公开(公告)号：US20100314754A1

公开(公告)日：2010-12-16

申请号：US12510274

申请日：2009-07-28

Applicant: Changliang ZHANG ,  Yingwei Jiang ,  Zhijie Wang ,  Wei Xiao

Inventor： Changliang ZHANG ,  Yingwei Jiang ,  Zhijie Wang ,  Wei Xiao

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L24/85 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48482 ,  H01L2224/48489 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/49175 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2224/78 ,  H01L2924/00

Abstract: A method of forming a wire bond in a semiconductor device includes forming a first bump of a first composition proximate to a probe mark on a bond pad. A second bump of the first composition is formed adjacent to the first bump such that the first and second bumps are formed away from the probe mark. A wire of a second composition that is harder than the first composition is attached on top of the first and second bumps to form an interconnection.

Abstract translation: 在半导体器件中形成引线接合的方法包括在接合焊盘上形成靠近探针标记的第一组合物的第一凸点。 第一组合物的第二凸起形成为与第一凸起相邻，使得第一和第二凸块形成为远离探针标记。 比第一组合物硬的第二组合物的导线附接在第一和第二凸块的顶部上以形成互连。

公开(公告)号：US20100181365A1

公开(公告)日：2010-07-22

申请号：US12093403

申请日：2007-03-13

Applicant: Michael T. Deley ,  Peter M. Lister ,  Deepak Sood ,  Zhijie Wang

Inventor： Michael T. Deley ,  Peter M. Lister ,  Deepak Sood ,  Zhijie Wang

IPC: B23K31/02 ,  B23K20/00

CPC classification number: B23K20/004 ,  B23K2101/40 ,  H01L23/544 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78901 ,  H01L2224/85121 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  Y10S228/904 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/05556 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract translation: 提供了一种教导用于引线键合操作的眼点的方法。 该方法包括：（1）从半导体器件的区域中选择一组形状用作眼点，以及（2）使用（a）样品半导体器件或 （b）与半导体器件相关的预定数据。 教学步骤包括相对于彼此定义每个形状的位置。

公开(公告)号：US09613941B2

公开(公告)日：2017-04-04

申请号：US14552442

申请日：2014-11-24

Applicant: Yanbo Xu ,  Zhijie Wang ,  Fei Zong

Inventor： Yanbo Xu ,  Zhijie Wang ,  Fei Zong

IPC: H01L23/495 ,  H01L25/18 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/18 ,  H01L21/56 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49572 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/2919 ,  H01L2224/32058 ,  H01L2224/32105 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83005 ,  H01L2224/83801 ,  H01L2224/83862 ,  H01L2224/85005 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15151 ,  H01L2924/15157 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/35121 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

Abstract: A semiconductor package has a lead frame and a power die. The lead frame has a first die paddle with a cavity formed entirely therethrough. The power die, which has a lower surface, is mounted on the first die paddle such that a first portion of the lower surface is attached to the first die paddle using a solderless die-attach adhesive, and a second portion of the lower surface, is not attached to the first die paddle and abuts the cavity formed in the first die paddle such that the second portion is exposed.

公开(公告)号：US09214447B2

公开(公告)日：2015-12-15

申请号：US14277061

申请日：2014-05-14

Applicant: Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

Inventor： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

CPC classification number: H01L24/85 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling.

Abstract translation: 无引线型半导体封装具有形成模体的模盖。 模具体的角部用模具柱加强，使得拐角具有圆形的突起并且不形成90°的角度。 模具柱防止角垫脱落。

公开(公告)号：US20150243586A1

公开(公告)日：2015-08-27

申请号：US14551069

申请日：2014-11-23

Applicant: Zhijie Wang ,  Zhigang Bai ,  Aipeng Shu ,  Yanbo Xu ,  Huchang Zhang ,  Fei Zong

Inventor： Zhijie Wang ,  Zhigang Bai ,  Aipeng Shu ,  Yanbo Xu ,  Huchang Zhang ,  Fei Zong

IPC: H01L23/495 ,  H01L23/433 ,  H01L23/498 ,  H01L21/56

CPC classification number: H01L23/49503 ,  H01L21/56 ,  H01L21/561 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49568 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A semiconductor die is packaged by providing a die assembly that includes a semiconductor die with an active surface and an opposite mounting surface with an attached thermally conductive substrate. The die assembly is mounted on a first surface of a lead frame die flag so that the thermally conductive substrate is sandwiched between the die flag and the semiconductor die. Bonding pads of the die are electrically connected with bond wires to lead frame lead fingers. A mold compound then encapsulates the semiconductor die, bond wires, and thermally conductive substrate. A second surface of the die flag is exposed through the mold compound.

Abstract translation: 通过提供包括具有活性表面的半导体管芯和具有附接的导热衬底的相对安装表面的管芯组件来封装半导体管芯。 模具组件安装在引线框架模具标记的第一表面上，使得导热基板夹在模具标记和半导体管芯之间。 管芯的接合焊盘与接合线电连接以引导框架引线指。 然后，模制化合物封装半导体管芯，接合线和导热衬底。 模具标记的第二表面通过模具化合物暴露。

公开(公告)号：US08536684B2

公开(公告)日：2013-09-17

申请号：US13092162

申请日：2011-04-22

Applicant: Wei Min Chen ,  Zhigang Bai ,  Zhijie Wang

Inventor： Wei Min Chen ,  Zhigang Bai ,  Zhijie Wang

IPC: H01L23/29

CPC classification number: H01L23/552 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of assembling an integrated circuit (IC) device includes the steps of providing a lead frame or substrate panel, attaching a semiconductor die to the lead frame or substrate panel and electrically coupling the die to the lead frame or substrate panel. The method further includes encapsulating the die with a first encapsulant, and the encapsulating the first encapsulant with a second encapsulant where the second encapsulant includes a material that provides electromagnetic shielding.

Abstract translation: 一种组装集成电路（IC）器件的方法包括以下步骤：提供引线框架或衬底面板，将半导体管芯附接到引线框架或衬底面板，并将管芯电耦合到引线框架或衬底面板。 该方法还包括用第一密封剂封装管芯，并用第二密封剂封装第一密封剂，其中第二密封剂包括提供电磁屏蔽的材料。

公开(公告)号：US08100317B2

公开(公告)日：2012-01-24

申请号：US13072930

申请日：2011-03-28

Applicant: Michael T. Deley ,  Peter M. Lister ,  Deepak Sood ,  Zhijie Wang

Inventor： Michael T. Deley ,  Peter M. Lister ,  Deepak Sood ,  Zhijie Wang

IPC: B23K31/00 ,  B23K11/00

CPC classification number: B23K20/004 ,  B23K2101/40 ,  H01L23/544 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78901 ,  H01L2224/85121 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  Y10S228/904 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/05556 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract translation: 提供了一种教导用于引线键合操作的眼点的方法。 该方法包括：（1）从半导体器件的区域中选择一组形状用作眼点，以及（2）使用（a）样品半导体器件或 （b）与半导体器件相关的预定数据。 教学步骤包括相对于彼此定义每个形状的位置。

公开(公告)号：US20110263077A1

公开(公告)日：2011-10-27

申请号：US13025143

申请日：2011-02-10

Applicant: Zhigang BAI ,  Zhijie Wang ,  Jinzhong Yao

Inventor： Zhigang BAI ,  Zhijie Wang ,  Jinzhong Yao

IPC: H01L21/50

CPC classification number: H01L24/97 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

Abstract: A method of assembling semiconductor devices for surface mounting includes forming an array of lead frames in which supporting frame structures of adjacent lead frames include an intermediate common bar connecting on both its sides with sets of leads of the respective adjacent lead frames. The semiconductor devices are singulated by sawing through the leads on each side of the common bars without sawing the common bars longitudinally. The material sawn off from the common bars in a first direction is removed by washing it away before sawing off the intermediate common bars that run in an orthogonal direction. The supporting frame structures include bars surrounding the array and singulation includes sawing beside the surrounding bars to saw them off before sawing off the intermediate common bars.

Abstract translation: 组装用于表面安装的半导体器件的方法包括形成引线框架阵列，其中相邻引线框架的支撑框架结构包括在其两侧与相应的相邻引线框架的引线组连接的中间公共杆。 半导体器件通过在公共棒的每一侧上的引线进行锯切而不是纵向地锯切公共棒来切割。 在沿着正交方向移动的中间公共棒之前，通过将其从第一方向上从共同的杆上脱落的材料通过洗涤除去。 支撑框架结构包括围绕阵列的条纹，并且分割包括在周围的条子旁边锯切以在锯切中间公共条之前锯切它们。

公开(公告)号：US20100317152A1

公开(公告)日：2010-12-16

申请号：US12499788

申请日：2009-07-08

Applicant: Zhigang BAI ,  Weimin Chen ,  Zhijie Wang

Inventor： Zhigang BAI ,  Weimin Chen ,  Zhijie Wang

IPC: H01L21/60 ,  B23P23/00

CPC classification number: H01L23/3107 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15331 ,  H01L2924/181 ,  Y10T29/41 ,  Y10T29/51 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method for assembling a stackable semiconductor package includes providing a substrate having a first surface and a second surface. The first surface includes bond pads and one or more die pads. Conductive bumps are formed on the bond pads and one or more semiconductor dies are attached to the one or more die pads. The first surface of the substrate, the semiconductor dies and the conductive bumps are placed in a side-gate molding cast and a mold material is supplied to the first surface of the substrate to form a stackable semiconductor package. Similarly formed semiconductor packages may be stacked, one on another to form a stacked semiconductor package.

Abstract translation: 一种用于组装可堆叠半导体封装的方法包括提供具有第一表面和第二表面的衬底。 第一表面包括接合焊盘和一个或多个管芯焊盘。 导电凸块形成在接合焊盘上，并且一个或多个半导体管芯附接到一个或多个管芯焊盘。 将基板的第一表面，半导体管芯和导电凸块放置在侧浇口模铸件中，并将模具材料供应到基板的第一表面以形成可堆叠的半导体封装。 类似地形成的半导体封装可以彼此层叠以形成堆叠的半导体封装。

公开(公告)号：US07613372B2

公开(公告)日：2009-11-03

申请号：US11870404

申请日：2007-10-10

Applicant: Xin Simon Luo ,  Pei Chuang Chen ,  Leming Wang ,  Zhijie Wang

Inventor： Xin Simon Luo ,  Pei Chuang Chen ,  Leming Wang ,  Zhijie Wang

IPC: G02B6/32

CPC classification number: G02B6/4204 ,  G02B6/32 ,  G02B6/4212

Abstract: A coupling apparatus includes a lens disposed between a port, such as a photodetector, and a light source, such as a fiber. The lens is aligned such that light emitted from the light source is focused by the lens onto the port. Between the lens and light source and/or lens and port, a low contrast medium is disposed to reduce reflection that could degrade signal strength.

Abstract translation: 耦合装置包括设置在诸如光电检测器的端口和诸如光纤的光源之间的透镜。 镜头对齐，使得从光源发射的光被透镜聚焦到端口上。 在透镜和光源和/或透镜和端口之间，设置低对比度介质以减少可能降低信号强度的反射。