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公开(公告)号:US10594309B2
公开(公告)日:2020-03-17
申请号:US16025148
申请日:2018-07-02
Applicant: Intel Corporation
Inventor: Abhishek Agrawal , Stefano Pellerano , Yanjie Wang , Peter Sagazio
Abstract: In a phase modulation method enable signals may be sequentially generating based on a clock signal to generate a sequence of enable signals, and a signal is delayed by delay values generated from delay cells based on the sequence of enable signals and digital bit values. A phase modulator may include a first delay circuit configured to: delay a clock signal based on a first delay value to generate a first delayed clock signal, and delay a carrier signal based on the first delayed clock signal to generate a first delayed carrier signal; and a second delay circuit configured to: delay the first delayed clock signal based on a second delay value to generate a second delayed clock signal, and delay the first delayed carrier signal based on the second delayed clock signal to generate a second delayed carrier signal.
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公开(公告)号:US20190267692A1
公开(公告)日:2019-08-29
申请号:US16320203
申请日:2016-08-15
Applicant: Intel Corporation
Inventor: Jeanette M. Roberts , Ravi Pillarisetty , David J. Michalak , Zachary R. Yoscovits , James S. Clarke , Stefano Pellerano
Abstract: Described herein are new transmission line structures for use as resonators and non-resonant interconnects in quantum circuits. In one aspect of the present disclosure, a proposed structure includes a substrate, a ground plane disposed over the substrate, a dielectric layer disposed over the ground plane, and a conductor strip disposed over the dielectric layer. In another aspect, a proposed structure includes a substrate, a lower ground plane disposed over the substrate, a lower dielectric layer disposed over the lower ground plane, a conductor strip disposed over the lower dielectric layer, an upper dielectric layer disposed over the conductor strip, and an upper ground plane disposed over the upper dielectric layer. Transmission line structures as proposed herein could be used for providing microwave connectivity to, from, or/and between the qubits, or to set the frequencies that address individual qubits. Methods for fabricating such structures are disclosed as well.
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33.
公开(公告)号:US20170264250A1
公开(公告)日:2017-09-14
申请号:US15068179
申请日:2016-03-11
Applicant: Intel Corporation
Inventor: Jong Seok Park , Yanjie J. Wang , Stefano Pellerano , Christopher D. Hull
CPC classification number: H03F1/3205 , H03F1/0261 , H03F1/0277 , H03F1/223 , H03F1/565 , H03F3/189 , H03F3/193 , H03F3/211 , H03F3/24 , H03F3/245 , H03F3/45188 , H03F3/68 , H03F3/72 , H03F2200/111 , H03F2200/162 , H03F2200/18 , H03F2200/387 , H03F2200/423 , H03F2200/429 , H03F2200/451 , H03F2200/541 , H03F2201/3203 , H03F2203/21139 , H03F2203/21142 , H03F2203/21178 , H03F2203/7206 , H03F2203/7209 , H03F2203/7236 , H04B1/04 , H04B2001/0408 , H04L27/34
Abstract: A communication device includes a power amplifier that generates power signals according to one or more operating bands of communication data, with the amplitude being driven and generated in output stages of the power amplifier. The final stage can include an output passive network that suppresses suppress an amplitude modulation-to-phase modulation (AM-PM) distortion. During a back-off power mode a bias of a capacitive unit of the output power network component can be adjusted to minimize an overall capacitance variation. A output passive network can further generate a flat-phase response between dual resonances of operation.
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公开(公告)号:US20170187405A1
公开(公告)日:2017-06-29
申请号:US14998107
申请日:2015-12-23
Applicant: Intel Corporation
Inventor: Shreyas Sen , Ritesh Bhat , Yanjie Wang , Stefano Pellerano , Christopher Hull , Farhana Sheikh
CPC classification number: H04B1/1027 , H04B1/16 , H04L27/14 , H04W52/0209 , H04W52/0229 , H04W52/0238 , H04W52/0245 , H04W88/06 , Y02D70/1262 , Y02D70/142 , Y02D70/144
Abstract: A receiver system includes a blocker detector circuit configured to receive a radio frequency (RF) input signal and detect an existence of a blocker therein, and further configured to output a blocker detection signal indicative of the existence of the blocker. The receiver system further includes a configurable receiver circuit configured to receive the RF input signal and the blocker detection signal, and selectively configure the configurable receiver circuit between a first mode wherein the configurable receiver circuit exhibits first linearity characteristics, and a second mode wherein the configurable receiver circuit exhibits second, different linearity characteristics based on the blocker detection signal.
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公开(公告)号:US09209958B1
公开(公告)日:2015-12-08
申请号:US14318799
申请日:2014-06-30
Applicant: Intel Corporation
Inventor: Georgios Palaskas , Paolo Madoglio , Stefano Pellerano , Ashoke Ravi , Kailash Chandrashekar
CPC classification number: H04L7/0004 , G04F10/005 , H04B17/14 , H04B17/21 , H04L7/0087
Abstract: This application discusses, among other things, calibration systems for ameliorating nonlinearity of a digital-to-time converter (DTC). In an example, a calibration system can include a calibration path configured to represent a segment of the DTC, a time-to-digital circuit configured to receive an output of the calibration path and the processed frequency information and to provide timing error information of the segment, and a calibration engine configured to receive controller modulation information from a main controller, to provide calibration modulation information to the DTC, to receive the timing error information, and to provide compensation information to a correction circuit coupled to the DTC using the timing error information.
Abstract translation: 该应用程序除其他外还讨论了用于改善数字 - 时间转换器(DTC)的非线性的校准系统。 在一个示例中,校准系统可以包括被配置为表示DTC的段的校准路径,配置成接收校准路径的输出和经处理的频率信息的时间到数字电路,并且提供定时误差信息 并且校准引擎被配置为从主控制器接收控制器调制信息,以向DTC提供校准调制信息以接收定时误差信息,并且使用定时误差向耦合到DTC的校正电路提供补偿信息 信息。
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公开(公告)号:US12212351B2
公开(公告)日:2025-01-28
申请号:US17131872
申请日:2020-12-23
Applicant: Intel Corporation
Inventor: Abhishek Agrawal , Ritesh A. Bhat , Steven Callender , Brent R. Carlton , Christopher D. Hull , Stefano Pellerano , Mustafijur Rahman , Peter Sagazio , Woorim Shin
IPC: H04B1/04
Abstract: Various aspects provide a transceiver and a communication device including the transceiver. In an example, the transceiver includes an amplifier circuit including an amplifier stage with an adjustable degeneration component, the amplifier stage configured to amplify a received input signal with an adjustable gain, an adjustable feedback component coupled to the amplifier stage; and a controller coupled to the amplifier stage and to the adjustable feedback component and configured to adjust the adjustable feedback component based on an adjustment of the adjustable degeneration component.
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公开(公告)号:US20240243477A1
公开(公告)日:2024-07-18
申请号:US18442331
申请日:2024-02-15
Applicant: Intel Corporation
Inventor: Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Marian Verhelst , Yossi Tsfati , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC: H01Q9/04 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q5/47 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
CPC classification number: H01Q9/0414 , H01Q1/243 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q5/47 , H01Q21/24 , H03L7/145 , H04B1/3827 , H04B7/0482 , H04B7/0639 , H04B15/04
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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公开(公告)号:US11916604B2
公开(公告)日:2024-02-27
申请号:US16893660
申请日:2020-06-05
Applicant: Intel Corporation
Inventor: Diego Correas-Serrano , Georgios Dogiamis , Henning Braunisch , Neelam Prabhu Gaunkar , Telesphor Kamgaing , Thomas W. Brown , Stefano Pellerano
Abstract: Embodiments may relate to a communications module comprising with a dispersion compensation module communicatively coupled between a baseband module and a radio frequency (RF) module. The dispersion compensation module may be configured to process a data signal at an intermediate frequency that is between a baseband frequency and a RF frequency. Other embodiments may be described or claimed.
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公开(公告)号:US20230320237A1
公开(公告)日:2023-10-05
申请号:US17695584
申请日:2022-03-15
Applicant: Intel Corporation
Inventor: Bishnu Prasad Patra , Stefano Pellerano , JongSeok Park
CPC classification number: H01L27/18 , H01L39/221 , H01L39/228 , H01L39/24 , H03H11/28
Abstract: Technologies for scalable spin qubit readout are disclosed. In the illustrative embodiment, superconducting and semiconducting components are integrated onto a single chip, allowing for frequency and temporal multiplexing components to be integrated onto the same die. The semiconducting components on the die can include transistors, varactors, and amplifiers, and the superconducting components can include an inductor and a capacitor that form part of an impedance matching network.
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公开(公告)号:US20230210023A1
公开(公告)日:2023-06-29
申请号:US17561439
申请日:2021-12-23
Applicant: Intel Corporation
Inventor: Hubert C. George , Ravi Pillarisetty , JongSeok Park , Stefano Pellerano , Lester F. Lampert , Thomas F. Watson , Florian Luthi , James S. Clarke
IPC: H01L27/18 , H01L39/22 , H03H7/38 , H01P3/00 , H01L39/24 , H01L39/04 , G06N10/80 , H01L23/00 , H05K1/18
CPC classification number: H01L27/18 , H01L39/228 , H03H7/38 , H01P3/003 , H01L39/24 , H01L39/04 , H01L39/221 , G06N10/80 , H01L24/48 , H01L24/45 , H01L2224/49171 , H01L2224/45144 , H05K2201/10045 , H01L2924/0495 , H01L2224/48225 , H01L2224/45186 , H05K2201/10522 , H05K1/18 , H01L2224/45147 , H01L2224/48153
Abstract: Technologies for radiofrequency optimized interconnects for a quantum processor are disclosed. In the illustrative embodiment, signals are carried in coplanar waveguides on a surface of a quantum processor die. A ground ring surrounds the signals and is connected to the ground conductors of each coplanar waveguide. Wire bonds connect the ground ring to a ground of a circuit board. The wire bonds provide both an electrical connection from the quantum processor die to the circuit board as well as increased thermal coupling between the quantum processor die and the circuit board, increasing cooling of the quantum processor die.
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