公开(公告)号：US20170251913A1

公开(公告)日：2017-09-07

申请号：US15057767

申请日：2016-03-01

Applicant: KARL STORZ Endovision, Inc.

Inventor： Dashiell Birnkrant ,  Gerard Vadenais ,  Jordan He ,  Jason Curtis

IPC: A61B1/05 ,  H05K3/34 ,  A61B1/00 ,  H04N5/335

CPC classification number: A61B1/0011 ,  A61B1/051 ,  H04N5/2253 ,  H04N2005/2255 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10356 ,  H05K2201/10628 ,  H05K2201/10757

Abstract: An image sensor module includes a circuit board, image sensor, electronic component assembly, and cable assembly. The circuit board includes a center section located between two end sections. The end sections each extend away from the center section and define an interior area there between. The image sensor is secured to an outer face of the circuit board in the center section with sensor contact fingers being connected at the circuit board outer face in one or both end sections. The electronic component arrangement is mounted on an inner face of the circuit board in the center section. A number of wires of the cable assembly extend through an end gap between the circuit board end sections and are connected to the inner face of the circuit board so as to overlap with the sensor contact fingers along a module longitudinal axis.

公开(公告)号：US09697953B2

公开(公告)日：2017-07-04

申请号：US14667575

申请日：2015-03-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Seok Kyoon Woo ,  Kyoung Jin Jun ,  So Yeon Song ,  Soon Ju Lee

IPC: H01G2/20 ,  H01G4/06 ,  H01G4/228 ,  H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H01G4/224 ,  H01G4/012 ,  H05K1/18 ,  H05K3/34 ,  H05K1/11

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/0311 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: There is provided a multilayer ceramic electronic component including: a multilayer ceramic capacitor (MLCC) including first and second external electrodes disposed to be spaced apart from one another on a mounting surface thereof; and first and second terminal electrodes including upper horizontal portions disposed on lower surfaces of the first and second external electrodes, lower horizontal portions disposed to be spaced apart from the upper horizontal portions downwardly, and curved vertical portions connecting one ends of the upper horizontal portions and one ends of the lower horizontal portions, having “⊂” and “⊃” shapes, and disposed on the mounting surface of the MLCC in a facing manner.

公开(公告)号：US20170170583A1

公开(公告)日：2017-06-15

申请号：US15350239

申请日：2016-11-14

Applicant: GE Aviation Systems Limited

Inventor： Denis Vaughan WEALE ,  Julian Peter MAYES

IPC: H01R12/70 ,  H05K1/18 ,  H01R13/658 ,  H05K1/02 ,  H01R12/71 ,  H01R13/24

CPC classification number: H01R12/7088 ,  H01R12/718 ,  H01R13/2414 ,  H01R13/658 ,  H05K1/0216 ,  H05K1/0263 ,  H05K1/181 ,  H05K3/4015 ,  H05K2201/0314 ,  H05K2201/10265 ,  H05K2201/10272 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/10757 ,  H05K2201/2036 ,  Y02P70/611

Abstract: The present embodiments relate to providing electrical connectivity to electric-powered components mounted in parallel on a wiring board. An electrical apparatus is provided in which electricity is conducted from an electrically conductive member onto first and second electrically conductive pathways, of a wiring board through the use of first and second resiliently-deformable electrically conductive connectors. First and second electric-powered components are mounted to the respective first and second electrically conductive pathways. The first and second resiliently-deformable electrically conductive connectors are compressed between the electrically conductive member and the wiring board such that the first connector provides an electrical connection between the conductive member and the first electrically conductive pathway, and the second connector provides an electrical connection between the conductive member and the second electrically conductive pathway.

公开(公告)号：US09562675B2

公开(公告)日：2017-02-07

申请号：US14308649

申请日：2014-06-18

Applicant: ILLINOIS TOOL WORKS INC.

Inventor： Yasoob Ahmed ,  Steven Sievers

IPC: F21V19/00 ,  F21V23/00 ,  F21V23/06 ,  H05K3/30 ,  F21W111/00 ,  H05K1/18 ,  H05K3/34 ,  F21Y101/00

CPC classification number: F21V19/002 ,  F21V23/005 ,  F21V23/06 ,  F21W2111/00 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05K1/181 ,  H05K3/301 ,  H05K3/308 ,  H05K3/3421 ,  H05K2201/0311 ,  H05K2201/10106 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757

Abstract: A holder structure for mounting light indicators on printed circuit boards using surface mount technology at a position elevated above the surface of the board is provided with a body member including a top wall, a bottom wall, opposed sidewalls, a front wall, and a rear wall, all being formed integrally together. Two spaced-apart recesses are formed and aligned vertically in the front wall of the body member terminating in respective first and second interior wall portions. The first interior wall portion has openings formed on diametrically opposed sides of a vertical partition and lying in a horizontal plane parallel to the bottom wall. The second interior wall portion has openings formed on diametrically opposed sides of a transverse partition and lying in a plane which is rotated a predetermined number of degrees from a vertical plane perpendicular to the bottom wall.

Abstract translation: 一种用于在印刷电路板上使用表面贴装技术将光指示器安装在高于板表面的位置的支架结构设置有主体部件，主体部件包括顶壁，底壁，相对的侧壁，前壁和后部 墙壁，整体形成在一起。 形成两个间隔开的凹部并且在主体构件的前壁中垂直排列，终止于相应的第一和第二内壁部分。 第一内壁部分具有形成在垂直隔板的直径相对的侧面上并且位于平行于底壁的水平面中的开口。 第二内壁部分具有形成在横向隔板的直径相对侧上的开口，并且位于从垂直于底壁的垂直平面旋转预定数量的平面中。

公开(公告)号：US09546780B2

公开(公告)日：2017-01-17

申请号：US14228356

申请日：2014-03-28

Applicant: AU Optronics Corporation

Inventor： Ming-Ji Hsu

IPC: F21V23/00 ,  H05K1/02 ,  H05K3/34 ,  F21Y101/00

CPC classification number: F21V23/00 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05K1/0296 ,  H05K3/3421 ,  H05K2201/10106 ,  H05K2201/10757

Abstract: A light source module includes a substrate, a circuit, at least one first light source unit, and at least one second light source. The circuit is disposed on the substrate and includes a first signal channel and a second signal channel. The first light source unit is disposed on a bearing surface, wherein the first light source unit has a first A pin and a first B pin having different polarity from the first A pin. The second light source unit is disposed on the bearing surface and is adjacent to the first light source unit, wherein the second light source unit has a second A pin and a second B pin having different polarity from the second A pin, and the second A pin is adjacent to the first A pin of the first light source unit and has a same polarity with the first A pin.

Abstract translation: 光源模块包括基板，电路，至少一个第一光源单元和至少一个第二光源。 电路设置在基板上，并且包括第一信号通道和第二信号通道。 第一光源单元设置在支承表面上，其中第一光源单元具有第一A引脚和与第一A引脚具有不同极性的第一B引脚。 第二光源单元设置在支承表面上并与第一光源单元相邻，其中第二光源单元具有第二A引脚和与第二A引脚具有不同极性的第二B引脚，第二A 引脚与第一光源单元的第一个A引脚相邻，并且与第一个A引脚具有相同的极性。

公开(公告)号：US09480142B2

公开(公告)日：2016-10-25

申请号：US14289401

申请日：2014-05-28

Applicant: YAZAKI CORPORATION

Inventor： Akira Harao ,  Mototatsu Matsunaga ,  Yasuhiro Sugiura ,  Minoru Kubota

IPC: H01R9/00 ,  H05K1/02 ,  H01R12/72 ,  H05K3/36 ,  H05K1/11 ,  H05K3/10 ,  H01L23/498 ,  H05K7/10 ,  H05K1/05 ,  H05K3/20 ,  H05K3/34 ,  H05K1/14

CPC classification number: H05K1/0204 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/48091 ,  H01L2225/1094 ,  H01R12/728 ,  H05K1/0203 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/14 ,  H05K3/10 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1046 ,  H05K2201/09009 ,  H05K2201/09063 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2203/025 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.

Abstract translation: 公开了布线基板及其制造方法，所述布线基板包括具有高导热层的基板，其中所述基板的前表面和后表面中的至少一个是用于各种部件的安装表面; 形成在所述基板中的窗部; 以及从所述窗部的内表面部分延伸并在垂直于所述基板的表面的方向上弯曲的连接端子。

公开(公告)号：US09392702B2

公开(公告)日：2016-07-12

申请号：US14792713

申请日：2015-07-07

Applicant: FUJITSU COMPONENT LIMITED

Inventor： Takeshi Okuyama ,  Toshihiro Kusagaya ,  Tohru Yamakami

IPC: B23K1/00 ,  B23K3/06 ,  H05K3/34 ,  H01R4/02 ,  H01R12/57 ,  H01R12/72 ,  H01R13/6587 ,  H05K1/02

CPC classification number: H05K3/3426 ,  H01R4/028 ,  H01R12/57 ,  H01R12/724 ,  H01R13/6587 ,  H05K1/025 ,  H05K3/3494 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10803 ,  H05K2201/10909 ,  H05K2201/2081 ,  H05K2203/04 ,  Y02P70/613

Abstract: Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead.

Abstract translation: 公开了一种表面安装装置，其安装在基座构件上，包括多个引线单元，所述多个引线单元中的每一个包括：引线，其包括形成在引线端部的主体部分和脚部; 形成在引脚的脚部处的焊料部分朝向基部构件的方向突出以具有顶部部分，以及设置在引线上的防止扩散部分，用于防止焊料沿引线的主体部分扩散。

公开(公告)号：US20160126015A1

公开(公告)日：2016-05-05

申请号：US14877765

申请日：2015-10-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil PARK ,  Seok Kyoon WOO ,  Soon Ju LEE ,  So Yeon SONG

IPC: H01G4/30 ,  H01G4/248 ,  H01G4/012 ,  H01G4/12 ,  H05K1/18 ,  H05K1/11

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/0311 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: A multilayer ceramic component including a multilayer ceramic capacitor including first and second external electrodes disposed on a mounting surface of a ceramic body; and first and second terminal electrodes each including an upper horizontal part disposed on a lower surface of the respective external electrode, a lower horizontal part disposed below the upper horizontal part and spaced apart from the upper horizontal part, and a connecting part connecting the upper horizontal part and the lower horizontal part, the connecting part having a plurality of openings alternately facing opposite end surfaces of the ceramic body.

Abstract translation: 一种多层陶瓷部件，包括：多层陶瓷电容器，包括设置在陶瓷体的安装表面上的第一和第二外部电极; 以及第一和第二端子电极，每个包括设置在各个外部电极的下表面上的上部水平部分，设置在上部水平部分下方并与上部水平部分间隔开的下部水平部分，以及连接上部水平部分 部分和下部水平部分，连接部分具有交替地面对陶瓷体的相对端表面的多个开口。

公开(公告)号：US20150332995A1

公开(公告)日：2015-11-19

申请号：US14278458

申请日：2014-05-15

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Kim-Yong GOH ,  Wing Shenq Wong

IPC: H01L23/498 ,  H01L23/31 ,  H05K1/18

CPC classification number: H05K3/3426 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49555 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/10757 ,  Y02P70/613 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic device may include a surface mount integrated circuit (IC) package to be attached to a printed circuit board (PCB). The surface mount IC package may include at least one IC and an encapsulating material surrounding the at least one IC and having a component receiving cavity defined therein on a bottom surface thereof to be positioned adjacent the PCB. The surface mount IC package may also include electrical leads coupled to the at least one IC and extending outwardly from the encapsulating material to be coupled to the PCB. The electronic device may also include at least one electronic component carried within the component receiving cavity and that includes electrical contacts to be coupled to the PCB.

Abstract translation: 电子设备可以包括要附着到印刷电路板（PCB）的表面贴装集成电路（IC）封装。 表面安装IC封装可以包括至少一个IC和围绕至少一个IC的封装材料，并且在其底表面上具有限定在其中的部件容纳腔，以邻近PCB定位。 表面贴装IC封装还可以包括耦合到至少一个IC并从封装材料向外延伸以耦合到PCB的电引线。 电子设备还可以包括在部件接收腔内承载的至少一个电子部件，并且包括要联接到PCB的电触点。

公开(公告)号：US20150313019A1

公开(公告)日：2015-10-29

申请号：US14650940

申请日：2012-12-11

Applicant: TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)

Inventor： Martin DERMARK

IPC: H05K1/18 ,  H02M1/00

CPC classification number: H05K1/18 ,  H02M1/00 ,  H05K1/141 ,  H05K2201/10166 ,  H05K2201/1034 ,  H05K2201/10757

Abstract: A power module (100) arranged to receive an input voltage and to deliver an output voltage, comprising a supporting layer (110) with first and second main surfaces (111, 109) and a rim (122) surrounding the main surfaces. The power module (100) also comprises at least one component (112, 113, 114, 115) on or in the supporting layer (110) which protrudes a first perpendicular distance (d1) from one of the main surfaces. The power module (100) additionally comprises connectors (116-119; 120-123) for attaching the power module (100) to an external component (10). The one or more connectors (116-119; 120-123) protrude a second distance (d2) from said rim (122) in a perpendicular direction from one of the main surfaces (111, 109), so that the at least one component is at a predefined distance (d4, d5) from the external component (10) when the power module is attached to the external component (10).

Abstract translation: 电源模块（100），被布置成接收输入电压并输送输出电压，所述功率模块包括具有围绕所述主表面的第一和第二主表面（111,109）和边缘（122）的支撑层（110）。 功率模块（100）还包括在支撑层（110）上或支撑层（110）中的从其中一个主表面突出第一垂直距离（d1）的至少一个部件（112,113,114,115）。 功率模块（100）还包括用于将功率模块（100）附接到外部组件（10）的连接器（116-119; 120-123）。 所述一个或多个连接器（116-119; 120-123）从所述主表面（111,109）之一沿垂直方向从所述边缘（122）突出第二距离（d2），使得所述至少一个部件 当电源模块附接到外部组件（10）时，距离外部组件（10）处于预定距离（d4，d5）。