公开(公告)号：US06747875B2

公开(公告)日：2004-06-08

申请号：US09964130

申请日：2001-09-25

Applicant: Carl Milton Wildrick ,  Gordon K. Y. Lee

Inventor： Carl Milton Wildrick ,  Gordon K. Y. Lee

IPC: H05K114

CPC classification number: H01R12/7088 ,  H05K1/165 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/10257 ,  H05K2201/1084 ,  Y02P70/613

Abstract: This improved surface mount power supply can withstand the rigors of the manufacturing process and still create sturdy and robust connection to a user's circuit card. The open frame power module uses a U-shaped or T-shaped interconnect rather than a spherical interconnect. In one embodiment, the U-shaped interconnect can have a hole through one surface to allow the wicking of solder. The wicked solder provides a sturdier connection that is more likely to survive subsequent reflow processes. The power module is also built on a thicker FR4 board. The thicker board is less likely to warp during subsequent heating.

Abstract translation: 这种改进的表面贴装电源可以承受制造过程的严格性，并且仍然可以创建与用户电路卡的坚固和牢固的连接。 开放式框架功率模块使用U形或T形互连，而不是球形互连。 在一个实施例中，U形互连可以具有穿过一个表面的孔，以允许焊料芯吸。 恶臭的焊料提供了更坚固的连接，更有可能在随后的回流工艺中生存。 电源模块也建在较厚的FR4板上。 较厚的板在随后的加热期间不太可能翘曲。

公开(公告)号：US20020191379A1

公开(公告)日：2002-12-19

申请号：US09964130

申请日：2001-09-25

Inventor： Carl Milton Wildrick ,  Gordon K.Y. Lee

IPC: H05K001/14

CPC classification number: H01R12/7088 ,  H05K1/165 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/10257 ,  H05K2201/1084 ,  Y02P70/613

Abstract: This improved surface mount power supply can withstand the rigors of the manufacturing process and still create sturdy and robust connection to a user's circuit card. The open frame power module uses a U-shaped or T-shaped interconnect rather than a spherical interconnect. In one embodiment, the U-shaped interconnect can have a hole through one surface to allow the wicking of solder. The wicked solder provides a sturdier connection that is more likely to survive subsequent reflow processes. The power module is also built on a thicker FR4 board. The thicker board is less likely to warp during subsequent heating.

Abstract translation: 这种改进的表面贴装电源可以承受制造过程的严格性，并且仍然可以创建与用户电路卡的坚固和牢固的连接。 开放式框架功率模块使用U形或T形互连，而不是球形互连。 在一个实施例中，U形互连可以具有穿过一个表面的孔，以允许焊料芯吸。 恶臭的焊料提供更坚固的连接，更有可能在后续回流工艺中生存。 电源模块也建在较厚的FR4板上。 较厚的板在随后的加热期间不太可能翘曲。

公开(公告)号：US20020038509A1

公开(公告)日：2002-04-04

申请号：US09837423

申请日：2001-04-19

Applicant: NEC Corporation

Inventor： Koji Soejima ,  Naoji Senba

IPC: H05K003/36 ,  H05K003/34

CPC classification number: H01L24/12 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1111 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/20 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2203/0113 ,  H05K2203/0338 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Disclosed is a bump structure, which has a hollow body, for electrically connecting a first member and a second member. Also disclosed is a method for making a bump structure, which has the steps of: preparing a molding plate with a concave mold to mold a bump-forming member; forming a conductive thin film so as to form a predetermined cavity in the concave mold of the molding plate; preparing a substrate to which the conductive thin film is to be transferred; and transferring the conductive thin film formed on the molding plate to the substrate.

Abstract translation: 公开了一种凸块结构，其具有中空体，用于电连接第一构件和第二构件。 还公开了一种制造凸块结构的方法，其具有以下步骤：制备具有凹模的模制板以模制凸块形成构件; 形成导电薄膜，以在模板的凹模中形成预定的空腔; 准备要传输导电薄膜的基板; 以及将形成在所述成型板上的导电性薄膜转移到所述基板。

公开(公告)号：US20180302985A1

公开(公告)日：2018-10-18

申请号：US15949230

申请日：2018-04-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Gi OH ,  Sang Hyuk WI ,  Chang Geun YU ,  Sang Ho HONG

IPC: H05K1/14 ,  F21V8/00 ,  H05K5/00 ,  H05K1/02 ,  H01P3/12 ,  H05K1/18 ,  G02F1/1333 ,  G02F1/1345

CPC classification number: H05K1/142 ,  G02B6/0055 ,  G02B6/0085 ,  G02F1/133308 ,  G02F1/13452 ,  G02F2001/133314 ,  G02F2001/133317 ,  G02F2001/13332 ,  G06F1/1601 ,  G06F1/1637 ,  G06F1/20 ,  H01P3/122 ,  H01P11/002 ,  H04N5/64 ,  H05K1/0237 ,  H05K1/0274 ,  H05K1/18 ,  H05K5/0017 ,  H05K2201/10098 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/10189 ,  H05K2201/10257

Abstract: A display apparatus including a waveguide is provided. The display apparatus includes a display panel; a backlight configured to provide light to the display panel; a heat sink configured to absorb heat generated by the backlight; a bottom chassis configured to support the backlight and the heat sink; a first circuit board mounted on the bottom chassis; a second circuit board mounted on the bottom chassis; and a waveguide formed between the first circuit board and the second circuit board.

公开(公告)号：US09877397B2

公开(公告)日：2018-01-23

申请号：US14923941

申请日：2015-10-27

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Rikihiro Maruyama ,  Kenshi Kai ,  Nobuyuki Kanzawa ,  Mitsutoshi Sawano

IPC: H05K3/30 ,  H01L21/44 ,  H05K3/34 ,  H01L23/498 ,  H01L21/48 ,  H01L25/07 ,  H05K3/40 ,  H01L23/373

CPC classification number: H05K3/301 ,  H01L21/4853 ,  H01L23/3735 ,  H01L23/49811 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K3/303 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/10257 ,  H05K2201/1031 ,  H05K2203/0278 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/41 ,  Y10T29/532 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A mounting jig for a semiconductor device includes an insulated circuit board positioning jig positioning an insulated circuit board by housing the insulated circuit board at a predetermined position, a tubular contact element positioning jig having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig for pressing down the plurality of tubular contact elements inserted into the respective positioning holes in the tubular contact element positioning jig.

公开(公告)号：US20170339794A1

公开(公告)日：2017-11-23

申请号：US15671899

申请日：2017-08-08

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Rikihiro MARUYAMA ,  Kenshi KAI ,  Nobuyuki KANZAWA ,  Mitsutoshi SAWANO

IPC: H05K3/30 ,  H01L25/07 ,  H05K3/34 ,  H01L23/498 ,  H01L21/48 ,  H05K3/40 ,  H01L23/373

CPC classification number: H05K3/301 ,  H01L21/4853 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K3/303 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/10257 ,  H05K2201/1031 ,  H05K2203/0278 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/532 ,  H01L2924/014 ,  H01L2924/00012

Abstract: A mounting jig for a semiconductor device includes an insulated circuit board positioning jig having a concave part in which an insulated circuit board is placed, a tubular contact element positioning jig disposed on an upper side of the insulated circuit board and having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig having a flat plate and a plurality of projections extending from a lower surface of the flat plate. The plurality of projections includes a first length from the flat plate on a side closer to an outer circumference of the insulated circuit board, and a second length from the flat plate inside the outer circumference of the insulated circuit board. The first length is shorter than the second length.

公开(公告)号：US09801269B1

公开(公告)日：2017-10-24

申请号：US15150834

申请日：2016-05-10

Applicant: Northrop Grumman Systems Corporation

Inventor： Charles M. Jackson ,  Elizabeth T. Kunkee

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H01P3/08 ,  H01P3/06

CPC classification number: H05K1/025 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2407 ,  H05K1/0222 ,  H05K1/0242 ,  H05K1/144 ,  H05K3/184 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/467 ,  H05K3/4679 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/042 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/09809 ,  H05K2201/10257 ,  H05K2201/10378

Abstract: A resilient electrical connector assembly includes a base PCB and stacked layers of interconnected resilient conductive structures where each structure has at least two resilient conductive strips and at least two conductive contacts. One contact is integrated with a conductive path on the base PCB and another contact pad is positioned to establish a conductive path with a target PCB when the latter is mounted parallel to the base PCB. The resilient conductive strips flex due to a compressive force exerted between the base PCB and target PCB on the stacked layers. The resilient conductive structures are formed by depositing metal to sequentially form each of the stacked layers with one contact being initially formed in engagement with the conductive path on the base PCB.

公开(公告)号：US20170105285A1

公开(公告)日：2017-04-13

申请号：US15281340

申请日：2016-09-30

Applicant: TDK Corporation

Inventor： Kazuharu KITATANI ,  Yasunobu NOGUCHI

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0263 ,  H05K1/11 ,  H05K3/306 ,  H05K3/34 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10257 ,  H05K2201/10272

Abstract: A circuit board includes a base substrate, a busbar disposed on a mounting surface-side of the base substrate; and an electronic component disposed on the mounting surface-side and including a plurality of terminals, at least one of which is soldered to a component connecting end portion extending from the busbar. The base substrate has an opening into which the component connecting end portion can be inserted. A first insertion portion through which the terminal can be inserted is provided in the component connecting end portion. The busbar is fixed to the base substrate so that the component connecting end portion is inserted into the opening with a soldering surface, on a side of the component connecting end portion where the terminal inserted through the first insertion portion protrudes, positioned closer to a rear surface of the base substrate than the component mounting surface.

公开(公告)号：US09606496B2

公开(公告)日：2017-03-28

申请号：US14326193

申请日：2014-07-08

Applicant: CANON KABUSHIKI KAISHA

Inventor： Satoshi Ogawara

IPC: H05K1/00 ,  G03G15/00 ,  H05K3/40 ,  H05K1/02 ,  H05K3/34

CPC classification number: G03G15/80 ,  G03G21/1652 ,  H05K1/0254 ,  H05K1/0269 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10257 ,  H05K2201/10265 ,  H05K2201/1028 ,  H05K2201/10295 ,  H05K2201/10363

Abstract: A printed circuit board, including: a substrate on which a component is mounted by solder; and a contact plate having a soldered portion soldered on the substrate, the contact plate being configured to be brought into contact with a contact of an apparatus to which the substrate is to be attached, wherein the soldered portion is soldered on a surface of the substrate opposite to a surface of the substrate on which the component is mounted, and wherein the contact plate has a suppressing portion configured to suppress an adhesion of a flux of the solder to a portion in which the contact plate is to be contacted by the contact, the suppressing portion making a flow path of the flux from the soldered portion to the portion longer than a straight-line distance from the soldered portion to the portion.

公开(公告)号：US09549472B2

公开(公告)日：2017-01-17

申请号：US14305948

申请日：2014-06-16

Applicant: CANON KABUSHIKI KAISHA

Inventor： Ryuichi Shibutani

IPC: H05K7/00 ,  H05K1/18 ,  H05K3/34 ,  H05K1/02 ,  H05K1/11 ,  H01L23/498 ,  H01L25/10

CPC classification number: H05K3/3436 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49894 ,  H01L25/105 ,  H01L2225/1058 ,  H01L2924/1432 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/3511 ,  H05K1/02 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/181 ,  H05K1/186 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/2036 ,  Y02P70/613

Abstract: First electrode pads formed on one semiconductor package surface include a first reinforcing electrode pad having a surface area larger than that of other first electrode pads. Second electrode pads formed on a printed wiring board on which the semiconductor package is mounted include at least one second reinforcing electrode pad. The second reinforcing electrode pad opposes the first reinforcing electrode pad, and has a surface area greater than that of the other second electrode pads. The first and second electrode pads are connected by solder connection parts. A cylindrical enclosing member encloses an outer perimeter of a solder connection part connecting the first and second reinforcing electrode pads. Increases in the amount of warping of semiconductor devices such as the package substrate and the printed wiring board are suppressed, and the development of solder bridges with respect to adjacent solder connecting parts or adjacent components is reduced.

Abstract translation: 形成在一个半导体封装表面上的第一电极焊盘包括表面积大于其它第一电极焊盘的表面积的第一增强电极焊盘。 形成在其上安装有半导体封装的印刷线路板上的第二电极焊盘包括至少一个第二增强电极焊盘。 第二加强电极垫与第一增强电极焊盘相对，并且其表面积大于其它第二电极焊盘的表面积。 第一和第二电极焊盘通过焊接连接部分连接。 圆柱形封闭构件包围连接第一和第二增强电极焊盘的焊接连接部分的外周边。 抑制诸如封装衬底和印刷电路板的半导体器件的翘曲量的增加，并且减少了相对于相邻焊料连接部件或相邻部件的焊料桥的发展。