公开(公告)号：US08703545B2

公开(公告)日：2014-04-22

申请号：US13408185

申请日：2012-02-29

申请人： Zhiqiang Niu ,  Ming-Chen Lu ,  Yan Xun Xue ,  Yan Huo ,  Hua Pan ,  Guo Feng Lian ,  Jun Lu

发明人： Zhiqiang Niu ,  Ming-Chen Lu ,  Yan Xun Xue ,  Yan Huo ,  Hua Pan ,  Guo Feng Lian ,  Jun Lu

IPC分类号： H01L21/56 ,  H01L23/495

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor package is provided with an Aluminum alloy lead-frame without noble metal plated on the Aluminum base lead-frame. Aluminum alloy material with proper alloy composition and ratio for making an aluminum alloy lead-frame is provided. The aluminum alloy lead-frame is electroplated with a first metal electroplating layer, a second electroplating layer and a third electroplating layer in a sequence. The lead-frame electroplated with the first, second and third metal electroplating layers is then used in the fabrication process of a power semiconductor package including chip connecting, wire bonding, and plastic molding. After the molding process, the area of the lead-frame not covered by the molding compound is electroplated with a fourth metal electroplating layer that is not easy to be oxidized when exposing to air.

摘要翻译： 半导体封装设置有没有贵金属的铝合金引线框架，镀在铝基底引线框架上。 提供具有适当的合金组成和制造铝合金引线框架的比例的铝合金材料。 铝合金引线框架依次电镀有第一金属电镀层，第二电镀层和第三电镀层。 然后，利用第一，第二和第三金属电镀层电镀的引线框架用于包括芯片连接，引线接合和塑性模制的功率半导体封装的制造过程中。 在模制过程之后，未被模塑料覆盖的引线框架的区域用暴露于空气中不容易氧化的第四金属电镀层电镀。

公开(公告)号：US08563417B2

公开(公告)日：2013-10-22

申请号：US13302219

申请日：2011-11-22

申请人： Jun Lu ,  Alex Niu ,  Yueh-Se Ho ,  Ping Hoang ,  Jacky Gong ,  Yan Xun Xue ,  Xiaolian Zhang ,  Ming-Chen Lu

发明人： Jun Lu ,  Alex Niu ,  Yueh-Se Ho ,  Ping Hoang ,  Jacky Gong ,  Yan Xun Xue ,  Xiaolian Zhang ,  Ming-Chen Lu

IPC分类号： H01L21/78

CPC分类号： H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3157 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L2224/03009 ,  H01L2224/0332 ,  H01L2224/0384 ,  H01L2224/03848 ,  H01L2224/03849 ,  H01L2224/04034 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05794 ,  H01L2224/058 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/06135 ,  H01L2224/06164 ,  H01L2224/06181 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40247 ,  H01L2224/73263 ,  H01L2224/84801 ,  H01L2224/94 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/03 ,  H01L2224/053 ,  H01L2924/014 ,  H01L2924/00

摘要： The invention generally relates to a packaging method of an ultra-thin chip, more specifically, the invention relates to a method for packaging the ultra-thin chip with solder ball thermo-compression in wafer level packaging process. The method starts with disposing solder balls on metal pads arranged on the front surface of semiconductor chips that are formed at the front surface of a semiconductor wafer. The solder balls are soften by heating the wafer, a compression plate is applied with a pressure on the top ends of the solder balls thus forming a co-planar top surface at the top ends of the solder balls. A molding compound is deposited on the front surface of the wafer with the top ends of the solder balls exposed. The wafer is then ground from its back surface to reduce its thickness to achieve ultra-thin chip.

摘要翻译： 本发明一般涉及超薄芯片的封装方法，更具体地说，本发明涉及一种用于在晶片级封装工艺中封装具有焊球热压缩的超薄芯片的方法。 该方法开始于将焊球设置在形成在半导体晶片的前表面的半导体芯片的前表面上的金属焊盘上。 通过加热晶片来软化焊球，压力板在焊球的顶端施加压力，从而在焊球的顶端形成共面顶表面。 模具化合物沉积在晶片的前表面上，其中焊球的顶端被暴露。 然后将晶片从其背面研磨以减小其厚度以实现超薄芯片。

公开(公告)号：US20130221507A1

公开(公告)日：2013-08-29

申请号：US13408185

申请日：2012-02-29

申请人： Zhiqiang Niu ,  Ming-Chen Lu ,  Yan Xun Xue ,  Yan Huo ,  Hua Pan ,  Guo Feng Lian ,  Jun Lu

发明人： Zhiqiang Niu ,  Ming-Chen Lu ,  Yan Xun Xue ,  Yan Huo ,  Hua Pan ,  Guo Feng Lian ,  Jun Lu

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor package is provided with an Aluminum alloy lead-frame without noble metal plated on the Aluminum base lead-frame. Aluminum alloy material with proper alloy composition and ratio for making an aluminum alloy lead-frame is provided. The aluminum alloy lead-frame is electroplated with a first metal electroplating layer, a second electroplating layer and a third electroplating layer in a sequence. The lead-frame electroplated with the first, second and third metal electroplating layers is then used in the fabrication process of a power semiconductor package including chip connecting, wire bonding, and plastic molding. After the molding process, the area of the lead-frame not covered by the molding compound is electroplated with a fourth metal electroplating layer that is not easy to be oxidized when exposing to air.

摘要翻译： 半导体封装设置有没有贵金属的铝合金引线框架，镀在铝基底引线框架上。 提供具有适当的合金组成和制造铝合金引线框架的比例的铝合金材料。 铝合金引线框架依次电镀有第一金属电镀层，第二电镀层和第三电镀层。 然后，利用第一，第二和第三金属电镀层电镀的引线框架用于包括芯片连接，引线接合和塑性模制的功率半导体封装的制造过程中。 在模制过程之后，未被模塑料覆盖的引线框架的区域用暴露于空气中不容易氧化的第四金属电镀层电镀。

公开(公告)号：US09006870B2

公开(公告)日：2015-04-14

申请号：US13955206

申请日：2013-07-31

申请人： Xiaotian Zhang ,  Hua Pan ,  Ming-Chen Lu ,  Jun Lu ,  Hamza Yilmaz

发明人： Xiaotian Zhang ,  Hua Pan ,  Ming-Chen Lu ,  Jun Lu ,  Hamza Yilmaz

IPC分类号： H01L23/34 ,  H01L23/495 ,  H01L23/00

CPC分类号： H01L25/50 ,  H01L21/304 ,  H01L21/56 ,  H01L21/78 ,  H01L22/14 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49534 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/27 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/07 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/118 ,  H01L2224/13022 ,  H01L2224/32245 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40145 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84801 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

摘要： A stacked multi-chip packaging structure comprises a lead frame, a first semiconductor chip mounted on the lead frame, a second semiconductor chip flipped-chip mounted on the lead frame, a metal clip mounted on top of the first and second semiconductor chips and a third semiconductor chip stacked on the meal clip; bonding wires electrically connecting electrodes on the third semiconductor chip to the first and second semiconductor chips and the pins of the lead frame; plastic molding encapsulating the lead frame, the chips and the metal clip.

摘要翻译： 堆叠多芯片封装结构包括引线框架，安装在引线框架上的第一半导体芯片，安装在引线框架上的第二半导体芯片翻转芯片，安装在第一和第二半导体芯片顶部的金属夹子和 第三个半导体芯片堆叠在餐夹上; 将第三半导体芯片上的电极电连接到第一和第二半导体芯片和引线框架的引脚的接合线; 塑料成型封装引线框架，芯片和金属夹。

公开(公告)号：US08669650B2

公开(公告)日：2014-03-11

申请号：US13244256

申请日：2011-09-23

申请人： Xiaotian Zhang ,  Hamza Yilmaz ,  Jun Lu ,  Xiaoguang Zeng ,  Ming-Chen Lu

发明人： Xiaotian Zhang ,  Hamza Yilmaz ,  Jun Lu ,  Xiaoguang Zeng ,  Ming-Chen Lu

IPC分类号： H01L23/495 ,  H01L23/02

CPC分类号： H01L23/49524 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/84 ,  H01L25/074 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/3701 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40106 ,  H01L2224/40135 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/4118 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73271 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/81 ,  H01L2224/84 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012

摘要： A semiconductor device package comprises a lead frame having a die paddle comprising a first chip installation area and a second chip installation area, a recess area formed in the first chip installation area, and multiple metal pillars formed in the recess area, a notch divides the first chip installation area into a transverse base extending transversely and a longitudinal base extending longitudinally, and separates the recess area into a transverse recess part formed in the transverse base and a longitudinal recess part formed in longitudinal base; a portion of a transverse extending part connecting to an external pin extends into a portion inside of the notch.

摘要翻译： 一种半导体器件封装，包括具有包括第一芯片安装区域和第二芯片安装区域的模板的引线框架，形成在第一芯片安装区域中的凹部区域和形成在凹部区域中的多个金属柱，凹口将 第一芯片安装区域横向延伸的横向基部和纵向延伸的纵向基部，并且将凹部区域分离成形成在横向基部中的横向凹部和形成在纵向基部中的纵向凹部; 连接到外部销的横向延伸部分的一部分延伸到凹口内部的一部分。

公开(公告)号：US20120248539A1

公开(公告)日：2012-10-04

申请号：US13244256

申请日：2011-09-23

申请人： Xiaotian Zhang ,  Hamza Yilmaz ,  Jun Lu ,  Xiaoguang Zeng ,  Ming-Chen Lu

发明人： Xiaotian Zhang ,  Hamza Yilmaz ,  Jun Lu ,  Xiaoguang Zeng ,  Ming-Chen Lu

IPC分类号： H01L23/495 ,  H01L27/088

CPC分类号： H01L23/49524 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/84 ,  H01L25/074 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/3701 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40106 ,  H01L2224/40135 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/4118 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73271 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/81 ,  H01L2224/84 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012

摘要： A semiconductor device package comprises a lead frame having a die paddle comprising a first chip installation area and a second chip installation area, a recess area formed in the first chip installation area, and multiple metal pillars formed in the recess area, a notch divides the first chip installation area into a transverse base extending transversely and a longitudinal base extending longitudinally, and separates the recess area into a transverse recess part formed in the transverse base and a longitudinal recess part formed in longitudinal base; a portion of a transverse extending part connecting to an external pin extends into a portion inside of the notch.

摘要翻译： 一种半导体器件封装，包括具有包括第一芯片安装区域和第二芯片安装区域的模板的引线框架，形成在第一芯片安装区域中的凹部区域和形成在凹部区域中的多个金属柱，凹口将 第一芯片安装区域横向延伸的横向基部和纵向延伸的纵向基部，并且将凹部区域分离成形成在横向基部中的横向凹部和形成在纵向基部中的纵向凹部; 连接到外部销的横向延伸部分的一部分延伸到凹口内部的一部分。

公开(公告)号：US20150035129A1

公开(公告)日：2015-02-05

申请号：US13955206

申请日：2013-07-31

申请人： Xiaotian Zhang ,  Hua Pan ,  Ming-Chen Lu ,  Jun Lu ,  Hamza Yilmaz

发明人： Xiaotian Zhang ,  Hua Pan ,  Ming-Chen Lu ,  Jun Lu ,  Hamza Yilmaz

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L25/50 ,  H01L21/304 ,  H01L21/56 ,  H01L21/78 ,  H01L22/14 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49534 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/27 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/07 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/118 ,  H01L2224/13022 ,  H01L2224/32245 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40145 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84801 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

摘要： A stacked multi-chip packaging structure comprises a lead frame, a first semiconductor chip mounted on the lead frame, a second semiconductor chip flipped-chip mounted on the lead frame, a metal clip mounted on top of the first and second semiconductor chips and a third semiconductor chip stacked on the meal clip; bonding wires electrically connecting electrodes on the third semiconductor chip to the first and second semiconductor chips and the pins of the lead frame; plastic molding encapsulating the lead frame, the chips and the metal clip.

摘要翻译： 堆叠多芯片封装结构包括引线框架，安装在引线框架上的第一半导体芯片，安装在引线框架上的第二半导体芯片翻转芯片，安装在第一和第二半导体芯片顶部的金属夹子和 第三个半导体芯片堆叠在餐夹上; 将第三半导体芯片上的电极电连接到第一和第二半导体芯片和引线框架的引脚的接合线; 塑料成型封装引线框架，芯片和金属夹。

公开(公告)号：US20140175628A1

公开(公告)日：2014-06-26

申请号：US13724006

申请日：2012-12-21

申请人： Hua Pan ,  Yueh-Se Ho ,  Jun Lu ,  Ming-Chen Lu ,  Zhiqiang Niu

发明人： Hua Pan ,  Yueh-Se Ho ,  Jun Lu ,  Ming-Chen Lu ,  Zhiqiang Niu

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/3171 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/02166 ,  H01L2224/03464 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40479 ,  H01L2224/4048 ,  H01L2224/40499 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48647 ,  H01L2224/48847 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8391 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/8491 ,  H01L2224/92 ,  H01L2224/92142 ,  H01L2224/92147 ,  H01L2224/92157 ,  H01L2224/9221 ,  H01L2224/92242 ,  H01L2224/92246 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/386 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/01079 ,  H01L2224/03 ,  H01L21/78 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/85 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A semiconductor device comprises a first top electrode and a second top electrode at a front surface of the die, at least a Ni plating layer and an Au plating layer overlaying the Ni plating layer are formed on each of the first top electrode and the second top electrode. A copper clip attaches on the Au plating layer of the second top electrode. A gold (Au) stud bump is formed on the Au plating layer of the first top electrode with a copper wire connected on the stud bump. The Au stud bump is thicker than a thickness of the Au plating layer and thinner than a thickness of the copper clip to avoid copper wire NSOP (non-stick on pad) problem due to Ni plating layer diffusion during the solder reflow process in the copper clip attachment.

摘要翻译： 半导体器件包括在管芯的前表面处的第一顶电极和第二顶电极，在第一顶电极和第二顶部的每一个上形成至少Ni镀层和覆盖Ni镀层的Au镀层 电极。 铜夹附着在第二顶电极的Au镀层上。 在第一顶电极的Au镀层上形成金（Au）柱凸块，铜柱连接在凸块上。 Au凸块比Au镀层的厚度厚，比铜夹的厚度薄，以避免在铜回焊过程中镀镍层扩散的铜线NSOP（不粘垫）问题 夹子附件。

公开(公告)号：US20150206868A1

公开(公告)日：2015-07-23

申请号：US14158830

申请日：2014-01-19

申请人： Xiaotian Zhang ,  Hamaz Yilmaz ,  Jun Lu ,  Xiaoguang Zeng ,  Ming-Chen Lu

发明人： Xiaotian Zhang ,  Hamaz Yilmaz ,  Jun Lu ,  Xiaoguang Zeng ,  Ming-Chen Lu

IPC分类号： H01L25/00 ,  H01L25/07 ,  H01L23/495 ,  H01L21/78 ,  H01L25/16

CPC分类号： H01L25/50 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L25/072 ,  H01L25/165 ,  H01L2224/0401 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/06135 ,  H01L2224/16245 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83805 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/92157 ,  H01L2224/92225 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599

摘要： A semiconductor device package comprises a lead frame having a die paddle comprising a first chip installation area and a second chip installation area, a recess area formed in the first chip installation area, and multiple metal pillars formed in the recess area, a notch divides the first chip installation area into a transverse base extending transversely and a longitudinal base extending longitudinally, and separates the recess area into a transverse recess part formed in the transverse base and a longitudinal recess part formed in longitudinal base; a portion of a transverse extending part connecting to an external pin extends into a portion inside of the notch.

摘要翻译： 一种半导体器件封装，包括具有包括第一芯片安装区域和第二芯片安装区域的模板的引线框架，形成在第一芯片安装区域中的凹部区域和形成在凹部区域中的多个金属柱，凹口将 第一芯片安装区域横向延伸的横向基部和纵向延伸的纵向基部，并且将凹部区域分离成形成在横向基部中的横向凹部和形成在纵向基部中的纵向凹部; 连接到外部销的横向延伸部分的一部分延伸到凹口内部的一部分。