

申请号：US11318846

申请日：2005-12-27

申请人： Belgacem Haba ,  IIyas Mohammed ,  Craig Mitchell ,  Michael Warner ,  Jesse Thompson

发明人： Belgacem Haba ,  IIyas Mohammed ,  Craig Mitchell ,  Michael Warner ,  Jesse Thompson

IPC分类号： H01L23/02

CPC分类号： H01L21/6835 ,  H01L22/34 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/1601 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05099

摘要： A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps and terminals may be formed on the bumps. The bumps may be of a precise height. The terminals lie at a precisely controlled height above the front surface of the wafer element. The terminals may include projecting posts which extend above a surrounding solder mask layer to facilitate engagement with a test fixture. The posts are immersed within solder joints when the structure is bonded to a circuit panel.

摘要翻译： 通过模制工艺形成电介质结构，使得电介质结构的第一表面通过与模具接触而成形。 电介质结构的相对的第二表面被施加到晶片元件的前表面上。 电介质层可以包括突出的凸起，并且可以在凸块上形成端子。 凸块可能具有精确的高度。 端子位于晶片元件的前表面上方的精确控制的高度。 端子可以包括在周围的焊接掩模层之上延伸的突出柱，以便于与测试夹具的接合。 当结构结合到电路板上时，将柱浸入焊点中。

公开(公告)号：US20050279916A1

公开(公告)日：2005-12-22

申请号：US11120711

申请日：2005-05-03

申请人： Teck-Gyu Kang ,  Michael Estrella ,  Jae Park ,  Kenneth Thompson ,  Craig Mitchell ,  Belgacem Haba

发明人： Teck-Gyu Kang ,  Michael Estrella ,  Jae Park ,  Kenneth Thompson ,  Craig Mitchell ,  Belgacem Haba

IPC分类号： H01L27/00 ,  H01L27/146 ,  H01L31/0203 ,  H04N5/225

CPC分类号： H01L27/14618 ,  H01L31/0203 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H04M2250/52 ,  H04N5/2253 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2924/00

摘要： An image sensor package is disclosed that reduces the overall size of known image sensor packages. The image sensor package includes an image sensor and image sensor controller that are arranged on a substrate so that the surfaces of the image sensor and image sensor controller are directly adjacent one another. A package in accordance with the present invention reduces the amount of space in the package by allowing at least one surface of the image sensor controller and at least one surface of the image sensor to be directly attached or connected to one another. Electrical conductive material in the nature of anisotropic conductive materials is also preferably applied to the substrate in the form of an adhesive layer to allow for the image sensor controller and the image sensor to be in electrical communication with one another.

摘要翻译： 公开了一种降低已知图像传感器封装的总体尺寸的图像传感器封装。 图像传感器封装包括图像传感器和图像传感器控制器，其布置在基板上，使得图像传感器和图像传感器控制器的表面彼此直接相邻。 根据本发明的包装通过允许图像传感器控制器的至少一个表面和图像传感器的至少一个表面直接附接或彼此连接来减少包装中的空间量。 各向异性导电材料性质的导电材料也优选以粘合剂层的形式施加到基底上，以允许图像传感器控制器和图像传感器彼此电连通。

公开(公告)号：US08736066B2

公开(公告)日：2014-05-27

申请号：US13051424

申请日：2011-03-18

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/481 ,  H01L21/76802 ,  H01L21/76805 ,  H01L21/76877 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/145 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/83 ,  H01L2224/9202 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/05552 ,  H01L2924/00

摘要： A microelectronic assembly is provided which includes a first element consisting essentially of at least one of semiconductor or inorganic dielectric material having a surface facing and attached to a major surface of a microelectronic element at which a plurality of conductive pads are exposed, the microelectronic element having active semiconductor devices therein. A first opening extends from an exposed surface of the first element towards the surface attached to the microelectronic element, and a second opening extends from the first opening to a first one of the conductive pads, wherein where the first and second openings meet, interior surfaces of the first and second openings extend at different angles relative to the major surface of the microelectronic element. A conductive element extends within the first and second openings and contacts the at least one conductive pad.

摘要翻译： 提供了一种微电子组件，其包括基本上由半导体或无机电介质材料中的至少一种构成的第一元件，该介电材料具有面向并附着到微电子元件的主表面的表面，在该电子元件的主表面处暴露多个导电焊盘，该微电子元件具有 其中有源半导体器件。 第一开口从第一元件的暴露表面延伸到附接到微电子元件的表面，并且第二开口从第一开口延伸到第一导电焊盘中，其中第一和第二开口相交，其中内表面 第一和第二开口相对于微电子元件的主表面以不同的角度延伸。 导电元件在第一和第二开口内延伸并接触至少一个导电垫。

公开(公告)号：US08685793B2

公开(公告)日：2014-04-01

申请号：US12883421

申请日：2010-09-16

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L23/522

CPC分类号： H01L24/80 ,  H01L21/6835 ,  H01L21/76805 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5384 ,  H01L24/02 ,  H01L24/24 ,  H01L24/25 ,  H01L24/27 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68372 ,  H01L2224/0231 ,  H01L2224/0235 ,  H01L2224/02371 ,  H01L2224/2401 ,  H01L2224/2405 ,  H01L2224/24146 ,  H01L2224/244 ,  H01L2224/2512 ,  H01L2224/32225 ,  H01L2224/82005 ,  H01L2224/821 ,  H01L2224/82106 ,  H01L2224/83005 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/92244 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2225/06544 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2224/27 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： An assembly and method of making same are provided. The assembly can be formed by juxtaposing a first electrically conductive element overlying a major surface of a first semiconductor element with an electrically conductive pad exposed at a front surface of a second semiconductor element. An opening can be formed extending through the conductive pad of the second semiconductor element and exposing a surface of the first conductive element. The opening may alternatively be formed extending through the first conductive element. A second electrically conductive element can be formed extending at least within the opening and electrically contacting the conductive pad and the first conductive element. A third semiconductor element can be positioned in a similar manner with respect to the second semiconductor element.

公开(公告)号：US08610264B2

公开(公告)日：2013-12-17

申请号：US12962806

申请日：2010-12-08

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L21/76898 ,  H01L23/3171 ,  H01L23/481 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/80 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02123 ,  H01L2224/0215 ,  H01L2224/0311 ,  H01L2224/0332 ,  H01L2224/03466 ,  H01L2224/03602 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05013 ,  H01L2224/05014 ,  H01L2224/05015 ,  H01L2224/05022 ,  H01L2224/05073 ,  H01L2224/05186 ,  H01L2224/05191 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05564 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05578 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/06181 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15165 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81805 ,  H01L2924/06

摘要： A microelectronic assembly includes a substrate and an electrically conductive element. The substrate can have a CTE less than 10 ppm/° C., a major surface having a recess not extending through the substrate, and a material having a modulus of elasticity less than 10 GPa disposed within the recess. The electrically conductive element can include a joining portion overlying the recess and extending from an anchor portion supported by the substrate. The joining portion can be at least partially exposed at the major surface for connection to a component external to the microelectronic unit.

公开(公告)号：US08609540B2

公开(公告)日：2013-12-17

申请号：US13164448

申请日：2011-06-20

申请人： Cyprian Uzoh ,  Belgacem Haba ,  Craig Mitchell

发明人： Cyprian Uzoh ,  Belgacem Haba ,  Craig Mitchell

IPC分类号： H01L21/32

CPC分类号： H01L23/528 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/76802 ,  H01L21/76804 ,  H01L21/76807 ,  H01L21/76831 ,  H01L21/76834 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76852 ,  H01L21/76868 ,  H01L21/76873 ,  H01L21/76879 ,  H01L21/76883 ,  H01L21/76885 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5226 ,  H01L23/53209 ,  H01L23/53238 ,  H01L24/13 ,  H01L24/14 ,  H01L2221/1094 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/14181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/05552

摘要： Methods and apparatus for forming a semiconductor device are provided which may include any number of features. One feature is a method of forming an interconnect structure that results in the interconnect structure having a top surface and portions of the side walls of the interconnect structure covered in a dissimilar material. In some embodiments, the dissimilar material can be a conductive material or a nano-alloy. The interconnect structure can be formed by removing a portion of the interconnect structure, and covering the interconnect structure with the dissimilar material. The interconnect structure can comprise a damascene structure, such as a single or dual damascene structure, or alternatively, can comprise a silicon-through via (TSV) structure.

摘要翻译： 提供了用于形成半导体器件的方法和装置，其可以包括任何数量的特征。 一个特征是形成互连结构的方法，其导致互连结构具有覆盖在不同材料中的互连结构的顶表面和侧壁的部分。 在一些实施例中，异种材料可以是导电材料或纳米合金。 互连结构可以通过去除互连结构的一部分并且用不同材料覆盖互连结构来形成。 互连结构可以包括镶嵌结构，例如单镶嵌结构或双镶嵌结构，或者可以包括硅通孔（TSV）结构。

公开(公告)号：US20120199926A1

公开(公告)日：2012-08-09

申请号：US13114243

申请日：2011-05-24

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L31/0232 ,  H01L31/18 ,  H01L27/146

CPC分类号： H01L27/14625 ,  H01L27/1461 ,  H01L27/14629 ,  H01L27/14632 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14687

摘要： A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face such that the first and second light sensing elements receive light of substantially the same intensity. A dielectric region is provided at least substantially filling a space of the semiconductor region adjacent at least one of the light sensing elements. The dielectric region may include at least one light guide.

摘要翻译： 提供了一种用于背面照明的微电子图像传感器组件及其制造方法。 该组件包括具有在正面暴露的触点的微电子元件和被布置成通过后表面接收不同波长的光的光感测元件。 半导体区域在第一光感测元件和后表面之间具有第一厚度，并且在第二光感测元件和后表面之间具有第二厚度，使得第一和第二光感测元件接收基本上相同强度的光。 提供至少基本上填充与至少一个光感测元件相邻的半导体区域的空间的电介质区域。 电介质区域可以包括至少一个光导。

公开(公告)号：US20120199925A1

公开(公告)日：2012-08-09

申请号：US13111258

申请日：2011-05-19

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14609 ,  H01L27/1461 ,  H01L27/14621 ,  H01L27/1464 ,  H01L27/14645

摘要： A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has an opening overlying at least one of first and second light sensing elements, the semiconductor region having a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face. A light-absorbing material overlies the semiconductor region within the opening above at least one of the light sensing elements such that the first and second light sensing elements receive light of substantially the same intensity.

摘要翻译： 提供了一种用于背面照明的微电子图像传感器组件及其制造方法。 该组件包括具有在正面暴露的触点的微电子元件和被布置成通过后表面接收不同波长的光的光感测元件。 半导体区域具有覆盖第一和第二光感测元件中的至少一个的开口，该半导体区域在第一光感测元件和后表面之间具有第一厚度，在第二光感测元件与后表面之间具有第二厚度。 光吸收材料覆盖至少一个感光元件之内的开口内的半导体区域，使得第一和第二光感测元件接收基本上相同强度的光。

公开(公告)号：US20120146210A1

公开(公告)日：2012-06-14

申请号：US12962806

申请日：2010-12-08

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L25/065 ,  H01L21/98 ,  H01L21/60 ,  H01L27/06

CPC分类号： H01L21/76898 ,  H01L23/3171 ,  H01L23/481 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/80 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02123 ,  H01L2224/0215 ,  H01L2224/0311 ,  H01L2224/0332 ,  H01L2224/03466 ,  H01L2224/03602 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05013 ,  H01L2224/05014 ,  H01L2224/05015 ,  H01L2224/05022 ,  H01L2224/05073 ,  H01L2224/05186 ,  H01L2224/05191 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05564 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05578 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/06181 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15165 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81805 ,  H01L2924/06

摘要： A microelectronic assembly includes a substrate and an electrically conductive element. The substrate can have a CTE less than 10 ppm/° C., a major surface having a recess not extending through the substrate, and a material having a modulus of elasticity less than 10 GPa disposed within the recess. The electrically conductive element can include a joining portion overlying the recess and extending from an anchor portion supported by the substrate. The joining portion can be at least partially exposed at the major surface for connection to a component external to the microelectronic unit.

摘要翻译： 微电子组件包括衬底和导电元件。 衬底可以具有小于10ppm /℃的CTE，具有不延伸穿过衬底的凹部的主表面和设置在凹部内的弹性模量小于10GPa的材料。 导电元件可以包括覆盖凹部并从由衬底支撑的锚定部分延伸的接合部分。 连接部分可以在主表面处至少部分地暴露以连接到微电子单元外部的部件。

公开(公告)号：US20120139094A1

公开(公告)日：2012-06-07

申请号：US12958866

申请日：2010-12-02

申请人： Belgacem Haba ,  Vage Oganesian ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Belgacem Haba ,  Vage Oganesian ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L29/41 ,  H01L21/44

CPC分类号： H01L25/0657 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/36 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/15311

摘要： A microelectronic assembly can include first and second microelectronic elements each embodying active semiconductor devices adjacent a front surface thereof, and having an electrically conductive pad exposed at the respective front surface. An interposer of material having a CTE less than 10 ppm/° C. has first and second surfaces attached to the front surfaces of the respective first and second microelectronic elements, the interposer having a second conductive element extending within an opening in the interposer. First and second conductive elements extend within openings extending from the rear surface of a respective microelectronic element of the first and second microelectronic elements towards the front surface of the respective microelectronic element. In one example, one or more of the first or second conductive elements extends through the respective first or second pad, and the conductive elements contact the exposed portions of the second conductive element to provide electrical connection therewith.

摘要翻译： 微电子组件可以包括第一和第二微电子元件，每个微电子元件各自体现邻近其前表面的有源半导体器件，并且具有在相应的前表面处暴露的导电焊盘。 具有小于10ppm /℃的CTE的材料的插入件具有附接到相应的第一和第二微电子元件的前表面的第一和第二表面，所述插入件具有在插入器的开口内延伸的第二导电元件。 第一和第二导电元件在从第一和第二微电子元件的相应微电子元件的后表面朝向相应微电子元件的前表面延伸的开口内延伸。 在一个示例中，第一或第二导电元件中的一个或多个延伸穿过相应的第一或第二焊盘，并且导电元件接触第二导电元件的暴露部分以提供与其的电连接。