公开(公告)号：US20010050843A1

公开(公告)日：2001-12-13

申请号：US09919834

申请日：2001-08-02

Applicant: PIONEER CORPORATION

Inventor： Hitoshi Ueno ,  Shigeru Yoshida

IPC: H05K007/20

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/10416 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A heating element (IC, transistor or the like) is placed on a printed circuit board and silicon grease is coated on the surface of the printed circuit board side of the heating element. The projection portion of a radiator with a step portion is inserted into the through hole of the printed circuit board and closely contacted with the lower portion of the heating element through the silicon grease. As a result, heat generated from the heating element is transferred to the projection portion of the radiator through the silicon grease and then transferred to the entirety of the radiator. Excessive silicon grease is collected in a step portion provided at the base of the projection portion of the radiator and prevented from leaking to other portion such as a portion on the board.

Abstract translation: 将加热元件（IC，晶体管等）放置在印刷电路板上，并且在加热元件的印刷电路板侧的表面上涂覆硅脂。 具有阶梯部分的散热器的突出部分插入印刷电路板的通孔中，并通过硅油脂与加热元件的下部紧密接触。 结果，从加热元件产生的热量通过硅脂转移到散热器的突出部分，然后转移到整个散热器。 过多的硅脂被收集在设置在散热器的突出部分的底部的阶梯部分中，并且防止其泄漏到诸如板上的其它部分。

公开(公告)号：US06316737B1

公开(公告)日：2001-11-13

申请号：US09393952

申请日：1999-09-09

Applicant: Michael D. Evans ,  James D. Goss ,  Jeffrey A. Curhan ,  Patrizio Vinciarelli

Inventor： Michael D. Evans ,  James D. Goss ,  Jeffrey A. Curhan ,  Patrizio Vinciarelli

IPC: H05K116

CPC classification number: H05K1/111 ,  H01L2224/48091 ,  H01L2924/01079 ,  H05K1/0306 ,  H05K1/182 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0179 ,  H05K2201/09572 ,  H05K2201/09745 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

Abstract: In general, in one aspect, the invention features a connection between a through-hole in a circuit board and a contact region on a component. The contact region has a surface bearing a depression. A continuous solder column has one end of that forms a solder joint with an inner wall of the through-hole and the other end of that forms a solder joint with the contact region.

Abstract translation: 通常，一方面，本发明的特征在于电路板中的通孔与部件上的接触区域之间的连接。 接触区域具有带凹陷的表面。 连续的焊料柱的一端与通孔的内壁形成焊接点，另一端与接触区域形成焊接点。

公开(公告)号：US06262878B1

公开(公告)日：2001-07-17

申请号：US09594369

申请日：2000-06-15

Applicant: Michihiro Shirashige ,  Hidemasa Ichiki ,  Koichi Baba ,  Kazuto Okada ,  Takayoshi Oka

Inventor： Michihiro Shirashige ,  Hidemasa Ichiki ,  Koichi Baba ,  Kazuto Okada ,  Takayoshi Oka

IPC: H01G904

CPC classification number: H01G9/012 ,  H05K3/3442 ,  H05K2201/09745 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A capacitor element has on its outer surface a cathode layer with a flat bottom surface, and also a tantalum lead extending outward from its one end. One of opposing major surfaces of a flat cathode terminal is located beneath and in parallel with the bottom surface of the cathode layer. They are electrically connected with each other. One of opposing major surfaces of a flat anode terminal is located substantially in the same plane as the one major surface of the cathode terminal and is electrically connected to the tantalum lead of the capacitor element. The capacitor element, the anode terminal and the cathode terminal are encapsulated with portions of the other major surfaces of the cathode and anode terminals left exposed.

Abstract translation: 电容器元件的外表面具有平坦的底表面的阴极层，以及从其一端向外延伸的钽引线。 平面阴极端子的相对的主表面之一位于阴极层的底表面下方并与阴极层的底表面平行。 它们彼此电连接。 平面阳极端子的相对的主表面之一基本上位于与阴极端子的一个主表面相同的平面中，并且电连接到电容器元件的钽引线。 电容器元件，阳极端子和阴极端子被阴极和阳极端子的另一个主表面的部分露出而封装。

公开(公告)号：US06225572B1

公开(公告)日：2001-05-01

申请号：US09403966

申请日：1999-11-01

Applicant: Jean Marc Nicolaï ,  Marc Duarte

Inventor： Jean Marc Nicolaï ,  Marc Duarte

IPC: H05K116

CPC classification number: H05K3/3447 ,  H01R9/16 ,  H01R12/58 ,  H05K3/0061 ,  H05K3/44 ,  H05K2201/0382 ,  H05K2201/09554 ,  H05K2201/09745 ,  H05K2201/10401

Abstract: An assembly including a printed-circuit electronics card mounted on a metal substrate, and in electronic communication with the same, includes a capsule which is crimped into a cavity in the metal substrate and which extends through a hole in the electronics card, the edges of said hole being metallised, the capsule being soldered to the metallised area of the edges.

Abstract translation: 包括安装在金属基板上并与其电子连通的印刷电路电子卡的组件包括：胶囊，其被压接在金属基板中的空腔中并延伸穿过电子卡的孔， 所述孔被金属化，所述胶囊被焊接到边缘的金属化区域。

公开(公告)号：US6046918A

公开(公告)日：2000-04-04

申请号：US310626

申请日：1999-05-12

Applicant: Ionel Jitaru

Inventor： Ionel Jitaru

IPC: H01F27/06 ,  H05K1/02 ,  H05K1/05 ,  H05K1/16 ,  H05K7/20 ,  H02M5/42

CPC classification number: H05K1/165 ,  H01F27/06 ,  H05K1/0206 ,  H05K7/209 ,  H05K1/0203 ,  H05K1/05 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09572 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K3/0061 ,  Y10T29/49165

Abstract: A transformer group in which a multitude of transformers are used to supply energy to a single load. The transformers are connected in series; in order to assist in providing a "flux equalizing" affect, the invention includes a flux equalizer circuit. The flux equalizer circuit provides a series of flux windings. Each flux winding is associated with a single transformer. The windings are arranged in parallel. In this manner, a balancing of the output of the transformers is obtained; the power output from each transformer is "sensed" by its associated flux winding which is "shared" with the other transformers via their own associated flux winding. Power is process then through the secondary windings, rectifiers, and output filters to a common load.

公开(公告)号：US5877559A

公开(公告)日：1999-03-02

申请号：US689234

申请日：1996-08-06

Applicant: Yoshinari Takayama ,  Kazuo Ouchi ,  Atsushi Hino

Inventor： Yoshinari Takayama ,  Kazuo Ouchi ,  Atsushi Hino

IPC: H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H01L23/48

CPC classification number: H05K3/4007 ,  H01L23/49811 ,  H01L23/4985 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/09745 ,  H05K2203/0369 ,  H05K2203/095 ,  H05K2203/1572 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/423

Abstract: In a film carrier with a conductive circuit formed, an opening is formed in a particular position relative to where the conductive path is to be formed. The opening is a through-hole, filled with a conductive material to form a conductive path. The conductive circuit has a concave face, provided according to certain formulae. The film carrier can cope with a fine-pitched and highly dense mounting, while prohibiting pulling out of the conductive path by an external force. The film carrier does not suffer from fallout of the conductive path, and has increased electrical connection reliability.

Abstract translation: 在形成有导电电路的薄膜载体中，相对于要形成导电路径的特定位置形成开口。 开口是通孔，填充有导电材料以形成导电路径。 导电电路具有根据某些公式提供的凹面。 薄膜载体可以处理细调和高度密集的安装，同时禁止通过外力从导电路径拉出。 电影载体不会受到导电路径的影响，并且具有增加的电连接可靠性。

公开(公告)号：US5828128A

公开(公告)日：1998-10-27

申请号：US604429

申请日：1996-02-21

Applicant: Yutaka Higashiguchi ,  Toshio Kumai ,  Yasuhiro Teshima ,  Mamoru Niishiro ,  Yasushi Kobayashi ,  Yukio Sekiya ,  Shuzo Igarashi ,  Yasuhiro Ichihara

Inventor： Yutaka Higashiguchi ,  Toshio Kumai ,  Yasuhiro Teshima ,  Mamoru Niishiro ,  Yasushi Kobayashi ,  Yukio Sekiya ,  Shuzo Igarashi ,  Yasuhiro Ichihara

IPC: H01L23/12 ,  G01R31/04 ,  H01L21/60 ,  H01L21/66 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  G01R31/046 ,  H01L22/12 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1403 ,  H01L2924/01322 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/116 ,  H05K2201/0367 ,  H05K2201/094 ,  H05K2201/09745 ,  H05K2201/10666 ,  H05K2203/0455 ,  H05K2203/0465 ,  H05K2203/162 ,  H05K3/3431 ,  Y02P70/613

Abstract: A BGA-type semiconductor device has a soldering bump a soldered state of which can be easily checked by visual inspection. A package has a bottom surface which faces the wiring board when the semiconductor device is mounted on the wiring board. A plurality of soldering bumps are provided on the bottom surface of the package. The soldering bumps are in a plurality of different sizes, and are located in positions where the soldering bumps are observable from outside of the package when the semiconductor device is mounted on the wiring board.

Abstract translation: BGA型半导体器件具有焊接凸块，其焊接状态可以通过目视检查容易地检查。 当半导体器件安装在布线板上时，封装具有面向布线板的底表面。 多个焊接凸块设置在封装的底表面上。 焊接凸块具有多个不同的尺寸，并且当将半导体器件安装在布线板上时，位于从封装外部观察焊接凸块的位置。

公开(公告)号：US5532186A

公开(公告)日：1996-07-02

申请号：US319486

申请日：1994-10-07

Applicant: Yasushi Kobayashi

Inventor： Yasushi Kobayashi

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H05K3/34 ,  H05K3/36 ,  H01L21/71

CPC classification number: H01L21/4853 ,  H01L23/49816 ,  H05K3/3426 ,  H01L2924/0002 ,  H05K2201/09745 ,  H05K2201/10681 ,  H05K2201/10984 ,  H05K2203/041 ,  H05K2203/043 ,  H05K3/3484 ,  H05K3/363 ,  Y02P70/613 ,  Y10T29/49121

Abstract: A manufacturing method for a TAB tape which forms a plurality of bumps on a plurality of sheet-like leads of the TAB tape. First, the leads are fixed to a belt-shaped tape member having a plurality of first openings arranged at equal intervals in a longitudinal direction and a plurality of second openings formed around each of the first openings. In fixing each lead to the tape member, one end portion of the lead is exposed to each first opening, and the other end portion of the lead is exposed to each second opening. Secondly, a point is pressed onto a surface of each lead to form a plurality of recesses on the surface of each lead. Thirdly, a metal ball is seated in each recess, and is then heated to be molten so that a part of the metal ball may substantially semispherically project from the surface of the lead. Thus, a metal bump is formed as a substantially semispherical part projecting from the surface of each lead. Instead of the use of the metal ball, a mixture of a metal powder and a paste may be filled in each recess. In this case, the mixture filled in each recess is heated to be molten so that a part of the mixture may substantially semispherically project from the surface of each lead, thus forming the metal bumps on the surface of each lead.

Abstract translation: 一种在TAB带的多个片状引线上形成多个凸块的TAB带的制造方法。 首先，将引线固定在带状带状部件上，该带状部件具有沿纵向相等间隔排列的多个第一开口和围绕每个第一开口形成的多个第二开口。 在将每个引线固定到带构件上时，引线的一个端部暴露于每个第一开口，并且引线的另一端部暴露于每个第二开口。 其次，将点压在每个引线的表面上，以在每个引线的表面上形成多个凹槽。 第三，将金属球放置在每个凹槽中，然后被加热熔化，使得金属球的一部分可以从铅的表面基本上半径地突出。 因此，金属凸块形成为从每个引线的表面突出的大致半球形部分。 代替使用金属球，可以在每个凹部中填充金属粉末和糊料的混合物。 在这种情况下，填充在每个凹部中的混合物被加热熔化，使得该混合物的一部分可以从每个引线的表面基本上半径地突出，从而在每个引线的表面上形成金属凸块。

公开(公告)号：US5464662A

公开(公告)日：1995-11-07

申请号：US300131

申请日：1994-09-02

Applicant: Tomoo Murakami ,  Takanori Tsunoda

Inventor： Tomoo Murakami ,  Takanori Tsunoda

IPC: H05K3/24 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/28 ,  H05K3/38 ,  B05D5/12

CPC classification number: H05K3/0094 ,  H05K1/111 ,  H05K3/28 ,  H05K2201/09745 ,  H05K2201/09881 ,  H05K2203/0353 ,  H05K2203/0369 ,  H05K2203/0508 ,  H05K2203/0574 ,  H05K2203/0759 ,  H05K2203/1394 ,  H05K3/0082 ,  H05K3/061 ,  H05K3/383 ,  Y02P70/611

Abstract: A fabrication method of a printed wiring board in which the halation effect of light irradiated to a solder resist film is utilized in a process of selectively removing the solder resist film. After a conductive layer is patterned to a given circuit pattern including soldering pads, the solder resist film is formed on the base material to cover the patterned conductive layer. The solder resist film is selectively exposed to light utilizing reflection of the irradiated light from the insulating base material and developed so that the solder resist film is selectively left in areas adjacent to the respective soldering pads. Then, an etching resist film is formed to cover the patterned conductive layer except for the soldering pads, and surface areas of the respective soldering pads are selectively etched using the etching resist film as a mask to produce solder resist dams made of the solder resist film left on the base material. Solder films are formed on the respective soldering pads thus selectively etched. Electronic components can be soldered on the soldering pads with satisfactory reliability even if the soldering pads have narrow pitches such as 500 .mu.m or less.

Abstract translation: 在选择性去除阻焊膜的工序中，利用照射到阻焊膜的光的晕影效果的印刷电路板的制造方法。 在将导电层图案化为包括焊盘的给定电路图案之后，在基底材料上形成阻焊膜以覆盖图案化的导电层。 利用来自绝缘基材的照射光的反射来选择性地将阻焊膜暴露于光，并显影，使得阻焊膜选择性地留在与各个焊盘相邻的区域中。 然后，形成抗蚀剂膜以覆盖除了焊盘之外的图案化导电层，并且使用抗蚀剂膜作为掩模来选择性地蚀刻各个焊盘的表面积，以形成由阻焊膜制成的阻焊堤 留在基材上。 在相应的焊盘上形成焊接膜，从而选择性地蚀刻。 即使焊盘具有500μm以下的窄间距，也可以将电子部件焊接在焊盘上，其可靠性良好。

公开(公告)号：US5245509A

公开(公告)日：1993-09-14

申请号：US929532

申请日：1992-08-14

Applicant: Georg Seitz

Inventor： Georg Seitz

IPC: H01R12/71 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K3/34 ,  H05K5/02 ,  H05K7/20

CPC classification number: H05K1/189 ,  H01R12/716 ,  H05K1/0271 ,  H05K3/3421 ,  H05K1/111 ,  H05K1/118 ,  H05K2201/09109 ,  H05K2201/09745 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/2009 ,  H05K3/0061 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: The invention relates to a printed circuit board disposed on a film serving as the carrier material. A connector strip having a large number of connection pins is disposed on the printed circuit board using surface-mounting technology. Connector strips of this type are widespread in digital technology. In the case of circuits in the fields of power electronics or motor vehicle electronics, connector strips cannot be surface-mounted because of the larger cross-sections of the connections. In a printed circuit board of the type mentioned at the outset, recesses are provided in the film stiffener underneath the solder points, such that when the connection pins of the connector strip are soldered, level differences in the connection pins are compensated by the deformation of the carrier film. With this measure, tensions are compensated for the most part by the deformation of the carrier film, so that connector strips for power electronics and motor vehicle electronics applications can also be surface-mounted.

Abstract translation: 本发明涉及一种布置在作为载体材料的薄膜上的印刷电路板。 具有大量连接引脚的连接器条使用表面安装技术设置在印刷电路板上。 这种类型的连接器条在数字技术中普遍存在。 在电力电子或机动车辆电子领域的电路的情况下，由于连接的较大横截面，连接器条不能被表面安装。 在一开始所述类型的印刷电路板中，在焊接点下方的薄膜加强件中设置有凹槽，使得当连接器条的连接销被焊接时，连接销的电平差由 载体膜。 通过这种措施，大部分通过载体膜的变形来补偿张力，使得用于电力电子和机动车辆电子应用的连接器条也可以被表面安装。