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    Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby
    32.
    发明申请
    Methods of Forming Printable Integrated Circuit Devices and Devices Formed Thereby 有权
    形成可印刷的集成电路器件和器件的方法

    公开(公告)号：US20100248484A1

    公开(公告)日：2010-09-30

    申请号：US12732868

    申请日：2010-03-26

    申请人： Christopher Bower ,  Etienne Menard ,  Matthew Meitl

    发明人： Christopher Bower ,  Etienne Menard ,  Matthew Meitl

    IPC分类号： H01L21/302

    CPC分类号： H01L27/1266 ,  H01L21/3065 ,  H01L21/32055 ,  H01L21/76834 ,  H01L21/76877 ,  H01L21/84 ,  H01L27/1214 ,  H01L27/1222 ,  H01L27/124 ,  H01L27/1248 ,  H01L29/78666

    摘要： Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. A step is performed to selectively etch through the semiconductor active layer and the sacrificial layer in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. A step can be performed to selectively etch through the capping layer and the first portion of the semiconductor active layer to thereby expose the sacrificial layer. The sacrificial layer may be selectively removed from between the first portion of the semiconductor active layer and the handling substrate to thereby define a suspended integrated circuit chip encapsulated by the capping layer.

    摘要翻译： 形成集成电路器件的方法包括在处理衬底上形成牺牲层并在牺牲层上形成半导体活性层。 执行步骤以依次选择性地蚀刻半导体有源层和牺牲层以限定绝缘体上半导体（SOI）衬底，其包括半导体有源层的第一部分。 可以在SOI衬底上形成多层电互连网络。 该多层电互连网络可以由与半导体有源层的第一部分的上表面接触的无机覆盖层封装。 可以执行步骤以选择性地蚀刻通过覆盖层和半导体有源层的第一部分，从而暴露牺牲层。 可以从半导体有源层的第一部分和处理衬底之间选择性地去除牺牲层，从而限定由封盖层封装的悬浮集成电路芯片。

    STRUCTURES AND METHODS FOR TESTING PRINTABLE INTEGRATED CIRCUITS
    34.
    发明申请
    STRUCTURES AND METHODS FOR TESTING PRINTABLE INTEGRATED CIRCUITS 有权
    用于测试可打印集成电路的结构和方法

    公开(公告)号：US20130221355A1

    公开(公告)日：2013-08-29

    申请号：US13818901

    申请日：2011-08-24

    申请人： Christopher Bower ,  Etienne Menard ,  Matthew Meitl

    发明人： Christopher Bower ,  Etienne Menard ,  Matthew Meitl

    IPC分类号： H01L21/66 ,  G01R31/26 ,  H01L21/308

    CPC分类号： H01L33/62 ,  G01R31/26 ,  G01R31/2644 ,  H01L21/308 ,  H01L21/6835 ,  H01L22/14 ,  H01L22/30 ,  H01L22/32 ,  H01L25/0753 ,  H01L33/16 ,  H01L33/30 ,  H01L33/34 ,  H01L33/48 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A substrate includes an anchor area (30) physically secured to a surface of the substrate (10) and at least one printable electronic component (20). The at least one printable electronic component includes an active layer (14) having one or more active elements thereon, and is suspended over the surface of the substrate by electrically conductive breakable tethers (40). The electrically conductive breakable tethers include an insulating layer and a conductive layer thereon that physically secure and electrically connect the at least one printable electronic component to the anchor area, and are configured to be preferentially fractured responsive to pressure applied thereto. Related methods of fabrication and testing are also discussed.

    摘要翻译： 衬底包括物理地固定到衬底（10）的表面上的锚定区域（30）和至少一个可印刷的电子部件（20）。 所述至少一个可印刷电子部件包括其上具有一个或多个有源元件的有源层（14），并且通过导电可破坏的系绳（40）悬挂在基板的表面上。 导电可破裂系绳包括绝缘层和导电层，其物理地固定和电连接至少一个可印刷的电子部件到锚定区域，并且被配置为响应于施加到其上的压力而优先断裂。 还讨论了相关的制造和测试方法。

    DEVICES AND METHODS FOR PATTERN GENERATION BY INK LITHOGRAPHY
    39.
    发明申请
    DEVICES AND METHODS FOR PATTERN GENERATION BY INK LITHOGRAPHY 审中-公开
    用于图形生成的设备和方法

    公开(公告)号：US20080055581A1

    公开(公告)日：2008-03-06

    申请号：US11675659

    申请日：2007-02-16

    申请人： John Rogers ,  Etienne Menard

    发明人： John Rogers ,  Etienne Menard

    IPC分类号： G03B27/04 ,  G03C5/00

    CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  G03F1/50 ,  H01L51/0017

    摘要： The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions and including relief and recess features with variable height, depth or height and depth. Composite patterning devices comprising a plurality of polymer layers each having selected mechanical and thermal properties and physical dimensions provide high resolution patterning on a variety of substrate surfaces and surface morphologies. Gray-scale ink lithography photomasks for gray-scale pattern generation or molds for generating embossed relief features on a substrate surface are provided. The particular shape of the fabricated patterned can be manipulated by varying the three-dimensional recess pattern on an elastomeric patterning device which is brought into conformal contact with a substrate to localize patterning agent to the recess portion of the pattern.

    摘要翻译： 本发明提供了用于在衬底表面上制造图案的方法，装置和器件部件，特别是包括具有一维，两维或三维中选定长度的微尺寸和/或纳米尺寸特征的结构的图案，并且包括具有可变高度，深度的浮雕和凹陷特征 高度和深度。 包括多个具有选择的机械和热性质和物理尺寸的聚合物层的复合图案形成装置在各种基底表面和表面形态上提供高分辨率图案。 提供用于灰度图案生成的灰度级油墨光刻光掩模或用于在基板表面上产生浮雕浮雕特征的模具。 所制造的图案的特定形状可以通过改变弹性体图案形成装置上的三维凹陷图案来进行操作，所述弹性图案形成装置与衬底形成保形接触以将图案化剂定位到图案的凹部。

    Composite patterning devices for soft lithography
    40.
    发明申请
    Composite patterning devices for soft lithography 有权
    用于软光刻的复合图案形成装置

    公开(公告)号：US20050238967A1

    公开(公告)日：2005-10-27

    申请号：US11115954

    申请日：2005-04-27

    申请人： John Rogers ,  Etienne Menard

    发明人： John Rogers ,  Etienne Menard

    IPC分类号： C04B24/38 ,  C04B28/14 ,  G03F7/00 ,  G03F9/00

    CPC分类号： B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  C04B24/383 ,  C04B28/14 ,  C04B2111/00181 ,  G03F7/0002

    摘要： The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions. The present invention provides composite patterning devices comprising a plurality of polymer layers each having selected mechanical properties, such as Young's Modulus and flexural rigidity, selected physical dimensions, such as thickness, surface area and relief pattern dimensions, and selected thermal properties, such as coefficients of thermal expansion, to provide high resolution patterning on a variety of substrate surfaces and surface morphologies.

    摘要翻译： 本发明提供用于在衬底表面上制造图案的方法，装置和器件部件，特别是包括具有一维，二维或三维尺寸选定长度的微小尺寸和/或纳米尺寸特征的结构的图案。 本发明提供了复合图案形成装置，其包括多个聚合物层，每个聚合物层各自具有选择的机械性质，例如杨氏模量和弯曲刚度，所选择的物理尺寸，例如厚度，表面积和浮雕图案尺寸，以及选定的热性能，例如系数 的热膨胀，以在各种基底表面和表面形态上提供高分辨率图案。