公开(公告)号：US6144571A

公开(公告)日：2000-11-07

申请号：US506269

申请日：2000-02-17

申请人： Yasushi Sasaki ,  Yutaka Maeno ,  Hiroshi Fujii ,  Kinya Nakatsu ,  Toshio Ogawa ,  Akihiro Tamba ,  Kazuji Yamada

发明人： Yasushi Sasaki ,  Yutaka Maeno ,  Hiroshi Fujii ,  Kinya Nakatsu ,  Toshio Ogawa ,  Akihiro Tamba ,  Kazuji Yamada

IPC分类号： H02M7/04 ,  H01L25/16 ,  H02M7/48 ,  H05K1/14 ,  H03M7/00 ,  H01L23/043

CPC分类号： H01L25/165 ,  H01L25/162 ,  H01L2224/45124 ,  H01L2224/48137 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/144

摘要： In order to bring a moduled power converter into less size and cost in the case of a structure having a lead-insert-case, an insulated metal circuit board and a printed circuit board, a difficulty was encountered in thinning a wiring width and an increase in pad area for each metal wire has interfered with a reduction in its size and cost.In the present invention to cope with it, a power converter is constructed by using a semiconductor module having such a structure that a metal base and lead frames are adhered to each other in a state in which an insulating adhesive sheet is interposed therebetween, a resin-molded outer package is adhered to the metal base with an adhesive or the like, and a resin sealing agent is charged into the resin-molded outer package to thereby integrally seal the resin-molded outer package and circuit parts such as semiconductor elements implemented therein, whereby a reduction in size and cost thereof is realized.

摘要翻译： 为了在具有引线插入壳体，绝缘金属电路板和印刷电路板的结构的情况下将模块化的功率转换器带入更小的尺寸和成本，在布线宽度变薄和增加时遇到困难 在每个金属线的焊盘区域中，其尺寸和成本受到干扰。 在本发明中，通过使用具有这样的结构的半导体模块来构成功率转换器，所述半导体模块具有金属基底和引线框架彼此粘合的状态，其间插入有绝缘粘合片，树脂 模塑的外包装用粘合剂等粘合到金属基底上，树脂密封剂装入树脂模塑的外包装中，从而将树脂模塑的外包装和其中实现的半导体元件的电路部件整体密封 从而实现了尺寸和成本的降低。

公开(公告)号：US5661343A

公开(公告)日：1997-08-26

申请号：US405791

申请日：1995-03-16

申请人： Masaaki Takahashi ,  Kazuji Yamada ,  Hideki Miyazaki ,  Kazuo Kato

发明人： Masaaki Takahashi ,  Kazuji Yamada ,  Hideki Miyazaki ,  Kazuo Kato

IPC分类号： H05K1/05 ,  H01L23/14 ,  H01L25/16 ,  H05K1/03 ,  H05K1/14 ,  H05K3/22 ,  H01L23/34

CPC分类号： H05K1/142 ,  H01L23/142 ,  H01L25/16 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/0313 ,  H05K2201/1028 ,  H05K3/0061 ,  H05K3/222

摘要： An input-output wiring for the power circuit and a ground layer are formed on a metal substrate of a power hybrid integrated circuit apparatus. A plurality of windows are opened at predetermined positions of a circuit substrate to which electronic parts such as an IC driver, a chip resistor etc. are connected. Ceramic chips are soldered on the exposed surface of the metal substrate in the windows, and the power semiconductor elements are connected through metal bridges on the ceramic chips. Connection between lower electrode of adjoining power semiconductor elements or between lower part of the power semiconductor element and an input/output wiring is made by means of a part of the metal bridge.

摘要翻译： 用于电力电路和接地层的输入输出布线形成在功率混合集成电路装置的金属基板上。 在电路基板的与IC驱动器，片式电阻等电子部件连接的规定位置开放多个窗口。 陶瓷芯片焊接在窗户的金属基板的露出面上，功率半导体元件通过陶瓷芯片上的金属桥连接。 相邻的功率半导体元件的下电极之间或功率半导体元件的下部与输入/输出布线之间的连接通过金属桥的一部分制成。

公开(公告)号：US5350886A

公开(公告)日：1994-09-27

申请号：US659672

申请日：1991-02-25

申请人： Kunio Miyazaki ,  Yutaka Sugita ,  Akio Mukoh ,  Tadahiko Miyoshi ,  Osamu Miura ,  Akio Takahashi ,  Shunichi Numata ,  Satoru Ogihara ,  Kazuji Yamada ,  Hirokazu Inoue ,  Fumiyuki Kobayashi

发明人： Kunio Miyazaki ,  Yutaka Sugita ,  Akio Mukoh ,  Tadahiko Miyoshi ,  Osamu Miura ,  Akio Takahashi ,  Shunichi Numata ,  Satoru Ogihara ,  Kazuji Yamada ,  Hirokazu Inoue ,  Fumiyuki Kobayashi

IPC分类号： H01L23/538 ,  H05K1/03 ,  H05K3/46 ,  H05K1/00

CPC分类号： H01L23/5385 ,  H05K3/462 ,  H05K3/4629 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0379 ,  H05K2203/061

摘要： An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surface as that of a surface conductive layer of the unit.

摘要翻译： 一种具有多层薄膜布线部分的LSI安装基板，薄膜布线部分被分成多个布线层的布线单元，各单元之间的布线通过与 该单元的表面导电层的那个。

公开(公告)号：US06353258B1

公开(公告)日：2002-03-05

申请号：US09603966

申请日：2000-06-26

申请人： Hirokazu Inoue ,  Ryuichi Saito ,  Mutsuhiro Mori ,  Yasutoshi Kurihara ,  Jin Onuki ,  Shin Kimura ,  Satoshi Shimada ,  Kazuhiro Suzuki ,  Yukio Kamita ,  Isao Kobayashi ,  Kazuji Yamada ,  Naohiro Momma

发明人： Hirokazu Inoue ,  Ryuichi Saito ,  Mutsuhiro Mori ,  Yasutoshi Kurihara ,  Jin Onuki ,  Shin Kimura ,  Satoshi Shimada ,  Kazuhiro Suzuki ,  Yukio Kamita ,  Isao Kobayashi ,  Kazuji Yamada ,  Naohiro Momma

IPC分类号： H01L2334

CPC分类号： H01L23/5386 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/16151 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor module has a plurality of power semiconductor devices mounted on a substrate, and a metal foil for wiring is mounted on the substrate so that an asymmetric unit arrangement of the semiconductor devices is formed. In the device, all of the units are arranged in the same direction on the substrate, and all of the units are electrically connected with electrode terminal feet, and the electrode terminal feet are electrically connected with linkage terminal foot. The electrode terminal feet are disposed with a certain interval.

摘要翻译： 半导体模块具有安装在基板上的多个功率半导体器件，并且用于布线的金属箔安装在基板上，从而形成半导体器件的不对称单元布置。 在该装置中，所有单元在基板上沿相同的方向排列，并且所有单元与电极端子脚电连接，并且电极端子脚与联动端子脚电连接。 电极端子脚以一定间隔设置。

公开(公告)号：US06313598B1

公开(公告)日：2001-11-06

申请号：US09463591

申请日：2000-01-28

申请人： Akihiro Tamba ,  Toshio Ogawa ,  Kazuji Yamada

发明人： Akihiro Tamba ,  Toshio Ogawa ,  Kazuji Yamada

IPC分类号： H01L2504

CPC分类号： H01L25/04 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49575 ,  H01L25/165 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/144 ,  H05K3/202 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A power semiconductor module comprising a power semiconductor element included in a power circuit portion and mounted on a metal base, a first resin molded to the power semiconductor element, a control circuit element disposed on the first resin and included at least in a portion of the control circuit, and a control terminal connected to the power circuit portion and having an exposed portion thereof in the surface of the first resin, in which a portion of the control circuit is connected with the power circuit portion at the exposed portion of the control terminal. Accordingly, a resin mold type power semiconductor module capable of realizing a high performance of the control circuit portion at low cost can be realized.

摘要翻译： 一种功率半导体模块，包括功率电路部分中的功率半导体元件，其安装在金属基底上，模制到功率半导体元件的第一树脂，设置在第一树脂上的控制电路元件，至少包括 控制电路和连接到电源电路部分的控制端子，并且在第一树脂的表面中具有暴露部分，其中控制电路的一部分与控制端子的暴露部分处的电源电路部分连接 。 因此，可以实现能够以低成本实现控制电路部分的高性能的树脂模具型功率半导体模块。

公开(公告)号：US5956231A

公开(公告)日：1999-09-21

申请号：US539075

申请日：1995-10-04

申请人： Kazuji Yamada ,  Akira Tanaka ,  Ryuichi Saito ,  Yasutoshi Kurihara ,  Tadao Kushima ,  Takashi Haramaki ,  Yoshihiko Koike ,  Takashi Hosokawa ,  Mamoru Sawahata ,  Masahiro Koizumi ,  Jin Onuki ,  Kazuhiro Suzuki ,  Isao Kobayashi ,  Hideo Shimizu ,  Yutaka Higashimura ,  Shigeki Sekine ,  Nobuya Koike ,  Hideya Kokubun

发明人： Kazuji Yamada ,  Akira Tanaka ,  Ryuichi Saito ,  Yasutoshi Kurihara ,  Tadao Kushima ,  Takashi Haramaki ,  Yoshihiko Koike ,  Takashi Hosokawa ,  Mamoru Sawahata ,  Masahiro Koizumi ,  Jin Onuki ,  Kazuhiro Suzuki ,  Isao Kobayashi ,  Hideo Shimizu ,  Yutaka Higashimura ,  Shigeki Sekine ,  Nobuya Koike ,  Hideya Kokubun

IPC分类号： H01L23/049 ,  H01L23/495 ,  H01L25/065 ,  H02M7/00 ,  H05K7/02 ,  H05K7/04

CPC分类号： H01L23/49562 ,  H01L23/049 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/18 ,  H02M7/003 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/49431 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/2076 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351

摘要： A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base, the upper surface of the heat dissipating base being covered with a member for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements being arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.

摘要翻译： 一种半导体器件，其中多个半导体元件被结合到绝缘体衬底上的至少一个电极图案上，所述绝缘体衬底在主表面上形成多个电极图案，所述半导体元件的每个电极电连接到所述电极图案， 绝缘体基板的另一表面被结合到散热基底上，散热基座的上表面覆盖有用于从外部环境切断半导体元件的构件，将绝缘体基板上的电极与电极电连接的端子 设置在切断部件外侧，散热基体的材料的线膨胀系数大于半导体元件的线膨胀系数，小于半导体元件的线膨胀系数的3倍，导热系数 大于100 W / mK，半音 电感元件布置在至少一个电极表面上，并且在至少两个区域中被绝缘体基底上的另一个电极表面分隔。

公开(公告)号：US5920119A

公开(公告)日：1999-07-06

申请号：US802988

申请日：1997-02-21

申请人： Akihiro Tamba ,  Kazuji Yamada ,  Ruichi Saito ,  Tatsuya Shigemura ,  Yukio Sonobe ,  Masataka Sasaki ,  Kazuhiro Suzuki

发明人： Akihiro Tamba ,  Kazuji Yamada ,  Ruichi Saito ,  Tatsuya Shigemura ,  Yukio Sonobe ,  Masataka Sasaki ,  Kazuhiro Suzuki

IPC分类号： H01L25/07 ,  H01L25/18 ,  H01L23/12 ,  H01L23/08 ,  H01L23/48

CPC分类号： H01L25/18 ,  H01L25/072 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L24/45 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19107 ,  H01L2924/30107

摘要： A power semiconductor module having a power circuit unit; a metal base for sealing the bottom of the module; an insulation substrate for electrically insulating the metal base from the power circuit unit; external input and output terminals connected to the power circuit unit; a resin case in which the external input and output terminals are inserted by integral molding; and a resin encapsulant material has been improved substantially in its reliability through provision of a nut integrally molded with the resin case for fastening the external input and output terminals with a screw; a metal base inserted in the resin case by integral molding; and a recess to receive the end of the screw located immediately below the nut, the recess extending without penetrating the resin case, and the metal base extending to an area below the recess.

摘要翻译： 一种功率半导体模块，具有电源电路单元; 用于密封模块底部的金属底座; 用于将金属基底与电力电路单元电绝缘的绝缘基板; 连接到电源电路单元的外部输入和输出端子; 其中通过一体成型插入外部输入和输出端子的树脂壳体; 树脂密封剂材料的可靠性大大提高，通过设置与树脂壳体一体模制的螺母，用螺钉固定外部输入和输出端子; 通过一体成型插入树脂壳体中的金属基座; 以及凹部，用于接收位于螺母正下方的螺钉的端部，所述凹部延伸而不穿透树脂壳体，并且金属基部延伸到凹部下方的区域。

公开(公告)号：US5177670A

公开(公告)日：1993-01-05

申请号：US832332

申请日：1992-02-07

申请人： Hiroichi Shinohara ,  Hirokazu Inoue ,  Yoichi Abe ,  Akira Kato ,  Hideo Suzuki ,  Kazuji Yamada ,  Masaaki Takahashi ,  Keiichirou Nakanishi

发明人： Hiroichi Shinohara ,  Hirokazu Inoue ,  Yoichi Abe ,  Akira Kato ,  Hideo Suzuki ,  Kazuji Yamada ,  Masaaki Takahashi ,  Keiichirou Nakanishi

IPC分类号： H01L23/36 ,  H01L23/467 ,  H01L23/48 ,  H01L23/498 ,  H01L23/64

CPC分类号： H01L24/73 ,  H01L23/36 ,  H01L23/467 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/642 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10S257/924

摘要： Noise generated at high frequencies at the time of simultaneous switchings of logical circuits is reduced by lowering an inductance from LSI to a capacitor formed on a substrate. The capacitor is formed to ensure that an inductance from a bonding pad for the LSI loaded on the substrate to an electrode of the capacitor is 0.05 nanohenry. The lower inductance from the LSI to the capacitor allows a reduction in the amount of the noise at high frequencies among those generated in power supply system, whereby the rising time of signals is made shorter, and the speed of arithmetic operation can be increased.

摘要翻译： 通过降低从LSI到形成在基板上的电容器的电感，可以降低在同时切换逻辑电路时在高频时产生的噪声。 形成电容器以确保来自负载在基板上的LSI的焊盘与电容器的电极的电感为0.05纳秒。 从LSI到电容器的较低的电感允许在电源系统中产生的那些电路中的高频噪声量的减少，从而使信号的上升时间更短，并且可以提高算术运算速度。

公开(公告)号：US4908695A

公开(公告)日：1990-03-13

申请号：US178650

申请日：1988-04-07

申请人： Atsushi Morihara ,  Yoshio Naganuma ,  Shuntaro Koyama ,  Kazuji Yamada ,  Tasao Soga ,  Hideo Arakawa ,  Shunsuke Nogita ,  Yukio Hishinuma

发明人： Atsushi Morihara ,  Yoshio Naganuma ,  Shuntaro Koyama ,  Kazuji Yamada ,  Tasao Soga ,  Hideo Arakawa ,  Shunsuke Nogita ,  Yukio Hishinuma

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4338 ,  H01L2224/16

摘要： A heat conducting member is placed in the space between a semiconductor chip which generates heat and a heat transfer block which is cooled by a coolant, and the heat conducting member conducts heat from the semiconductor chip to the heat transfer block. The heat conducting member has a slanted surface which is inclined with respect to a surface to be cooled of the corresponding semiconductor chip. Even when the semiconductor chip is displaced or inclined with respect to the heat transfer block, the whole of the cooling surface of the semiconductor chip can be kept in contact with the corresponding heat conducting member.

公开(公告)号：US4906823A

公开(公告)日：1990-03-06

申请号：US202027

申请日：1988-06-03

申请人： Tadao Kushima ,  Tasao Soga ,  Kazuji Yamada ,  Mitugu Shirai

发明人： Tadao Kushima ,  Tasao Soga ,  Kazuji Yamada ,  Mitugu Shirai

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/49827 ,  H05K3/3478 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/19042 ,  H05K2201/09827 ,  H05K2201/10734 ,  H05K2201/2081 ,  H05K2203/0113 ,  H05K2203/0143 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/0405 ,  H05K2203/043 ,  Y10T29/49218

摘要： The invention relates to a solder carrier comprising a sheet of self-support type, made of a material which does not react to a solder when it is melted, a plurality of small through holes, and solder filling the through holes, each of the small through holes having an end, the area of which is larger than that of the other end. By using this solder carrier, a semiconductor device can be flip-chip-connected to a carrier substrate through a bump method, and solder balls can be formed for connecting the carrier substrate to a multilayer circuit board. The through holes of the solder carrier, each of which holes is to be filled with solder, is formed by etching, and the solder is inserted in the holes under pressure by a roll or the like.

摘要翻译： 本发明涉及一种焊料载体，它包括一种自支撑型材料，它由熔化时不与焊料反应的材料制成，多个小通孔和填充通孔的焊料，每个小型 具有端部的通孔，其面积大于另一端的面积。 通过使用该焊料载体，可以通过凸块法将半导体器件倒装芯片连接到载体基板，并且可以形成用于将载体基板连接到多层电路板的焊球。 通过蚀刻形成每个要填充有焊料的孔的焊料载体的通孔，并且通过辊等将焊料插入孔中。