公开(公告)号：US09439298B2

公开(公告)日：2016-09-06

申请号：US14181412

申请日：2014-02-14

Applicant: LOTES CO., LTD

Inventor： Ted Ju

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H01R13/03 ,  H01R13/24 ,  H01L23/498 ,  H01L23/00

CPC classification number: H05K3/32 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/16235 ,  H01L2224/81101 ,  H01L2224/81405 ,  H01L2224/81411 ,  H01L2224/81494 ,  H01L2224/81505 ,  H01L2224/81594 ,  H01L2224/81691 ,  H01L2224/81711 ,  H01L2224/819 ,  H01R13/035 ,  H01R13/2414 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10962 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0715

Abstract: An electrical connector for electrically connecting a first electronic element to a second electronic element includes an insulating body and multiple conductors. The insulating body has multiple accommodating holes. Each conductor is accommodated in a corresponding accommodating hole. Each conductor has an elastic insulator and low melting point liquid metal wrapping a surface of the elastic insulator, such that a continuous conducting path is formed by the liquid metal between the first electronic element and the second electronic element.

Abstract translation: 用于将第一电子元件电连接到第二电子元件的电连接器包括绝缘体和多个导体。 绝缘体具有多个容纳孔。 每个导体容纳在相应的容纳孔中。 每个导体具有包裹弹性绝缘体的表面的弹性绝缘体和低熔点液体金属，使得在第一电子元件和第二电子元件之间由液态金属形成连续导电路径。

公开(公告)号：US08742260B2

公开(公告)日：2014-06-03

申请号：US12446337

申请日：2007-10-05

Applicant: Junya Sato

Inventor： Junya Sato

IPC: H05K1/00

CPC classification number: H05K3/368 ,  H01R12/52 ,  H01R12/613 ,  H01R13/2414 ,  H05K2201/0314 ,  H05K2201/09018 ,  H05K2201/10378 ,  H05K2201/2009

Abstract: Provided is a circuit board device in which printed wiring boards 11, 12 are connected to each other electrically using a anisotropic conductive member 15 disposed between the printed wiring boards 11, 12. The anisotropic conductive member 15 comprises: an insulating elastic resin material 16; fine metal wires 17 having a middle portion embedded within the insulating elastic resin material 16 so as to connect corresponding connecting terminals of the printed wiring boards 11, 12; and resin layers 18 exhibiting a flexural rigidity greater than that of the insulating elastic resin material. An assembly composed of the printed wiring boards 11, 12 and anisotropic conductive member 15 is curved. The resin layers are shape-retaining resins for maintaining the curvature of respective ones of principal surfaces of the anisotropic conductive member 15 made to conform to curvature of the printed wiring boards 11, 12.

Abstract translation: 提供了一种电路板装置，其中印刷线路板11,12使用布置在印刷线路板11,12之间的各向异性导电构件15彼此电连接。各向异性导电构件15包括：绝缘弹性树脂材料16; 精细金属线17，其具有嵌入在绝缘弹性树脂材料16内的中间部分，以连接印刷电路板11,12的相应的连接端子; 树脂层18的弯曲刚度大于绝缘弹性树脂材料的弯曲刚度。 由印刷电路板11,12和各向异性导电构件15组成的组件是弯曲的。 树脂层是形状保持树脂，用于保持使各向异性导电构件15的各个主表面的曲率相应于印刷线路板11,12的曲率。

公开(公告)号：US20140085837A1

公开(公告)日：2014-03-27

申请号：US13922493

申请日：2013-06-20

Applicant: SNU R&DB FOUNDATION

Inventor： Yongtaek Hong ,  Sangwoo Kim

IPC: H01B1/20 ,  H01B13/00 ,  H05K1/09

CPC classification number: H01B1/20 ,  H01B1/22 ,  H01B13/00 ,  H05K1/0283 ,  H05K1/09 ,  H05K1/092 ,  H05K1/189 ,  H05K2201/0314 ,  H05K2201/083 ,  H05K2203/104

Abstract: A flexible conduction trace includes a flexible line; and a plurality of conductive particles arranged in the form of pillars within the flexible line.

Abstract translation: 灵活的导电迹线包括柔性线; 以及在柔性线内以柱状的形式布置的多个导电颗粒。

公开(公告)号：US08623700B1

公开(公告)日：2014-01-07

申请号：US11599283

申请日：2006-11-15

Applicant: Gary H. Bernstein ,  Patrick Fay ,  Wolfgang Porod ,  Qing Liu

Inventor： Gary H. Bernstein ,  Patrick Fay ,  Wolfgang Porod ,  Qing Liu

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC classification number: H01L24/67 ,  H01L23/60 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/48 ,  H01L24/49 ,  H01L24/66 ,  H01L24/72 ,  H01L24/73 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/167 ,  H01L25/18 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/81141 ,  H01L2224/81224 ,  H01L2225/0651 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10156 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/181 ,  H05K1/182 ,  H05K3/326 ,  H05K3/328 ,  H05K2201/0314 ,  H05K2201/10454 ,  H05K2201/10909 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

Abstract translation: 本发明提供了一种用于微芯片的被套包装系统，这种被套包装系统的制造方法，可用于这种被套包装系统的微芯片，以及制造这种微芯片的方法。

公开(公告)号：US20130342998A1

公开(公告)日：2013-12-26

申请号：US13973766

申请日：2013-08-22

Applicant: Kong-Chen Chen

Inventor： Kong-Chen Chen

IPC: H05K3/30 ,  H05K1/16 ,  H05K7/20 ,  H05K1/02

CPC classification number: H05K3/303 ,  H01L21/67259 ,  H01L22/32 ,  H01L22/34 ,  H01L23/041 ,  H01L23/10 ,  H01L23/4093 ,  H01L23/481 ,  H01L23/544 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/72 ,  H01L25/0655 ,  H01L2223/54426 ,  H01L2223/5446 ,  H01L2223/54466 ,  H01L2223/54473 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/0268 ,  H05K1/0296 ,  H05K1/144 ,  H05K1/16 ,  H05K3/222 ,  H05K3/325 ,  H05K7/20436 ,  H05K2201/0314 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2203/167 ,  Y10T29/49004 ,  Y10T29/49133 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An electronic assembly including a substrate, an electronic component, a fixture, and a housing. The substrate includes a first contact array. The electronic component includes a second contact array. The fixture includes an opening adapted to position the electronic component on the substrate and to connect the second contact array to the first contact array when the fixture is aligned at a first position on the substrate. The housing is adapted to hold the substrate populated with the electronic component. The housing includes a first conductive pathway adapted to connect from an external surface at the housing to the substrate in a serial continuous conductive path when the fixture is aligned at the first position on the substrate. The electronic assembly includes a sensing device connected to the continuous conductive path to detect the integrity of the electronic assembly.

Abstract translation: 一种包括基板，电子部件，固定装置和壳体的电子组件。 衬底包括第一接触阵列。 电子部件包括第二接触阵列。 所述固定装置包括适于将所述电子部件定位在所述基板上并且当所述固定装置对准在所述基板上的第一位置时将所述第二接触阵列连接到所述第一接触阵列的开口。 壳体适于保持充满电子部件的基板。 壳体包括第一导电路径，当第一导电路径适于在该基座上的第一位置对齐时，将其连接在一个串联连续的导电路径中的外壳上的外表面。 电子组件包括连接到连续导电路径的感测装置，以检测电子组件的完整性。

公开(公告)号：US08557385B2

公开(公告)日：2013-10-15

申请号：US13728325

申请日：2012-12-27

Applicant: Ajit Khosla ,  Bonnie Lynne Gray

Inventor： Ajit Khosla ,  Bonnie Lynne Gray

IPC: H05K1/11 ,  B32B9/04 ,  B29C39/00 ,  B29C39/12 ,  H01B1/12 ,  H01B1/04

CPC classification number: H01B1/124 ,  B82Y40/00 ,  H01B1/24 ,  H05K1/0306 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/207 ,  H05K2201/0133 ,  H05K2201/0257 ,  H05K2201/0314 ,  H05K2201/0329 ,  H05K2203/0113 ,  Y10S977/752 ,  Y10S977/779 ,  Y10S977/81 ,  Y10T428/24942 ,  Y10T428/31504

Abstract: An electrically conductive, thermosetting elastomeric composition is provided. The composition may comprise: an initially substantially non-electrically conductive, thermosetting base polymer; a particulate filler comprising electrically conductive particles; and an electrically conductive polymer additive. The non-electrically conductive, thermosetting base polymer, the particulate filler and the electrically conductive polymer additive are mixed substantially macroscopically homogeneously.

公开(公告)号：US08525024B2

公开(公告)日：2013-09-03

申请号：US13063996

申请日：2009-09-30

Applicant: Hiroaki Kaneda ,  Takeshi Yamada

Inventor： Hiroaki Kaneda ,  Takeshi Yamada

IPC: H01J5/00 ,  H01J15/00 ,  H05K5/06 ,  H05K9/00 ,  H05K7/14 ,  H01L23/02

CPC classification number: F16J15/064 ,  H01R13/6599 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/0393 ,  H05K3/28 ,  H05K3/325 ,  H05K9/0018 ,  H05K2201/0314 ,  H05K2201/0715 ,  H05K2201/0989 ,  H05K2203/1147

Abstract: A hermetically sealing device includes a conductive seal member (2) which is integrated with a conductive member (1) extending into a casing (3) and seals a space between the conductive member (1) and an inserting section for the conductive member (1) on the casing (3). In the conductive member (1), an electromagnetic wave shield layer (11) is laminated on a cover film which protects the surface of a base film having a circuit pattern, an insulating layer (12) is laminated on the electromagnetic wave shield layer (11), the insulating layer (12) has an opening section (12a) such that a part of the flat section of the electromagnetic wave shield layer (11) is exposed, and the seal member (2) is integrated with the conductive member (1) to cover the opening section (12a) and is brought into contact with the electromagnetic wave shield layer (11) through the opening section (12a).

Abstract translation: 气密密封装置包括导电密封件（2），导电密封件（2）与延伸到壳体（3）中的导电件（1）成一体并密封导电件（1）与导电件（1）的插入部分之间的空间 ）在壳体（3）上。 在导电部件（1）中，在保护具有电路图案的基膜的表面的覆盖膜上层叠有电磁波屏蔽层（11），绝缘层（12）层叠在电磁波屏蔽层 如图11所示，绝缘层（12）具有使电磁波屏蔽层（11）的平坦部分的一部分露出的开口部（12a），密封部件（2）与导电部件 1）覆盖开口部分（12a）并通过开口部分（12a）与电磁波屏蔽层（11）接触。

公开(公告)号：US08499442B2

公开(公告)日：2013-08-06

申请号：US12584629

申请日：2009-09-08

Applicant: James J Levante ,  Dennis Johnson ,  Tom Sahakian

Inventor： James J Levante ,  Dennis Johnson ,  Tom Sahakian

IPC: H01R9/00

CPC classification number: H01R12/57 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/326 ,  H05K3/42 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09827 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit. This connector will mate between printed circuit boards, packaged electronic assembles, BGAs or LGA type products, harnesses or cables without the need of solder or pins and sockets. Eliminating solder or pins and sockets reduces the pitch between connections. Mechanical pins are plated drawn, formed or machined conductive metal alloys. Insulator is molded or machined out of engineered plastic examples being, but not limited to, FR-4, Ultem®, Polyimide, Torlon®. Electrically conductive elastromeric compounds made up of flexible silicone and rubbers with conductive compounds added.

Abstract translation: 用于产生弹性机械连接器（1）的导电弹性体和机械销和接触系统，其结合机械销，绝缘体阵列与导电弹性记忆材料。 这种组合提供了低成本，高密度，可靠，可重复使用的电子互连系统。 该系统可用于代替目前使用的大多数连接器系统。 它替代了使用引脚和插座的任何连接器，并且还支持半导体业务中所需的精细导体间距，如球栅阵列（BGA）插座和相关设计。 本发明的装置包括安装在绝缘体（3）中的机械销（2），每个机械销顶部带有导电弹性体化合物（4）。 对于每个连接点使用机械销，绝缘体将机械销定位成适合于互连要求的阵列图案。 向每个金属销添加导电弹性体化合物以产生与配合单元的Z轴电气共同性。 该连接器将在印刷电路板，封装的电子组件，BGA或LGA型产品，线束或电缆之间配合，而不需要焊料或针脚和插座。 消除焊料或引脚和插座可减少连接间距。 机械销是电镀拉制，成型或加工的导电金属合金。 绝缘体由工程塑料实例模制或加工而成，但不限于FR-4，Ultem®，Polyimide，Torlon®。 导电弹性体化合物由柔性硅胶和橡胶与导电化合物相加而成。

公开(公告)号：US20130058057A1

公开(公告)日：2013-03-07

申请号：US13596762

申请日：2012-08-28

Applicant: Shunjiro TAKEMORI ,  Shigeru NARAKINO

Inventor： Shunjiro TAKEMORI ,  Shigeru NARAKINO

IPC: H05K1/00

CPC classification number: H05K1/0275 ,  G06F21/86 ,  H05K1/0213 ,  H05K1/141 ,  H05K1/147 ,  H05K5/0208 ,  H05K2201/0314 ,  H05K2201/047 ,  H05K2201/056 ,  H05K2201/2018 ,  H05K2203/178

Abstract: The terminal unit includes a main board, electronic components implemented on the main board, a sub-board covering above the electronic components and a frame member so disposed between the main board and the sub-board as to surround the electronic components. A flexible printed circuit covers an outer side of a wall portion of the frame member and is so wound around the frame member from upper and lower sides of the wall portion as to cover at least part of an inner side of the wall portion. A wiring pattern formed on the flexible printed circuit is electrically connected to the electronic components, and information to be protected that is stored on the electronic components becomes unreadable if the wiring pattern is cut off or short-circuited.

公开(公告)号：US08379403B2

公开(公告)日：2013-02-19

申请号：US12750458

申请日：2010-03-30

Applicant: David W. Waite ,  James L. Blair ,  Ashish Lohiya ,  Arvid G. Sammuli ,  Jeffrey T. Smith ,  Saritha Narra

Inventor： David W. Waite ,  James L. Blair ,  Ashish Lohiya ,  Arvid G. Sammuli ,  Jeffrey T. Smith ,  Saritha Narra

IPC: H05K7/00

CPC classification number: H05K1/144 ,  G01R1/06772 ,  G01R31/2822 ,  H01R12/52 ,  H01R13/2414 ,  H05K1/0222 ,  H05K1/145 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/09618 ,  H05K2201/09627 ,  H05K2201/10378 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/162

Abstract: A spacer-connector and connection arrangements between daughter boards and motherboards are disclosed. Assemblies may include a daughter board one or more spacer-connectors spacing the daughter board above a motherboard and conductive elastomers providing electrical connections between the daughter board and spacer-connector and between the spacer-connector and the motherboard. The spacer-connector may include ground, power, digital and/or controlled impedance RF pathways to conduct signals between the daughter board to the mother board.

Abstract translation: 公开了间隔器连接器和子板和母板之间的连接布置。 组件可以包括子板，一个或多个间隔器 - 连接器将母板间隔开在母板上方，并且导电弹性体提供子板和间隔器连接器之间以及间隔物连接器和母板之间的电连接。 间隔器连接器可以包括接地，功率，数字和/或控制的阻抗RF路径，以在子板到母板之间传导信号。