公开(公告)号：US20100011572A1

公开(公告)日：2010-01-21

申请号：US12439602

申请日：2008-04-24

申请人： Takashi Kitae ,  Seiichi Nakatani ,  Seiji Karashima

发明人： Takashi Kitae ,  Seiichi Nakatani ,  Seiji Karashima

IPC分类号： H05K3/30 ,  H05K3/34

CPC分类号： H05K3/3436 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L29/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11524 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/8101 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2224/83888 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10157 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/323 ,  H05K3/3484 ,  H05K2201/09036 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  Y10T29/49137 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A process for producing an electronic component assembly, comprising the steps of: (1) preparing a first electronic component whose surface (A) is provided with a plurality of electrodes (a) and a second electronic component whose surface (B) is provided with a plurality of electrodes (b) wherein at least one concave portion is formed in the surface (A) (except for a surface region on which the electrodes (a) are provided) and/or the surface (B) (except for a surface region on which the electrodes (b) are provided); (2) supplying a resin that comprises a solder powder onto the surface (A) of the first electronic component; (3) bringing the second electronic component into contact with a surface of the resin such that the plurality of electrodes (a) of the first electronic component are opposed to the plurality of electrodes (b) of the second electronic component; and (4) heating the first electronic component and/or the second electronic component, and thereby forming solder connections from the solder powder, the solder connections serving to electrically interconnect the electrodes (a) and (b), wherein, upon the heating step (4), gas bubbles are generated within the resin such that the bubble generation originates at least from the concave portion, and the generated bubbles cause the solder powder to move and congregate onto the electrodes (a) and (b).

摘要翻译： 一种电子部件组件的制造方法，包括以下步骤：（1）制备其表面（A）设置有多个电极（a）的第一电子部件和其表面（B）设置有第二电子部件 多个电极（b），其中在表面（A）中形成至少一个凹部（除了设置电极（a）的表面区域之外））和/或表面（B）（表面除外） 设置电极（b）的区域）; （2）将包含焊料粉末的树脂供给到第一电子部件的表面（A）上; （3）使第二电子部件与树脂的表面接触，使得第一电子部件的多个电极（a）与第二电子部件的多个电极（b）相对; 和（4）加热第一电子部件和/或第二电子部件，从而形成从焊料粉末的焊接连接，焊料连接用于电连接电极（a）和（b），其中，在加热步骤 （4）中，在树脂内产生气泡，使得气泡产生至少从凹部产生，所产生的气泡使焊料粉末移动并聚集在电极（a）和（b）上。

公开(公告)号：US07640659B2

公开(公告)日：2010-01-05

申请号：US12064131

申请日：2005-08-11

申请人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

发明人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H01L21/4846 ,  H01L2224/11 ,  H05K3/04 ,  H05K3/101 ,  H05K3/102 ,  H05K3/3484 ,  H05K2203/0108 ,  H05K2203/0425 ,  H05K2203/083 ,  H05K2203/087 ,  Y10T29/49155 ,  Y10T156/1744

摘要： [Problem] To provide a conductive pattern formation method in which a fine pattern can be formed in a simple way at low cost.[Means for Solving Problem] A flat plate having a convex pattern on its surface is provided so as to oppose a substrate, a fluid body including conductive particles and a gas bubble generating agent is supplied into a gap between the substrate and the flat plate, and thereafter, the fluid body is heated for generating gas bubbles from the gas bubble generating agent included in the fluid body. The fluid body is forced out of the gas bubbles as the gas bubbles generated from the gas bubble generating agent grow, so as to self-assemble between the convex pattern formed on the flat plate and the substrate owing to interfacial force, and an aggregate of the conductive particles included in the fluid body having self-assembled is made into a conductive pattern formed on the substrate.

摘要翻译： [问题]提供一种导电图案形成方法，其中可以以简单的方式以低成本形成精细图案。 解决问题的手段在其表面上具有凸形图案的平板被设置为与基板相对，包括导电颗粒和气泡发生剂的流体被供应到基板和平板之间的间隙中， 此后，流体体被加热，从包含在流体中的气泡发生剂产生气泡。 当气泡发生剂产生的气泡生长时，液体被迫离开气泡，从而由于界面力而在平板上形成的凸形图案与基板之间自组装， 包含在具有自组装的流体中的导电颗粒被制成形成在基板上的导电图案。

公开(公告)号：US20090126876A1

公开(公告)日：2009-05-21

申请号：US12078891

申请日：2008-04-08

申请人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

发明人： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

IPC分类号： B32B38/18

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/83047 ,  H01L2224/83091 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2225/06513 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/30105 ,  H01L2924/381 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2203/087 ,  Y10T156/1744 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

摘要： A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a method for connecting substrates are provided. A circuit board 10 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 21 are disposed in mutually facing relation and a resin 13 containing conductive particles 12 and a gas bubble generating agent is supplied into the space therebetween. In this state, the resin 13 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 13. The resin 13 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof. The resin 13 pushed to the outside is self-assembled in the form of columns between the respective terminals of the circuit board 10 and the semiconductor chip 20. In this state, by pressing the semiconductor chip 20 against the circuit board 10, the conductive particles 12 contained in the resin 13 self-assembled between the facing terminals are brought into contact with each other to provide electrical connection between the terminals.

公开(公告)号：US20090078746A1

公开(公告)日：2009-03-26

申请号：US12282774

申请日：2007-02-22

申请人： Seiji Karashima ,  Yasushi Taniguchi ,  Seiichi Nakatani ,  Kenichi Hotehama ,  Takashi Kitae ,  Susumu Sawada

发明人： Seiji Karashima ,  Yasushi Taniguchi ,  Seiichi Nakatani ,  Kenichi Hotehama ,  Takashi Kitae ,  Susumu Sawada

IPC分类号： B23K1/20 ,  B23K3/00

CPC分类号： H05K3/3484 ,  H01L24/11 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K2203/0425 ,  H05K2203/083 ,  H05K2203/087 ,  H01L2924/00

摘要： A method for forming bumps 19 on electrodes 32 of a wiring board 31 includes the steps of: (a) supplying a fluid 14 containing conductive particles 16 and a gas bubble generating agent onto a first region 17 including the electrodes 32 on the wiring board 31; (b) disposing a substrate 40 having a wall surface 45 formed near the electrodes 32 for forming a meniscus 55 of the fluid 14, so that the substrate 40 faces the wiring board 31; and (c) heating the fluid 14 to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

摘要翻译： 在布线板31的电极32上形成凸块19的方法包括以下步骤：（a）将含有导电粒子16和气泡生成剂的流体14供给到布线板31上的包括电极32的第一区域17上 ; （b）设置具有形成在电极32附近的壁面45的基板40，以形成流体14的弯液面55，使得基板40面向布线板31; 和（c）加热流体14以从包含在流体14中的气泡生成剂产生气泡30。

公开(公告)号：US07443021B2

公开(公告)日：2008-10-28

申请号：US11550677

申请日：2006-10-18

申请人： Seiichi Nakatani

发明人： Seiichi Nakatani

IPC分类号： H01L29/40

CPC分类号： H01L23/4985 ,  H01L23/49805 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/06551 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2225/1011 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H05K1/145 ,  H05K2201/10734 ,  Y10T156/1056 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2224/05005 ,  H01L2224/05541 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2924/00012

摘要： An electronic component packaging structure, includes: circuit boards each having a wiring at least on a surface thereof; and an electronic component package secured between the circuit boards. The electronic component package includes at least one electronic component embedded within an electrical insulating encapsulation resin molded member made of an inorganic filler and a resin, the at least one electronic component being selected from an active component and a passive component, protruding electrodes are arranged on both faces of the electrical insulating encapsulation resin molded member, and the electronic component is connected electrically with at least a part of the protruding electrodes. This configuration allows circuit boards to be connected with each other and a high-density and high-performance structure.

摘要翻译： 一种电子部件封装结构，包括：至少在其表面上具有布线的电路板; 以及固定在电路板之间的电子部件封装。 电子部件封装包括嵌入由无机填料和树脂制成的电绝缘密封树脂模制构件中的至少一个电子部件，所述至少一个电子部件选自有源部件和无源部件，突出电极设置在 电绝缘性封装树脂成型体的两面，电子部件与至少一部分突出电极电连接。 该配置允许电路板彼此连接和高密度和高性能的结构。

公开(公告)号：US20080128664A1

公开(公告)日：2008-06-05

申请号：US11793175

申请日：2005-12-14

申请人： Takashi Kitae ,  Seiji Karashima ,  Koichi Hirano ,  Toshiyuki Kojima ,  Seiichi Nakatani ,  Shingo Komatsu ,  Yoshihisa Yamashita

发明人： Takashi Kitae ,  Seiji Karashima ,  Koichi Hirano ,  Toshiyuki Kojima ,  Seiichi Nakatani ,  Shingo Komatsu ,  Yoshihisa Yamashita

IPC分类号： H01B1/02

CPC分类号： H05K3/323 ,  H01L21/6835 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/0695 ,  H01L2924/062 ,  H01L2924/0615 ,  H01L2924/068 ,  H01L2924/0705 ,  H01L2924/0675 ,  H01L2924/07001 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

摘要： There is provided a flip-chip mounting resin composition which can be used for a flip-chip mounting process that is high in productivity and reliability and thus can be applicable to a flip-chip mounting of a next-generation LSI. This flip-chip mounting resin composition comprises a resin, metal particles and a convection additive 12 that boils upon heating the resin 13. Upon the heating of the resin 13, the metal particles melt and the boiling convection additive 12 convects within the resin 13. This flip-chip mounting resin composition is supplied between a circuit substrate 10 and a semiconductor chip 20, and subsequently the resin 13 is heated so that the molten metal particles self-assemble into the region between each electrode of the circuit substrate and each electrode of the semiconductor chip. As a result, an electrical connection is formed between each electrode of the circuit substrate and each electrode of the semiconductor chip. Finally, the resin 13 is allowed to cure so that the semiconductor chip 20 is secured to the circuit substrate 10, which leads to in a formation of a flip chip assembly.

摘要翻译： 提供了一种倒装芯片安装树脂组合物，其可用于生产率和可靠性高的倒装芯片安装工艺，因此可以应用于下一代LSI的倒装芯片安装。 这种倒装芯片安装树脂组合物包括在加热树脂13时沸腾的树脂，金属颗粒和对流添加剂12。 在加热树脂13时，金属颗粒熔化，沸腾对流添加剂12在树脂13内对流。 将该倒装芯片安装树脂组合物供给在电路基板10和半导体芯片20之间，随后加热树脂13，使得熔融金属颗粒自组装成电路基板的每个电极和电极的每个电极之间的区域 半导体芯片。 结果，在电路基板的每个电极和半导体芯片的每个电极之间形成电连接。 最后，使树脂13固化，使得半导体芯片20固定到电路基板10，这导致形成倒装芯片组件。

公开(公告)号：US20070262470A1

公开(公告)日：2007-11-15

申请号：US11577346

申请日：2005-09-20

申请人： Takashi Ichiryu ,  Yoshihisa Yamashita ,  Seiichi Nakatani

发明人： Takashi Ichiryu ,  Yoshihisa Yamashita ,  Seiichi Nakatani

IPC分类号： H01L23/48 ,  H01L21/00 ,  H01L25/00

CPC分类号： H01L21/56 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/0657 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10329 ,  H01L2924/181 ,  H05K1/186 ,  H05K3/4614 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： The present invention provides a module with a built-in semiconductor that can suppress a reduction in yield caused by a crack or failure of a semiconductor device in the process of mounting a thin semiconductor device on a wiring board and a method for manufacturing the module. In the module with a built-in semiconductor, a semiconductor device (107) is contained in an interlayer connection member (105) located between a first wiring board (101) and a second wiring board (103). The back side of the semiconductor device (107) is die-bonded to the first wiring board (101) via an adhesive (108), and the semiconductor device (107) is connected electrically to the second wiring pattern (104) via a protruding electrode (109).

摘要翻译： 本发明提供了一种具有内置半导体的模块，其能够抑制在将薄半导体器件安装在布线板上的过程中半导体器件的裂纹或故障引起的产量降低以及用于制造模块的方法。 在具有内置半导体的模块中，半导体器件（107）包含在位于第一布线板（101）和第二布线板（103）之间的层间连接部件（105）中。 半导体器件（107）的背面通过粘合剂（108）与第一布线板（101）进行裸片接合，半导体器件（107）经由突出部 电极（109）。

公开(公告)号：US20070216023A1

公开(公告)日：2007-09-20

申请号：US11683612

申请日：2007-03-08

申请人： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Sawada

发明人： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Sawada

IPC分类号： H01L23/34

CPC分类号： H05K3/3484 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  B23K35/3613 ,  C22C11/00 ,  C22C12/00 ,  C22C13/00 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/29311 ,  H01L2924/00014 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2224/16225

摘要： The present invention provides a conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium includes a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other. Thereby, a flip chip packaging method that can be applied to flip chip packaging of LSI and has high productivity and high reliability is provided.

摘要翻译： 本发明提供一种导电树脂组合物，用于电连接电极，其中金属颗粒分散在流动介质中，其中流动介质包括与金属颗粒相比具有较高润湿性的第一流动介质和具有相对较高的第二流动介质 与金属颗粒的低润湿性，以及第一流动介质和第二流动介质在彼此不相容的状态下分散。 因此，提供了可以应用于LSI的倒装芯片封装并且具有高生产率和高可靠性的倒装芯片封装方法。

公开(公告)号：US07141874B2

公开(公告)日：2006-11-28

申请号：US10840583

申请日：2004-05-05

申请人： Seiichi Nakatani

发明人： Seiichi Nakatani

IPC分类号： H01L29/40

CPC分类号： H01L23/4985 ,  H01L23/49805 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/06551 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2225/1011 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H05K1/145 ,  H05K2201/10734 ,  Y10T156/1056 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2224/05005 ,  H01L2224/05541 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2924/00012

摘要： An electronic component packaging structure, includes: circuit boards each having a wiring at least on a surface thereof; and an electronic component package secured between the circuit boards. The electronic component package includes at least one electronic component embedded within an electrical insulating encapsulation resin molded member made of an inorganic filler and a resin, the at least one electronic component being selected from an active component and a passive component, protruding electrodes are arranged on both faces of the electrical insulating encapsulation resin molded member, and the electronic component is connected electrically with at least a part of the protruding electrodes. This configuration allows circuit boards to be connected with each other and a high-density and high-performance structure.

摘要翻译： 一种电子部件封装结构，包括：至少在其表面上具有布线的电路板; 以及固定在电路板之间的电子部件封装。 电子部件封装包括嵌入由无机填料和树脂制成的电绝缘密封树脂模制构件中的至少一个电子部件，所述至少一个电子部件选自有源部件和无源部件，突出电极设置在 电绝缘性封装树脂成型体的两面，电子部件与至少一部分突出电极电连接。 该配置允许电路板彼此连接和高密度和高性能的结构。

公开(公告)号：US07134198B2

公开(公告)日：2006-11-14

申请号：US10654343

申请日：2003-09-03

申请人： Seiichi Nakatani ,  Yoshihiro Bessho ,  Yasuhiro Sugaya ,  Keiji Onishi

发明人： Seiichi Nakatani ,  Yoshihiro Bessho ,  Yasuhiro Sugaya ,  Keiji Onishi

IPC分类号： H05K3/30

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/187 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10378 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49146 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05624 ,  H01L2924/00014

摘要： A method for manufacturing an electric element built-in module including flip-chip mounting at least one electric element such as a semiconductor chip or a surface acoustic wave device on a wiring pattern, sealing the electric element with a thermosetting resin composition, and grinding or abrading the thermosetting resin composition and electric element from a side of the electric element opposite that of the wiring pattern. The method provides upper surfaces of the electric element and the thermosetting resin composition that are substantially flush with each other. The method provides an electric element built-in module suitable for high-density packaging with a reduced thickness without damaging the electric element and while maintaining mechanical strength.

摘要翻译： 一种电气元件内置模块的制造方法，其包括在布线图案上安装诸如半导体芯片或表面声波装置的至少一个电气元件的倒装芯片，用热固性树脂组合物密封电气元件，以及研磨或 从电气元件的与布线图案相反的一侧研磨热固性树脂组合物和电气元件。 该方法提供电气元件和热固性树脂组合物的彼此基本齐平的上表面。 该方法提供一种电子元件内置模块，适用于厚度较小的高密度封装，而不会损坏电气元件，同时保持机械强度。