公开(公告)号：US09324677B2

公开(公告)日：2016-04-26

申请号：US14009993

申请日：2012-04-02

申请人： Akihiro Kimura ,  Takeshi Sunaga

发明人： Akihiro Kimura ,  Takeshi Sunaga

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L21/56 ,  H01L23/495 ,  H01L25/065 ,  H01L23/31

CPC分类号： H01L24/81 ,  H01L21/52 ,  H01L21/56 ,  H01L21/568 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/71 ,  H01L24/90 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/11005 ,  H01L2224/1146 ,  H01L2224/16104 ,  H01L2224/16221 ,  H01L2224/16225 ,  H01L2224/16501 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.

摘要翻译： 半导体器件设置有具有多个电极的半导体元件，与多个电极电连接的多个端子和覆盖该半导体元件的密封树脂。 密封树脂覆盖多个端子，使得半导体元件的厚度方向的底面露出。 作为多个端子之一的第一端子被设置在与从厚度方向观察时与多个电极中的一个电极重叠的位置。 半导体器件设置有与第一端子和第一电极接触的导电连接构件。

公开(公告)号：US09095477B2

公开(公告)日：2015-08-04

申请号：US13819724

申请日：2011-06-21

申请人： Masashi Yamaguchi ,  Toru Oba ,  Akihiro Kimura ,  Katsuhiro Uematsu

发明人： Masashi Yamaguchi ,  Toru Oba ,  Akihiro Kimura ,  Katsuhiro Uematsu

IPC分类号： A61F13/15 ,  A61F13/511 ,  A61F13/512 ,  B32B3/30 ,  B32B3/26 ,  B32B3/28 ,  D04H1/54 ,  D04H1/70 ,  D04H1/425 ,  D04H1/4258 ,  D04H1/4266 ,  D04H1/541 ,  D01G15/00 ,  D04H1/49 ,  A61F13/51

CPC分类号： A61F13/51108 ,  A61F13/51104 ,  A61F13/512 ,  A61F13/5121 ,  A61F13/5126 ,  A61F2013/51078 ,  B32B3/263 ,  B32B3/266 ,  B32B3/28 ,  B32B3/30 ,  D01G15/00 ,  D04H1/425 ,  D04H1/4258 ,  D04H1/4266 ,  D04H1/49 ,  D04H1/495 ,  D04H1/54 ,  D04H1/541 ,  D04H1/70

摘要： A nonwoven sheet for use in absorbent articles such as disposable diapers which is capable of reducing the range of surface diffusion of, and reducing re-adhesion to the skin of, highly viscous fluid excretion. The nonwoven sheet has mutually perpendicular longitudinal, transverse and thickness directions, and has in the aforementioned thickness direction a front surface and a back surface opposite thereof. Ridges and grooves are formed alternately so as to extend in parallel in the aforementioned longitudinal direction and so as to form repeated undulations in the aforementioned transverse direction. The nonwoven sheet has a bottom surface which, when the aforementioned nonwoven sheet is placed on a horizontal surface with the back surface (opposite of the front surface in contact with the skin of the wearer) down, is the surface that contacts the aforementioned horizontal surface. On the back surface of the aforementioned grooves are formed in the aforementioned longitudinal direction alternately areas where the height from the bottom surface is relatively high and parts corresponding to the bottom surface. Openings are formed at least in the areas where the height from the bottom surface is relatively high, and a space is provided below said openings.

摘要翻译： 一种用于吸收制品如一次性尿布的非织造片材，其能够减少高度粘性的流体排泄物的表面扩散范围，并减少对皮肤的再附着。 非织造片材具有相互垂直的纵向，横向和厚度方向，并且在上述厚度方向上具有与其相对的前表面和后表面。 交替地形成脊和槽，以在上述纵向方向上平行延伸，并在上述横向上形成重复的起伏。 非织造片材具有底面，当将上述非织造片材放置在水平表面上时，其表面（与穿着者的皮肤接触的前表面相对）向下）是与上述水平表面接触的表面 。 在上述槽的背面上，在上述纵向方向交替地形成有从底面的高度相对较高的部位和与底面对应的部分。 至少在从底面的高度相对较高的区域形成开口，并且在所述开口下方设置空间。

公开(公告)号：US09093434B2

公开(公告)日：2015-07-28

申请号：US14110131

申请日：2012-04-03

申请人： Akihiro Kimura ,  Takeshi Sunaga ,  Shouji Yasunaga ,  Akihiro Koga

发明人： Akihiro Kimura ,  Takeshi Sunaga ,  Shouji Yasunaga ,  Akihiro Koga

IPC分类号： H01L21/48 ,  H01L23/495 ,  H01L23/31 ,  H01L23/433 ,  H01L21/56 ,  H01L23/36 ,  H01L23/00

CPC分类号： H01L23/49568 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/4882 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/49175 ,  H01L2224/49177 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.

摘要翻译： 一种方法包括以下步骤：制备包括多个管芯焊盘的引线框架，并制备多个半导体芯片; 将每个所述半导体芯片设置在所述芯片焊盘的相应一个上; 形成密封树脂以覆盖芯片焊盘和半导体芯片; 以及通过在形成密封树脂之后通过作为粘合剂层的树脂片将散热板压靠在冲模焊盘上而将散热板附接到模具衬垫。

公开(公告)号：US08892280B2

公开(公告)日：2014-11-18

申请号：US13320439

申请日：2010-05-11

申请人： Gohki Kinoshita ,  Koichiro Muta ,  Toshiya Hashimoto ,  Eiji Fukushiro ,  Takanori Aoki ,  Akihiro Kimura ,  Shunsuke Oyama ,  Masaya Yamamoto ,  Kaiji Itabashi ,  Yoshitaka Oikawa ,  Takashi Saito

发明人： Gohki Kinoshita ,  Koichiro Muta ,  Toshiya Hashimoto ,  Eiji Fukushiro ,  Takanori Aoki ,  Akihiro Kimura ,  Shunsuke Oyama ,  Masaya Yamamoto ,  Kaiji Itabashi ,  Yoshitaka Oikawa ,  Takashi Saito

IPC分类号： B60W30/20 ,  B60W20/00 ,  B60G17/016 ,  B60W10/08 ,  B60G17/0195 ,  B60W10/06 ,  B60K6/365 ,  B60K6/445 ,  B60K1/02

CPC分类号： B60W20/15 ,  B60G17/0164 ,  B60G17/0195 ,  B60G2300/50 ,  B60G2400/204 ,  B60G2400/208 ,  B60G2400/302 ,  B60G2400/32 ,  B60G2400/34 ,  B60G2500/10 ,  B60G2600/09 ,  B60G2600/11 ,  B60G2600/187 ,  B60G2800/014 ,  B60G2800/162 ,  B60G2800/213 ,  B60G2800/215 ,  B60G2800/85 ,  B60G2800/916 ,  B60G2800/922 ,  B60G2800/952 ,  B60K1/02 ,  B60K6/365 ,  B60K6/445 ,  B60L2240/423 ,  B60W10/06 ,  B60W10/08 ,  B60W20/00 ,  B60W2510/244 ,  B60W2710/0666 ,  B60W2710/083 ,  Y02T10/56 ,  Y02T10/6239 ,  Y02T10/6286 ,  Y02T10/642 ,  Y02T10/7258

摘要： A sprung mass damping control system of a vehicle, which aims to suppress sprung mass vibration generated in a vehicle body of a vehicle provided with at least a motor-generator (first and second motor-generators) as a drive source, includes a sprung mass damping control amount calculating device that sets a sprung mass damping control amount for suppressing the sprung mass vibration, and a drive source control device (a motor-generator control device) that executes sprung mass damping control by controlling a motor-generator control amount of the motor-generator to realize the sprung mass damping control amount.

摘要翻译： 一种车辆的弹簧质量阻尼控制系统，其目的在于抑制设置有至少具有作为驱动源的电动发电机（第一和第二电动发电机）的车辆的车体产生的弹簧振动振动，包括弹簧质量 设置用于抑制簧上质量振动的弹簧质量阻尼控制量的减振控制量计算装置，以及通过控制电动发电机控制量来执行弹簧质量阻尼控制的驱动源控制装置（电动发电机控制装置） 电动发电机实现弹簧质量阻尼控制量。

公开(公告)号：US20140174339A1

公开(公告)日：2014-06-26

申请号：US14236977

申请日：2012-08-02

申请人： Akihiro Kimura ,  Kiyotaka Takano ,  Junya Tokue

发明人： Akihiro Kimura ,  Kiyotaka Takano ,  Junya Tokue

IPC分类号： C30B15/22

CPC分类号： C30B15/22 ,  C30B15/00 ,  C30B15/10 ,  C30B29/06

摘要： There is provided a method for manufacturing a silicon single crystal, the method includes: a raw material melting step of melting polycrystalline silicon accommodated in a crucible to obtain a silicon melt; and bringing a seed crystal into contact with the silicon melt and pulling up the seed crystal to grow the silicon single crystal, wherein, after the raw material melting step and before the pulling step, there are performed: a cristobalitizing step of leaving the silicon melt at a predetermined number of rotations of the crucible with a predetermined gas flow rate and a predetermined furnace pressure to generate cristobalite while applying a magnetic field; and a dissolving step of partially dissolving the cristobalite by carrying out any one of an increase in number of rotations of the crucible, an increase in gas flow rate, and a reduction in furnace pressure beyond counterpart figures in the cristobalitizing step.

摘要翻译： 提供一种制造单晶硅的方法，该方法包括：将容纳在坩埚中的多晶硅熔化以获得硅熔体的原料熔化步骤; 并使晶种与硅熔体接触并拉出晶种以生长硅单晶，其中在原料熔化步骤之后和拉制步骤之前，进行：将硅熔体离开的方圆化步骤 以规定的气体流量和规定的炉压进行坩埚的预定转数，以施加磁场而产生方英石; 以及通过进行坩埚转数增加，气体流量增加和炉压力下降中的任何一个部分溶解方英石的溶解步骤，超过了对立图中的曲线图。

公开(公告)号：US08722173B2

公开(公告)日：2014-05-13

申请号：US13266923

申请日：2010-04-26

申请人： Toru Oba ,  Satoshi Mizutani ,  Akihiro Kimura

发明人： Toru Oba ,  Satoshi Mizutani ,  Akihiro Kimura

IPC分类号： B32B3/30 ,  B32B5/14 ,  A61F13/15 ,  D04H3/00 ,  D04H13/00 ,  B27N3/12 ,  B31F1/07

CPC分类号： D04H1/541 ,  A61F13/51108 ,  A61F13/51121 ,  D04H1/76 ,  Y10T156/1023 ,  Y10T428/2457 ,  Y10T428/24603 ,  Y10T428/24942 ,  Y10T442/608

摘要： A liquid-pervious fibrous non-woven fabric includes staple fibers made of thermoplastic synthetic resin fused together which is formed on its upper surface with a plurality of ridges, and a plurality of grooves extending in parallel in a longitudinal direction. The ridges and grooves are arranged alternately in a transverse direction. On the upper surface, some of the staple fibers extend across the ridges to the adjacent grooves on each side of the ridges and are, in the respective grooves, fused to the staple fibers of a different type from the former staple fibers.

摘要翻译： 透液性纤维无纺布包括由热塑性合成树脂制成的短纤维，所述短纤维由其上表面上形成有多个脊部而形成，并且在长度方向上平行延伸的多个凹槽。 脊和槽在横向上交替布置。 在上表面上，一些短纤维延伸穿过脊部到脊的每一侧上的相邻凹槽，并且在相应的凹槽中，与与前述短纤维不同类型的短纤维熔合。

公开(公告)号：US08523263B2

公开(公告)日：2013-09-03

申请号：US13000441

申请日：2009-06-05

申请人： Akihiro Kimura ,  Hirohito Aoi ,  Toshiharu Ito

发明人： Akihiro Kimura ,  Hirohito Aoi ,  Toshiharu Ito

IPC分类号： F16M11/00

CPC分类号： B60N2/067 ,  B60N2/0705

摘要： In a power slide device for vehicle seat which moves an upper rail in the forward/rearward direction by rotationally driving a screw rod, by providing a screw rod supporting rail with a pair of load transmitting members that are spaced from each other in the forward/rearward direction and providing the screw rod with a load receiving member which is in contact with the pair of load transmitting members, bucking is supported at a plurality of points when the buckling occurs in the screw rod due to an axial force acting on the screw rod, and this limits the direction of the buckling to reduce the amount of the buckling.

摘要翻译： 在用于通过旋转驱动螺杆使上轨道向前/向后方向移动的车辆座椅的动力滑动装置中，通过提供具有一对负载传递构件的螺杆支撑轨道，所述一对负载传递构件彼此间隔开， 向后方向提供螺杆，其具有与所述一对负载传递部件接触的负载接收部件，当由于作用在所述螺杆上的轴向力而在所述螺杆中发生弯曲时，所述弯曲部被支撑在多个点处 ，这限制了屈曲的方向以减少屈曲的量。

公开(公告)号：US20130101450A1

公开(公告)日：2013-04-25

申请号：US13477772

申请日：2012-05-22

申请人： Akihiro Kimura ,  Teiichi Hirono ,  Ryota Ogino ,  Kyoko Horise ,  Hiroyoshi Teshima ,  Masashi Hirayama

发明人： Akihiro Kimura ,  Teiichi Hirono ,  Ryota Ogino ,  Kyoko Horise ,  Hiroyoshi Teshima ,  Masashi Hirayama

IPC分类号： F04D25/06 ,  H02K7/08

CPC分类号： F04D25/0626 ,  F04D25/062 ,  F04D29/051 ,  F04D29/0513 ,  F16C17/107 ,  F16C33/745 ,  H02K5/1675 ,  H02K7/085

摘要： A first seal portion having a surface of a lubricating oil defined therein is defined between a sleeve portion and a bearing housing. A side communicating channel arranged to bring a first seal gap and a thrust gap into communication with each other is defined either between a sleeve portion and a bearing housing or in an outer circumferential portion of a sleeve portion. A second seal portion having another surface of a lubricating oil defined therein is defined in a gap constituted by a side minute gap between a thrust plate and a bearing housing and a lower minute gap between a thrust plate and a cap member.

摘要翻译： 限定在其中的具有润滑油的表面的第一密封部分限定在套筒部分和轴承壳体之间。 布置成使第一密封间隙和推力间隙彼此连通的侧面连通通道被限定在套筒部分和轴承壳体之间或套筒部分的外圆周部分中。 限定在其中的具有润滑油的另一表面的第二密封部分被限定在由推力板和轴承壳体之间的侧面微小间隙和推力板和盖构件之间的较小微小间隙构成的间隙中。

公开(公告)号：US20120286412A1

公开(公告)日：2012-11-15

申请号：US13522853

申请日：2011-01-17

申请人： Akihiro Kimura ,  Tsunemori Yamaguchi

发明人： Akihiro Kimura ,  Tsunemori Yamaguchi

IPC分类号： H01L23/495 ,  H01L21/78

CPC分类号： H01L23/49513 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/17738 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512

摘要： A semiconductor device 100 includes a first insulating material 110 attached to a second main surface 106b of a semiconductor chip 106, and a second insulating material 112 attached to side surfaces of the semiconductor chip 106, the first insulating material 110 and an island 102. The semiconductor chip 106 is fixed to the island 102 via the first insulating material 110 and the second insulating material 112. The first insulating material 110 ensures a high dielectric strength between the semiconductor chip 106 and the island 102. Though the second insulating material 112 having a modulus of elasticity greater than that of the first insulating material 110, the semiconductor chip 106 is firmly attached to the island 102.

摘要翻译： 半导体器件100包括附接到半导体芯片106的第二主表面106b的第一绝缘材料110和附接到半导体芯片106，第一绝缘材料110和岛102的侧表面的第二绝缘材料112。 半导体芯片106经由第一绝缘材料110和第二绝缘材料112固定到岛102.第一绝缘材料110确保半导体芯片106和岛102之间的高介电强度。虽然第二绝缘材料112具有 弹性模量大于第一绝缘材料110的弹性模量，半导体芯片106牢固地附接到岛102。

公开(公告)号：US08277125B2

公开(公告)日：2012-10-02

申请号：US12791147

申请日：2010-06-01

申请人： Akihiro Kimura ,  Teiichi Hirono ,  Kunio Sakurada ,  Kyoko Horise

发明人： Akihiro Kimura ,  Teiichi Hirono ,  Kunio Sakurada ,  Kyoko Horise

IPC分类号： F16C32/06

CPC分类号： F16C32/0659 ,  F16C17/10 ,  F16C17/107 ,  F16C33/107 ,  F16C33/745 ,  F16C2370/12 ,  G11B19/2009 ,  G11B19/2036 ,  H02K5/1675 ,  H02K7/08 ,  H02K7/085

摘要： In a bearing apparatus, a first cup portion defining a portion of a stationary portion of a bearing apparatus includes a circular plate portion and a cylindrical portion projecting downward from an outer edge portion of the circular plate portion. A rotating portion of the bearing apparatus includes an annular recessed portion arranged to accommodate at least a lower end portion of the cylindrical portion. Accordingly, it is possible to limit the axial dimension of the bearing apparatus while also enabling both a radial dynamic pressure groove array and a pumping groove array to have a sufficient axial dimension. Additionally, one end of a through hole defined in the rotating portion is arranged to open into the annular recessed portion, so that any air bubbles introduced into a lubricating oil by the pumping groove array can be efficiently caused to flow downward through the through hole and out of the bearing apparatus.

摘要翻译： 在轴承装置中，限定轴承装置的固定部分的一部分的第一杯部包括圆板部和从圆板部的外缘部向下方突出的圆筒部。 轴承装置的旋转部分包括设置成容纳圆柱形部分的至少下端部的环形凹部。 因此，可以限制轴承装置的轴向尺寸，同时使径向动压槽阵列和泵送槽阵列能够具有足够的轴向尺寸。 此外，限定在旋转部分中的通孔的一端被布置成向环形凹部打开，从而可以有效地使通过泵浦槽阵列引入到润滑油中的任何气泡向下流过通孔， 离开轴承装置。