公开(公告)号：US09240619B2

公开(公告)日：2016-01-19

申请号：US13096808

申请日：2011-04-28

Applicant: Gregory E. Howard ,  Amneh Akour ,  Yanli Fan ,  Karlheinz Muth ,  Mark W. Morgan

Inventor： Gregory E. Howard ,  Amneh Akour ,  Yanli Fan ,  Karlheinz Muth ,  Mark W. Morgan

IPC: H05K1/02 ,  H01P1/18 ,  H01P3/02 ,  H01L23/66

CPC classification number: H01P1/184 ,  H01L23/66 ,  H01L2223/6638 ,  H01L2924/0002 ,  H01P3/026 ,  H05K1/0245 ,  H05K2201/09245 ,  H01L2924/00

Abstract: An apparatus is provided. The apparatus generally comprises a plurality of pairs of differential transmission lines. The plurality of pairs of differential transmission lines includes a set of pairs of differential transmission lines with each pair of differential transmission lines from the set of pairs of differential transmission lines including at least one twist to alternate current direction. Also, the plurality of differential transmission lines are arranged such that alternating current directions substantially eliminate cross-talk across the plurality of pairs of differential transmission lines.

Abstract translation: 提供了一种装置。 该装置通常包括多对差动传输线。 多对差动传输线包括一组差动传输线，其中每对差动传输线对包括至少一个扭转到交替电流方向的差动传输线对。 此外，多个差动传输线被布置成使得交流方向基本上消除了多对差动传输线之间的串扰。

公开(公告)号：US20150237713A1

公开(公告)日：2015-08-20

申请号：US14184575

申请日：2014-02-19

Applicant: Adel A. Elsherbini ,  Ravindranath Mahajan ,  John S. Guzek ,  Nitin A. Deshpande

Inventor： Adel A. Elsherbini ,  Ravindranath Mahajan ,  John S. Guzek ,  Nitin A. Deshpande

IPC: H05K1/02 ,  H01L23/13 ,  H01L25/00 ,  H05K3/36 ,  H01L25/065 ,  H05K1/14 ,  H05K1/11 ,  H01L23/552 ,  H01L23/538

CPC classification number: H05K1/147 ,  H01L23/13 ,  H01L23/49833 ,  H01L23/552 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09681 ,  Y10T29/49126

Abstract: Embodiments of the present disclosure are directed towards electro-magnetic interference (EMI) shielding techniques and configurations. In one embodiment, an apparatus includes a first substrate, a die having interconnect structures coupled with the first substrate to route input/output (I/O) signals between the die and the first substrate and a second substrate coupled with the first substrate, wherein the die is disposed between the first substrate and the second substrate and at least one of the first substrate and the second substrate include traces configured to provide electro-magnetic interference (EMI) shielding for the die. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及电磁干扰（EMI）屏蔽技术和配置。 在一个实施例中，一种装置包括第一衬底，具有与第一衬底耦合的互连结构的管芯以在管芯和第一衬底之间路由输入/输出（I / O）信号和与第一衬底耦合的第二衬底， 芯片设置在第一基板和第二基板之间，并且第一基板和第二基板中的至少一个包括被配置为为管芯提供电磁干扰（EMI）屏蔽的迹线。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09055680B2

公开(公告)日：2015-06-09

申请号：US14264879

申请日：2014-04-29

Applicant: FUJIFILM Corporation

Inventor： Hiroshige Nakamura

IPC: H05K1/02 ,  B32B15/14 ,  G06F3/044 ,  G06F3/041

CPC classification number: H05K1/0296 ,  B32B15/14 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04112 ,  H05K1/0274 ,  H05K2201/09245

Abstract: The present invention provides an electroconductive sheet and a touch panel which do not impair visibility in a vicinity of an electrode terminal in a sensing region. In an electroconductive sheet which has an electrode pattern constructed of a metal thin wire and an electrode terminal that is electrically connected to an end of the electrode pattern, a transmittance of the electrode pattern is 83% or more, and when the transmittance of the electrode pattern is represented by a %, a transmittance of the electrode terminal is controlled to be (a-20)% or more and (a-3)% or less.

Abstract translation: 本发明提供一种不损害感测区域中的电极端子附近的可见性的导电片和触摸面板。 在具有由金属细线构成的电极图案和与电极图案的端部电连接的电极端子的导电片中，电极图案的透射率为83％以上，并且当电极的透射率 图案由％表示，电极端子的透射率被控制为（a-20）％以上且（a-3）％以下。

公开(公告)号：US20150092359A1

公开(公告)日：2015-04-02

申请号：US14447044

申请日：2014-07-30

Applicant: LG INNOTEK CO., LTD.

Inventor： In Tae Kim ,  Hyun Soo Kim ,  Jun Sik Shin ,  Joon Hyuk Yang ,  Jae Hong Lee ,  Chan Kyu Koo

IPC: H05K1/02 ,  G06F1/16 ,  G06F3/041

CPC classification number: H05K1/0296 ,  G06F1/1643 ,  G06F1/1652 ,  G06F3/0412 ,  G06F3/044 ,  G06F2203/04112 ,  H05K2201/09245 ,  H05K2201/09272

Abstract: Disclosed are a touch window with an improved visibility and a touch device with the same. The touch window includes a substrate; a first sensing electrode aligned on the substrate as a first conductive pattern; and a second sensing electrode aligned on the substrate as a second conductive pattern, wherein the first conductive pattern and the second conductive pattern have mutually different directionalities.

Abstract translation: 公开了具有改进的可见性的触摸窗口和具有其的触摸设备。 触摸窗包括基板; 第一感测电极，其在所述基板上对准，作为第一导电图案; 以及作为第二导电图案在所述基板上对准的第二感测电极，其中所述第一导电图案和所述第二导电图案具有相互不同的方向。

公开(公告)号：US20150047885A1

公开(公告)日：2015-02-19

申请号：US14080810

申请日：2013-11-15

Applicant: Industrial Technology Research Institute

Inventor： Yu-Pei Chang ,  Ming-Huan Yang ,  Chun-Yi Chiu

IPC: H05K1/02 ,  H05K3/10 ,  H05K1/09

CPC classification number: H05K3/02 ,  B82Y40/00 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/097 ,  H05K3/20 ,  H05K3/4685 ,  H05K2201/0108 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/09245 ,  H05K2203/1105 ,  H05K2203/1142 ,  Y10S977/932 ,  Y10T428/24802

Abstract: Provided is a patterned conductive film may include a conductive interconnected nano-structure film. The conductive interconnected nano-structure film may include a first region and a second region adjacent to the first region. A conductivity of the first region may be at least 1000 times a conductivity of the second region.

Abstract translation: 提供了图案化的导电膜可以包括导电互连的纳米结构膜。 导电互连的纳米结构膜可以包括与第一区域相邻的第一区域和第二区域。 第一区域的电导率可以是第二区域的电导率的至少1000倍。

公开(公告)号：US20150002762A1

公开(公告)日：2015-01-01

申请号：US14485286

申请日：2014-09-12

Applicant: WINTEK CORPORATION

Inventor： MING-KUNG WU ,  KUO-CHANG SU ,  CHIA-CHI CHEN ,  YU-TING LIN

IPC: G06F3/041 ,  H05K1/02 ,  H05K1/03

CPC classification number: H03K17/9618 ,  G02B1/11 ,  G06F1/1643 ,  G06F1/1692 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/044 ,  G06F3/047 ,  H01H11/00 ,  H03K2017/9602 ,  H05K1/0296 ,  H05K1/0306 ,  H05K2201/0326 ,  H05K2201/09245 ,  H05K2201/10128 ,  H05K2201/10151 ,  Y10T29/49105

Abstract: A touch-sensitive device includes a transparent substrate, a touch-sensing structure, a decorative layer, a trace layer, a passivation layer and a sheltering layer. The touch-sensing structure is disposed on the transparent substrate and located in a touch-sensitive region. The decorative layer is disposed on the transparent substrate and located in a non-touch-sensitive region, and the trace layer is disposed on the decorative layer. The passivation layer is disposed on the transparent substrate and at least covers the touch-sensing structure and the trace layer. The sheltering layer is disposed at least on the passivation layer and located in the non-touch-sensitive region.

Abstract translation: 触敏装置包括透明基板，触摸感测结构，装饰层，迹线层，钝化层和遮蔽层。 触摸感测结构设置在透明基板上并且位于触敏区域中。 装饰层设置在透明基板上并且位于非触敏区域中，并且迹线层设置在装饰层上。 钝化层设置在透明基板上，并且至少覆盖触摸感测结构和迹线层。 防护层至少设置在钝化层上并且位于非接触敏感区域中。

公开(公告)号：US20140240932A1

公开(公告)日：2014-08-28

申请号：US13843873

申请日：2013-03-15

Applicant: MC10, INC.

Inventor： Yung-Yu Hsu

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

Abstract translation: 提供缓冲结构，其可以用于减少适应电子系统中的应变，其包括与更刚性的装置部件电连通的顺应部件。 缓冲结构设置在适配电子系统上或至少部分嵌入适配电子系统中，使得缓冲结构与柔顺部件和更刚性的器件部件之间的连接区域的至少一部分重叠。 缓冲结构可以具有比适形电子系统的密封剂更高的杨氏模量值。

公开(公告)号：US20140238730A1

公开(公告)日：2014-08-28

申请号：US14271512

申请日：2014-05-07

Applicant: FUJIFILM CORPORATION

Inventor： Hiroshige NAKAMURA

IPC: H05K1/02

CPC classification number: H05K1/0296 ,  B32B15/14 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04112 ,  H05K1/0274 ,  H05K2201/09245

Abstract: The present invention provides an electroconductive sheet and a touch panel which do not impair visibility in a vicinity of an electrode terminal in a sensing region. In an electroconductive sheet which has an electrode pattern constructed of a metal thin wire and an electrode terminal that is electrically connected to an end of the electrode pattern, a transmittance of the electrode pattern is 83% or more, and when the transmittance of the electrode pattern is represented by a %, a transmittance of the electrode terminal is controlled to be (a-20)% or more and (a-3)% or less.

Abstract translation: 本发明提供一种不损害感测区域中的电极端子附近的可见性的导电片和触摸面板。 在具有由金属细线构成的电极图案和与电极图案的端部电连接的电极端子的导电片中，电极图案的透射率为83％以上，并且当电极的透射率 图案由％表示，电极端子的透射率被控制为（a-20）％以上且（a-3）％以下。

公开(公告)号：US08730195B2

公开(公告)日：2014-05-20

申请号：US13750369

申请日：2013-01-25

Applicant: Wintek Corporation

Inventor： Ming-Kung Wu ,  Kuo-Chang Su ,  Chia-Chi Chen ,  Yu-Ting Lin

IPC: G06F3/041

CPC classification number: H03K17/9618 ,  G02B1/11 ,  G06F1/1643 ,  G06F1/1692 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/044 ,  G06F3/047 ,  H01H11/00 ,  H03K2017/9602 ,  H05K1/0296 ,  H05K1/0306 ,  H05K2201/0326 ,  H05K2201/09245 ,  H05K2201/10128 ,  H05K2201/10151 ,  Y10T29/49105

Abstract: A touch-sensitive device includes a transparent substrate, a touch-sensing structure, a decorative layer, a trace layer, a passivation layer and a sheltering layer. The touch-sensing structure is disposed on the transparent substrate and located in a touch-sensitive region. The decorative layer is disposed on the transparent substrate and located in a non-touch-sensitive region, and the trace layer is disposed on the decorative layer. The passivation layer is disposed on the transparent substrate and at least covers the touch-sensing structure and the trace layer. The sheltering layer is disposed at least on the passivation layer and located in the non-touch-sensitive region.

公开(公告)号：US20130265729A1

公开(公告)日：2013-10-10

申请号：US13869553

申请日：2013-04-24

Applicant: PANASONIC CORPORATION

Inventor： Hiromitsu TAKASHITA ,  Tsuyoshi TAKEDA ,  Yuko KONNO ,  Hiroaki FUJIWARA ,  Shingo YOSHIOKA

IPC: H05K1/02

CPC classification number: H05K1/0213 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/66 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/105 ,  H01L2223/6605 ,  H01L2224/02311 ,  H01L2224/0235 ,  H01L2224/0237 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/131 ,  H01L2224/16104 ,  H01L2224/16105 ,  H01L2224/16112 ,  H01L2224/16113 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32104 ,  H01L2224/32105 ,  H01L2224/32147 ,  H01L2224/32148 ,  H01L2224/32227 ,  H01L2224/32237 ,  H01L2224/32238 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/30111 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K1/112 ,  H05K1/114 ,  H05K3/323 ,  H05K3/368 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09227 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09381 ,  H05K2201/09427 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

Abstract: The present invention relates to electronic components assembly for electrically connecting electronic components to each other, wherein a wiring formed on a surface of a first electronic component and a wiring formed on a surface of a second electronic component face each other, and are bonded to each other with an electric conductor interposed therebetween, so as to electrically connect the first electronic component and the second electronic component. The electric conductor is a resin composition containing solder or conductive filler.

Abstract translation: 本发明涉及将电子部件彼此电连接的电子部件组件，其中形成在第一电子部件的表面上的布线和形成在第二电子部件的表面上的布线彼此面对，并且被接合到每个 另一个电导体插入其间，以便电连接第一电子部件和第二电子部件。 电导体是含有焊料或导电填料的树脂组合物。