中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

351 records (took 0.019 seconds)

    Semiconductor connection substrate
    175.
    发明申请
    Semiconductor connection substrate 失效
    半导体连接基板

    公开(公告)号：US20040238941A1

    公开(公告)日：2004-12-02

    申请号：US10483383

    申请日：2004-01-12

    Inventor： Toshiya Satoh ,  Masahiko Ogino ,  Takao Miwa ,  Takashi Naitou ,  Takashi Namekawa

    IPC: H01L023/48

    CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/19011 ,  H01L2924/3011 ,  H05K1/162 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09763 ,  H01L2924/00

    Abstract: Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small sized semiconductor connection substrate which permits to integrate a variety of electronic parts such as capacitors, inductors and resistors in a high density with low cost. The semiconductor connection substrate which connects a semiconductor element to a mounting substrate such as a printed substrate comprises an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of a part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.

    Abstract translation: 通过在基板上安装单个无源元件并增加安装成本来改善模块尺寸增加，提供高可靠性，高性能和小尺寸的半导体连接基板，其允许集成各种电子部件，例如 电容器，电感器和电阻器，高密度，低成本。 将半导体元件连接到诸如印刷基板的安装基板的半导体连接基板包括绝缘体基板，设置在绝缘体基板上的具有不同区域的多个电极，一个或多个元件，其被选自介于 电极，电感器元件和电阻元件，连接这些元件的金属布线，金属布线的一部分的金属端子部分和覆盖元件的有机绝缘体材料以及除了金属端子部分之外的金属布线部分的周边。

    Co-fired ceramic capacitor and method for forming ceramic capacitors for use in printed wiring boards
    176.
    发明申请
    Co-fired ceramic capacitor and method for forming ceramic capacitors for use in printed wiring boards 有权
    共烧陶瓷电容器和用于形成用于印刷线路板的陶瓷电容器的方法

    公开(公告)号：US20040233611A1

    公开(公告)日：2004-11-25

    申请号：US10878877

    申请日：2004-06-28

    Inventor： William J. Borland

    IPC: H01G004/06

    CPC classification number: H01G4/01 ,  H05K1/092 ,  H05K1/162 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4623 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09718 ,  H05K2201/09763 ,  Y10T29/4913

    Abstract: A capacitor structure is fabricated by forming a pattern of first dielectrics over a foil, forming first electrodes over the first dielectrics, and co-firing the first dielectrics and the first electrodes. Co-firing of the dielectrics and the electrodes alleviates cracking caused by differences in thermal coefficient of expansion (TCE) between the electrodes and the dielectrics. Co-firing also ensures a strong bond between the dielectrics and the electrodes. In addition, co-firing allows multi-layer capacitor structures to be constructed, and allows the capacitor electrodes to be formed from copper.

    Abstract translation: 通过在箔上形成第一电介质的图案来形成电容器结构，在第一电介质上形成第一电极，并共烧第一电介质和第一电极。 电介质和电极的共烧可减轻由电极和电介质之间的热膨胀系数（TCE）的差异引起的开裂。 共烧也确保电介质和电极之间的牢固结合。 另外，共烧允许构造多层电容器结构，并且允许电容器电极由铜形成。

    Printed wiring boards having capacitors and methods of making thereof
    177.
    发明申请
    Printed wiring boards having capacitors and methods of making thereof 审中-公开
    具有电容器的印刷电路板及其制造方法

    公开(公告)号：US20040231885A1

    公开(公告)日：2004-11-25

    申请号：US10725888

    申请日：2004-02-04

    Inventor： William J. Borland ,  Saul Ferguson ,  David R. McGregor

    IPC: H05K001/16 ,  H05K003/30

    CPC classification number: H05K1/162 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09718 ,  H05K2201/09763 ,  Y10T29/435 ,  Y10T29/49155

    Abstract: In a printed wiring board, a plurality of stacked innerlayer panels have capacitors connected in parallel by connecting a first electrode of a first panel with a first electrode of a second panel, and similarly connecting second electrodes of the first and second panels. The innerlayer panel having capacitors connected in parallel provides a high capacitance in a small x-y area. An alternate printed wiring board has a capacitor having a first foil electrode, and second and third electrodes located on opposite sides of the first foil electrode. Yet another printed wiring board has capacitors formed as an array of discrete foil electrodes spaced from an array of discrete printed electrodes. Forming discrete interconnected electrodes allows the electrodes to be fired without excessive thermal coefficient of expansion stresses damaging the electrodes.

    Abstract translation: 在印刷布线板中，通过将第一面板的第一电极与第二面板的第一电极连接，并且类似地连接第一和第二面板的第二电极，多个层叠的内层面板具有并联连接的电容器。 具有并联连接的电容器的内层面板在小x-y区域中提供高电容。 交替的印刷线路板具有电容器，该电容器具有第一箔电极，第二和第三电极位于第一箔电极的相对侧。 另一印刷电路板具有形成为与离散印刷电极阵列隔开的离散箔电极阵列的电容器。 形成离散的互连电极允许电极被烧制而不会有过多的热膨胀系数破坏电极。

    Thin film capacitor using conductive polymers
    179.
    发明申请
    Thin film capacitor using conductive polymers 失效
    使用导电聚合物的薄膜电容器

    公开(公告)号：US20040173873A1

    公开(公告)日：2004-09-09

    申请号：US10801324

    申请日：2004-03-16

    Inventor： Prabhat Kumar ,  Henning Uhlenhut

    IPC: H01L027/108 ,  H01L029/76

    CPC classification number: H01G9/15 ,  H01G4/10 ,  H01G11/48 ,  H05K1/162 ,  H05K2201/0179 ,  H05K2201/0329 ,  H05K2201/09763 ,  Y02E60/13

    Abstract: The invention relates to a thin film capacitor containing (a) a substrate, (b) a first polymeric film comprising an electrically conductive polymer located on the substrate, (c) a pentoxide layer selected from the group consisting of tantalum pentoxide, or niobium pentoxide, and mixtures thereof, (d) a second polymeric film comprising an electrically conductive polymer located on the pentoxide layer.

    Abstract translation: 本发明涉及一种薄膜电容器，其包含（a）基底，（b）第一聚合物膜，其包含位于基底上的导电聚合物，（c）五氧化物层，其选自五氧化二钽或五氧化二铌 ，及其混合物，（d）包含位于五氧化物层上的导电聚合物的第二聚合物膜。

    Method of producing circuit carriers with integrated passive components
    180.
    发明申请
    Method of producing circuit carriers with integrated passive components 审中-公开
    具有集成无源元件的电路载体的制造方法

    公开(公告)号：US20040139589A1

    公开(公告)日：2004-07-22

    申请号：US10730374

    申请日：2003-12-08

    Applicant: FRIWO Geratebau GmbH

    Inventor： Michael Bothe ,  Stefan Morbe

    IPC: H01G007/00 ,  H05K003/36

    CPC classification number: H01L21/00 ,  H01L27/08 ,  H01L28/40 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/162 ,  H05K1/167 ,  H05K3/06 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0187 ,  H05K2201/0347 ,  H05K2201/09036 ,  H05K2201/09672 ,  H05K2201/09763 ,  H05K2203/0369 ,  H05K2203/063 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128

    Abstract: The present invention relates to a method for producing an electrical subassembly comprising a circuit carrier and at least one passive component which is integrated into the circuit carrier and comprises an electrically functional material. For providing an improved method for manufacturing an electrical subassembly comprising a circuit carrier and at least one passive component integrated into the circuit carrier, the method ensuring a rapid and inexpensive manufacture on the one hand and permitting a high flexibility on the other hand in the selection of the electrically functional materials involved, the method comprises the following steps: structuring the circuit carrier, at least one recess being created for the passive element; introducing the electrically functional material in a raw state into the recess of the circuit carrier; converting the electrically functional material from the raw state into a final state by supplying energy.

    Abstract translation: 本发明涉及一种用于制造电子组件的方法，该电子组件包括电路载体和集成到电路载体中并且包括电功能材料的至少一个无源部件。 为了提供一种用于制造包括电路载体和集成到电路载体中的至少一个无源部件的电子组件的改进方法，该方法一方面确保了快速且便宜的制造，另一方面在选择中允许高灵活性 涉及的电功能材料，该方法包括以下步骤：构造电路载体，为无源元件创建至少一个凹槽; 将处于原始状态的电功能材料引入电路载体的凹部中; 通过供给能量将电功能材料从原始状态转换成最终状态。

Patent Agency Ranking