公开(公告)号：US11967758B2

公开(公告)日：2024-04-23

申请号：US17987610

申请日：2022-11-15

申请人： Skyworks Solutions, Inc.

发明人： Ki Wook Lee

IPC分类号： H01Q1/38 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/36 ,  H01Q9/04 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06

CPC分类号： H01Q1/38 ,  H01Q1/2283 ,  H01Q1/2291 ,  H01Q1/242 ,  H01Q1/36 ,  H01Q9/0407 ,  H05K1/0224 ,  H05K1/115 ,  H05K3/42 ,  H05K3/4697 ,  H05K3/0026 ,  H05K3/027 ,  H05K3/06 ,  H05K3/4602 ,  H05K2201/09063 ,  H05K2201/10098 ,  H05K2201/10734 ,  H05K2203/107 ,  H05K2203/1178

摘要： A printed circuit board can include a substrate layer, a first metal layer disposed over the substrate layer, a core layer disposed over the first metal layer, and a second metal layer disposed over the core layer, where the core layer defines a closed cavity between the first and second metal layers. Optionally, the cavity is filled with air and operates as an antenna.

公开(公告)号：US20240114627A1

公开(公告)日：2024-04-04

申请号：US17937894

申请日：2022-10-04

申请人： Intel Corporation

发明人： Jeremy Ecton ,  Robert Alan May ,  Suddhasattwa Nad ,  Srinivas V. Pietambaram ,  Brandon C. Marin

IPC分类号： H05K3/06 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09

CPC分类号： H05K3/062 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H05K1/09 ,  H05K3/067 ,  H01L25/0652

摘要： Embodiments provides for a package substrate, including: a core comprising insulative material; first conductive traces in contact with a surface of the core; and buildup layers in contact with the first conductive traces and the surface of the core, the buildup layers comprising second conductive traces in an organic dielectric material. The first conductive traces comprise at least a first metal and a second metal, the first conductive traces comprise a first region proximate to and in contact with the core and a second region distant from the core, parallel and opposite to the first region, a relative concentration of the first metal to the second metal is higher in the first region than in the second region, and the relative concentration of the first metal to the second metal between the first region and the second region varies non-uniformly.

公开(公告)号：US20240030580A1

公开(公告)日：2024-01-25

申请号：US18331946

申请日：2023-06-09

申请人： Innolux Corporation

发明人： Chen-Lin Yeh ,  Yan-Zheng Wu ,  Yung-Wei Chen

IPC分类号： H01P3/08 ,  H01P11/00 ,  H05K1/02 ,  H05K3/06 ,  H05K3/42 ,  H05K3/36

CPC分类号： H01P3/081 ,  H01P11/003 ,  H05K1/0243 ,  H05K3/06 ,  H05K3/423 ,  H05K3/368 ,  H05K2201/10151 ,  H05K2201/10196 ,  H05K2201/10098 ,  H05K2201/09545 ,  H05K2201/09618 ,  H05K2201/09609 ,  H05K3/0029

摘要： An electronic device includes a glass substrate, a first metal layer, a second metal layer, and a third metal layer. The glass substrate includes a first surface, a second surface corresponding to the first surface, and at least two first through holes. The first through hole includes a third surface, and the third surface is connected to the first surface and the second surface. A first conductive layer is disposed on the first surface. A second conductive layer is disposed on the second surface. A third conductive layer is disposed on the third surface and is electrically connected to the first conductive layer and the second conductive layer. The first through hole has a major axis and a minor axis in a top view direction. A method of manufacturing the electronic device is also included.

公开(公告)号：US20230337358A1

公开(公告)日：2023-10-19

申请号：US18047689

申请日：2022-10-19

申请人： The Trustees of the University of Pennsylvania

发明人： Alan T. Johnson, JR. ,  Rajatesh R. Gudibande ,  Zhengqing John Qi

IPC分类号： H05K1/09 ,  H05K3/20 ,  H01L29/16 ,  H01L29/786 ,  B33Y80/00 ,  H05K1/03 ,  H05K3/06 ,  H05K3/12

CPC分类号： H05K1/09 ,  H05K3/20 ,  H01L29/1606 ,  H01L29/78684 ,  B33Y80/00 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/1275 ,  H05K2201/0323 ,  H05K2203/1338 ,  H01G11/32

摘要： The present invention provides methods for fabricating graphene workpieces. The present invention also provides for products produced by the methods of the present invention and for apparatuses used to perform the methods of the present invention.

公开(公告)号：US11792941B2

公开(公告)日：2023-10-17

申请号：US17460458

申请日：2021-08-30

申请人： ImberaTek LLC

发明人： Risto Tuominen ,  Antti Iihola ,  Petteri Palm

IPC分类号： H05K3/06 ,  H01L21/48 ,  H01L23/13 ,  H01L23/538 ,  H01L23/544 ,  H01L23/00 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H01L21/56 ,  H05K3/20 ,  H05K3/40

CPC分类号： H05K3/064 ,  H01L21/4846 ,  H01L21/56 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/16 ,  H01L24/24 ,  H01L24/82 ,  H01L24/83 ,  H05K1/183 ,  H05K1/187 ,  H05K1/188 ,  H05K3/284 ,  H05K3/303 ,  H05K3/305 ,  H05K3/321 ,  H01L21/568 ,  H01L24/81 ,  H01L24/90 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/24227 ,  H01L2224/293 ,  H01L2224/2929 ,  H01L2224/81121 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/92144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/1517 ,  H01L2924/15153 ,  H05K3/205 ,  H05K3/32 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2201/0969 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0353 ,  H05K2203/063 ,  H05K2203/0723 ,  Y02P70/50 ,  Y10T29/4913 ,  H01L2924/00011 ,  H01L2224/29075 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2224/2929 ,  H01L2924/00014 ,  H01L2224/293 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/0401 ,  H01L2924/00011 ,  H01L2224/0401

摘要： The present publication discloses a circuit-board structure, including a conductor layer on an insulating material layer, and a conductor pattern on top of the conductor foil. A component is attached to the conductor foil and the conductor pattern, the component embedded at least in part in adhesive which attaches the component to the insulating material layer. A recess is formed in the conductor foil and the insulating material layer, and contact openings are in the insulating material layer at locations of contact areas of the component. Conductor material of the conductor foil is not present outside the conductor pattern, and the conductor foil is located between the conductor pattern and the insulating material layer.

公开(公告)号：US11785713B2

公开(公告)日：2023-10-10

申请号：US17425713

申请日：2020-01-13

申请人： AMOGREENTECH CO., LTD.

发明人： Jeong-Sang Yu ,  Young-Suk Oh ,  Taek-Min Kim

IPC分类号： H05K1/02 ,  H05K3/06 ,  H05K3/46 ,  H05K1/18

CPC分类号： H05K1/028 ,  H05K1/0201 ,  H05K3/06 ,  H05K3/4644 ,  H05K1/181 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/10189

摘要： A flexible cable jumper structure and manufacturing method thereof. The flexible cable jumper device of the present disclosure includes a cover layer, a first metal layer stacked on the cover layer and having a circuit pattern formed thereon, a first dielectric layer stacked on the first metal layer, a first adhesive layer applied on the first dielectric layer, a second metal layer stacked on the first dielectric layer to which the first adhesive layer is applied and having a circuit pattern formed thereon, a heat-resistant layer stacked on the second metal layer, and a terminal layer formed in one region of the heat-resistant layer and electrically connected to the first metal layer and the second metal layer.

公开(公告)号：US20230300989A1

公开(公告)日：2023-09-21

申请号：US18046742

申请日：2022-10-14

申请人： TEMG TAI PCB MACHINERY CO., LTD.

发明人： PATRICK LU ,  CHIH WEI LU

IPC分类号： H05K3/06 ,  H05K3/00

CPC分类号： H05K3/068 ,  H05K3/002 ,  H05K2203/0195 ,  H05K2203/0165

摘要： A circuit board etching device for improving etching factor, comprising: a circuit board conveying device, which laterally conveys a circuit board; a circuit forming etching tank and a first etchant spraying unit, the first etchant spraying unit sprays a first etchant on the etching surface of the circuit board; and a circuit modification etching tank and a second etchant spraying unit, the second etchant spraying unit sprays a second etchant on the etching surface of the circuit board, and make the etching speed of the circuit modification etching tank slower than the etching speed of the circuit forming etching tank, whereby having the effect of improving the etching factor of the circuit board

公开(公告)号：US20230284391A1

公开(公告)日：2023-09-07

申请号：US18019104

申请日：2021-07-15

申请人： Gebr. Schmid GmbH

发明人： Christian Buchner ,  Jürgen Haungs ,  Christian Schmid

IPC分类号： H05K3/06

CPC分类号： H05K3/062 ,  H05K2203/107

摘要： A method of producing a printed circuit board includes providing a base substrate that is a film or plate, has first and second substrate sides and consists partly of an electrically non-conducting organic polymer material, where the first substrate side is covered with a capping metal layer, and regionally removing the capping metal layer, wherein regionally removing the capping metal layer includes applying a mask layer to the capping metal layer, regionally removing the mask layer by a laser so that the first substrate side is divided into at least one first subregion, in which the first substrate side is covered only with the capping metal layer, and into at least one second subregion, in which the first substrate side is covered with the capping metal layer and by the mask layer, and removing the capping metal layer in the at least one first subregion by an etching solution.

公开(公告)号：US20230269881A1

公开(公告)日：2023-08-24

申请号：US17729054

申请日：2022-04-26

申请人： DEVICEENG CO., LTD.

发明人： Taek Youb LEE

IPC分类号： H05K3/06

CPC分类号： H05K3/068 ,  H05K3/067 ,  H05K2203/1554 ,  H05K2203/086 ,  H05K2203/1509

摘要： The present invention relates to a substrate edge etching apparatus including: a substrate support assembly having a horizontally rotatable chuck base, chuck pins disposed on top of the chuck base to support a substrate, a purge gas inlet hole extending from an underside center of the chuck base to an interior of the chuck base in an upward and downward direction thereof, and a purge gas outlet hole extending radially from the purge gas inlet hole and then extending upwardly to penetrate top of the chuck base; a purge gas supply assembly for supplying a purge gas to the purge gas inlet hole; a chemical liquid supply unit for supplying a chemical liquid to top of the substrate; a bowl assembly having bowls surrounding the periphery of the substrate support assembly and configured to be able to ascend and descend; and a fan filter unit spaced apart from top of the substrate support assembly.

公开(公告)号：US11696407B2

公开(公告)日：2023-07-04

申请号：US17560004

申请日：2021-12-22

申请人： Intel Corporation

发明人： Chong Zhang ,  Ying Wang ,  Junnan Zhao ,  Cheng Xu ,  Yikang Deng

IPC分类号： H01L23/495 ,  H05K1/16 ,  H01L23/498 ,  H01L21/48 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H01F41/04 ,  H01F27/28 ,  H01F17/00 ,  H05K3/06 ,  H01L23/00

CPC分类号： H05K1/165 ,  H01F17/0013 ,  H01F27/2804 ,  H01F41/041 ,  H01F41/046 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H05K1/115 ,  H05K3/0026 ,  H05K3/0047 ,  H05K3/422 ,  H01F2017/002 ,  H01L23/49816 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/1427 ,  H01L2924/19042 ,  H01L2924/19102 ,  H05K3/06 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/072 ,  H05K2203/107

摘要： Embodiments may include inductors with embedded magnetic cores and methods of making such inductors. In an embodiment, an integrated circuit package may include an integrated circuit die with a multi-phase voltage regulator electrically coupled to the integrated circuit die. In such embodiments, the multi-phase voltage regulator may include a substrate core and a plurality of inductors. The inductors may include a conductive through-hole disposed through the substrate core and a plugging layer comprising a dielectric material surrounding the conductive through-hole. In an embodiment, a magnetic sheath is formed around the plugging layer. In an embodiment, the magnetic sheath is separated from the plated through hole by the plugging layer. Additionally, a first layer comprising a dielectric material may be disposed over a first surface of the magnetic sheath, and a second layer comprising a dielectric material may be disposed over a second surface of the magnetic sheath.