MULTISTEP DEPOSITION OF ZINC OXIDE ON GALLIUM NITRIDE
    114.
    发明申请
    MULTISTEP DEPOSITION OF ZINC OXIDE ON GALLIUM NITRIDE 有权
    氧化锌在氮化镓上的多金属沉积

    公开(公告)号:US20170077356A1

    公开(公告)日:2017-03-16

    申请号:US15266990

    申请日:2016-09-15

    CPC classification number: H01L33/42 H01L31/022483 H01L33/32 H01L2933/0016

    Abstract: A method for fabricating a Zinc Oxide (ZnO) conductive film on a semiconductor material, including depositing a doped ZnO seed layer on a diode, wherein the ZnO seed layer forms an electrical contact to the diode; and depositing a ZnO layer on the ZnO seed layer, wherein the ZnO seed layer and the ZnO layer each have a thickness, a crystal quality, and a doping level such that (1) the diode comprising III-nitride material is turned on with a turn on voltage of 2.75 volts or less applied across the ZnO layers and the diode, and (2) a contact resistance, of a structure comprising the ZnO layers and the diode, is lower as compared to a contact resistance of a structure comprising the ZnO layer directly on the diode without the ZnO seed layer.

    Abstract translation: 一种在半导体材料上制造氧化锌(ZnO)导电膜的方法,包括在二极管上沉积掺杂的ZnO种子层,其中ZnO籽晶层与二极管形成电接触; 以及在所述ZnO籽晶层上沉积ZnO层,其中所述ZnO籽晶层和所述ZnO层各自具有厚度,晶体质量和掺杂水平,使得(1)包含III族氮化物材料的二极管被接通, 在ZnO层和二极管两端施加2.75伏或更小的导通电压,以及(2)包含ZnO层和二极管的结构的接触电阻与包含ZnO的结构的接触电阻相比较低 层直接在二氧化硅上没有ZnO种子层。

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