PRINTED CIRCUIT BOARD AND POWER SUPPLY UNIT
    174.
    发明申请
    PRINTED CIRCUIT BOARD AND POWER SUPPLY UNIT 有权
    印刷电路板和电源单元

    公开(公告)号:US20150271922A1

    公开(公告)日:2015-09-24

    申请号:US14428008

    申请日:2012-11-13

    Abstract: A printed circuit board mounted with a power module having both a plurality of lead terminals for soldering and at least one screw terminal for screwing includes a through hole which receives the lead terminal and is soldered to the lead terminal, and an electrode section provided with a screw hole fastened to the screw terminal via a screw. A groove is formed between the electrode section and the through hole so as to intersect with two common tangents each connecting, to an outer periphery of a land of the through hole, an outer periphery of a contact area of the electrode section which is in contact with a head bearing surface of a screw or a washer.

    Abstract translation: 安装有具有用于焊接的多个引线端子和用于螺纹连接的至少一个螺钉端子的功率模块的印刷电路板包括:接纳引线端子并被焊接到引线端子的通孔;以及电极部, 螺丝孔通过螺钉固定在螺丝端子上。 在电极部分和通孔之间形成一个沟槽,以便与两个共同的切线相交,所述两个共同的切线连接到通孔的焊盘的外围,与接触的电极部分的接触区域的外周 具有螺钉或垫圈的头部轴承表面。

    Printed circuit board
    175.
    发明授权
    Printed circuit board 有权
    印刷电路板

    公开(公告)号:US09131615B2

    公开(公告)日:2015-09-08

    申请号:US14059777

    申请日:2013-10-22

    Inventor: Hideaki Hirasawa

    Abstract: A printed circuit board has a first solder land, a second solder land, and a signal line pattern. The first solder land is configured to be soldered with an electronic part. The second solder land is configured to accumulate solder, the second solder land being disposed on a downstream side of the first solder land as viewed in a direction in which the printed circuit is carried. The signal line pattern includes an exposed part that is not covered with a resist, the exposed part being disposed between the solder land and the solder bridge prevention land.

    Abstract translation: 印刷电路板具有第一焊盘焊盘,第二焊盘焊盘和信号线图案。 第一焊盘被配置为与电子部件焊接。 第二焊盘被构造为蓄积焊料,第二焊盘位于沿着印刷电路的携带方向设置在第一焊盘的下游侧。 信号线图案包括未被抗蚀剂覆盖的暴露部分,暴露部分设置在焊接区域和防止桥接防止焊盘之间。

    Printed circuit board
    176.
    发明授权
    Printed circuit board 失效
    印刷电路板

    公开(公告)号:US08681509B2

    公开(公告)日:2014-03-25

    申请号:US12544156

    申请日:2009-08-19

    Inventor: Hideaki Hirasawa

    Abstract: A printed circuit board has a first solder land, a second solder land, and a signal line pattern. The first solder land is configured to be soldered with an electronic part. The second solder land is configured to accumulate solder, the second solder land being disposed on a downstream side of the first solder land as viewed in a direction in which the printed circuit is carried. The signal line pattern includes an exposed part that is not covered with a resist, the exposed part being disposed between the solder land and the solder bridge prevention land.

    Abstract translation: 印刷电路板具有第一焊盘焊盘,第二焊盘焊盘和信号线图案。 第一焊盘被配置为与电子部件焊接。 第二焊盘被构造为蓄积焊料,第二焊盘位于沿着印刷电路的携带方向设置在第一焊盘的下游侧。 信号线图案包括未被抗蚀剂覆盖的暴露部分,暴露部分设置在焊接区域和防止桥接防止焊盘之间。

    PRINTED CIRCUIT BOARD
    177.
    发明申请
    PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板

    公开(公告)号:US20140041920A1

    公开(公告)日:2014-02-13

    申请号:US14059777

    申请日:2013-10-22

    Inventor: Hideaki Hirasawa

    Abstract: A printed circuit board has a first solder land, a second solder land, and a signal line pattern. The first solder land is configured to be soldered with an electronic part. The second solder land is configured to accumulate solder, the second solder land being disposed on a downstream side of the first solder land as viewed in a direction in which the printed circuit is carried. The signal line pattern includes an exposed part that is not covered with a resist, the exposed part being disposed between the solder land and the solder bridge prevention land.

    Abstract translation: 印刷电路板具有第一焊盘焊盘,第二焊盘焊盘和信号线图案。 第一焊盘被配置为与电子部件焊接。 第二焊盘被构造为蓄积焊料,第二焊盘位于沿着印刷电路的携带方向设置在第一焊盘的下游侧。 信号线图案包括未被抗蚀剂覆盖的暴露部分,暴露部分设置在焊接区域和防止桥接防止焊盘之间。

    Orthogonal Backplane Connector
    180.
    发明申请
    Orthogonal Backplane Connector 审中-公开
    正交背板连接器

    公开(公告)号:US20090149041A1

    公开(公告)日:2009-06-11

    申请号:US12349344

    申请日:2009-01-06

    Abstract: An orthogonal backplane connector systems having midplane footprints that provide for continuity of impedance and signal integrity through the midplane and allow for the same connector to be coupled to either side of the midplane. This design creates an orthogonal interconnect without taking up unnecessary PCB real estate. The midplane circuit board may include a first differential signal pair of electrically conductive vias disposed in a first direction, and a second differential signal pair of electrically conductive vias disposed in a second direction that is generally orthogonal to the first direction. The first and second differential signal pair of electrically conductive vias are electrically connected through the midplane circuit board. Each pair may be associated with and be located in between ground vias. A ground via that is large relative to the signal vias may be provided. The second signal vias may comprise a shared signal via, receiving a contact from respective connectors connected to each side of the midplane circuit board. The second signal vias may comprise partial signal vias, extending from one or more sides partially into the midplane circuit board. The signal pairs may be offset from a via array centerline formed by the ground vias to correspond with mating ends of signal contacts of an electrical connector that likewise jog away from a centerline of a respective contact column of the connector.

    Abstract translation: 正交背板连接器系统具有中间面积,其通过中平面提供阻抗和信号完整性的连续性,并允许相同的连接器耦合到中平面的任一侧。 该设计创建了一个正交互连,而不占用不必要的PCB空间。 中间平面电路板可以包括沿第一方向设置的导电通孔的第一差分信号对和沿大致正交于第一方向的第二方向设置的第二导电通孔对。 导电通孔的第一和第二差分信号对通过中平面电路板电连接。 每对可以与地面通孔相关联并位于其间。 可以提供相对于信号通路较大的接地通孔。 第二信号通孔可以包括共享信号通孔,从连接到中平面电路板的每一侧的相应连接器接收触点。 第二信号通孔可以包括从一个或多个侧面部分地延伸到中平面电路板中的部分信号通路。 信号对可以从由接地通孔形成的通孔阵列中心线偏移,以对应于同样从连接器的相应接触柱的中心线移开的电连接器的信号触头的配合端。

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