公开(公告)号：US09674955B2

公开(公告)日：2017-06-06

申请号：US14357450

申请日：2012-11-06

Applicant: LG INNOTEK CO., LTD.

Inventor： Hong Il Kim

IPC: H05K3/46 ,  H05K1/11 ,  H01L21/48 ,  H05K3/00 ,  H01L23/498 ,  H05K1/18 ,  H05K1/03

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K1/181 ,  H05K3/0038 ,  H05K2201/09009 ,  H01L2924/00

Abstract: Provided are a tape carrier package and a method of manufacturing the same, the method, including: forming through holes by performing a drill process using a laser to an insulating film of a flexible copper clad laminate (FCCL) film consisting of the insulating film and a copper layer; forming a circuit pattern layer by performing an etching process to the copper layer of the FCCL film; and selectively forming a plating layer on the circuit pattern layer. The method of manufacturing the tape carrier package according to the present invention is advantageous because a punching process, and processes for laminating and drying the copper layer which are necessary for the conventional method of manufacturing the tape carrier package can be omitted, a production cost of the tape carrier package is reduced, and the time required for the drying process is saved.

公开(公告)号：US09578741B2

公开(公告)日：2017-02-21

申请号：US14388381

申请日：2013-03-26

Applicant: JX Nippon Mining & Metals Corporation

Inventor： Tomota Nagaura ,  Michiya Kohiki ,  Terumasa Moriyama

IPC: H05K3/38 ,  H05K3/18 ,  H05K3/02 ,  H05K3/06 ,  H05K1/03 ,  H05K1/09 ,  B32B15/20 ,  B32B3/30 ,  B32B15/01 ,  C22C9/00 ,  B32B15/08

CPC classification number: H05K1/09 ,  B32B3/30 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2457/08 ,  C22C9/00 ,  C25D1/04 ,  C25D3/12 ,  C25D3/38 ,  C25D5/12 ,  C25D9/08 ,  H05K1/0313 ,  H05K3/022 ,  H05K3/025 ,  H05K3/06 ,  H05K3/181 ,  H05K3/188 ,  H05K3/381 ,  H05K3/383 ,  H05K3/388 ,  H05K2201/09009 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/12792 ,  Y10T428/12847 ,  Y10T428/12903 ,  Y10T428/1291

Abstract: Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 μm, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.

Abstract translation: 提供一种用于印刷电路板的铜箔，其在其至少一个表面上包括粗糙层。 在粗糙层中，粒子底部的平均粒径D1与粒子的底部相隔10％的粒子长度为0.2〜1.0μm，粒子长度L1与平均直径D1的比L1 / D1 在颗粒底部为15或更小。 在印刷电路板用铜箔中，当将具有粗糙层的印刷布线用铜箔层压到树脂上，然后通过蚀刻除去铜层时，占据具有凹凸的树脂粗糙面的孔面积之和为 20％以上。 本发明涉及开发用于半导体封装基板的铜箔，其可以避免电路侵蚀而不会导致铜箔的其它性能的劣化。 特别地，本发明的目的是提供一种用于印刷线路板的铜箔和铜箔的制造方法，其中可以通过改善粗糙层来提高铜箔和树脂之间的粘附强度 的铜箔。

公开(公告)号：US09573537B2

公开(公告)日：2017-02-21

申请号：US14779025

申请日：2014-03-10

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Yuji Kawashima ,  Mitsuhiro Shimamura ,  Satoru Itou

IPC: B60R16/02 ,  B60R16/023 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K7/02

CPC classification number: B60R16/0231 ,  B60R16/0215 ,  H05K1/0296 ,  H05K1/05 ,  H05K1/181 ,  H05K7/02 ,  H05K2201/09009

Abstract: A wiring unit (U) for automatic transmission mounted in an automatic transmission of an automotive vehicle and configured to execute a control relating to a speed changing operation includes a wiring harness (WH), a ROM (1) connected to the wiring harness and a holding plate (2) made of metal for holding these. The holding plate (2) is formed with a holding portion (33) on which the ROM (1) is to be placed, and the holding portion (33) is integrally formed with a plurality of swaging pieces (36) for fixing the ROM (1) on the holding portion (33) by being swaged to the ROM (1). Further, the ROM (1) is formed with a positioning protrusion (37), and the holding portion (33) is formed with a receiving hole (39) into which the positioning protrusion (37) is aligned and fitted.

Abstract translation: 一种用于自动变速器的接线单元（U），其安装在机动车辆的自动变速器中，并被配置为执行与变速操作有关的控制，包括线束（WH），连接到线束的ROM（1）和 用金属制成的夹持板（2）用于固定。 保持板（2）形成有要放置ROM（1）的保持部分（33），并且保持部分（33）与用于固定ROM（1）的多个模锻件（36）整体形成， （1）上的保持部（33）上。 此外，ROM（1）形成有定位突起（37），保持部（33）形成有定位突起（37）对准并嵌合的接收孔（39）。

公开(公告)号：US20160330829A1

公开(公告)日：2016-11-10

申请号：US15109423

申请日：2014-12-29

Applicant: KUNSHAN VISIONOX DISPLAY CO., LTD.

Inventor： Leping AN ,  Long WANG ,  Ming GAO ,  Yao HONG ,  Bin PU

IPC: H05K1/02

CPC classification number: H05K1/028 ,  G06F3/041 ,  G06F2203/04107 ,  H05K1/0213 ,  H05K1/0215 ,  H05K2201/053 ,  H05K2201/09009

Abstract: The present invention discloses a flexible circuit board. The flexible circuit board comprises a base portion and a grounding soft board extending from the base portion, the grounding soft board comprising a board body connected to the base portion and a contact end provided at a free end of the board body, the contact end comprising a bonding region and a windowing copper exposure region arranged inside the bonding region, and the board body being in a curved shape. According to the present invention, by making improvements on the bonding area between the grounding soft board and the shielding layer and on the shape of the soft board, and by increasing the bonding power and dispersing the folding stress, the grounding soft board is prevented from falling off at portions contacting the shielding layer when folded or transported.

Abstract translation: 本发明公开了一种柔性电路板。 柔性电路板包括从基部延伸的基部和接地软板，接地软板包括连接到基部的板本体和设置在板本体的自由端的接触端，所述接触端包括 接合区域和布置在接合区域内的开窗铜曝光区域，并且板体呈弯曲形状。 根据本发明，通过改善接地软板和屏蔽层之间的接合面积以及软板的形状，通过增加接合力和分散折叠应力，可以防止接地软板 在折叠或运输时与屏蔽层接触的部分脱落。

公开(公告)号：US20160316566A1

公开(公告)日：2016-10-27

申请号：US15138792

申请日：2016-04-26

Applicant: IBIDEN CO., LTD.

Inventor： Kenji SAKAI ,  Tomoyuki IKEDA ,  Toshiki FURUTANI

IPC: H05K1/18 ,  H05K3/46 ,  H05K3/32 ,  H05K1/02

CPC classification number: H05K1/185 ,  H01L2224/16227 ,  H05K1/0298 ,  H05K3/32 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/09009 ,  H05K2201/09536 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611

Abstract: A wiring board includes electronic components, a multilayer core substrate including insulating layers and conductive layers such that the insulating layers include a central insulating layer in the center position of the core in the thickness direction, a first build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core, and a second build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core. The core has cavities accommodating the electronic components, respectively, and including a first cavity and a second cavity such that the first and second cavities have different lengths in the thickness direction and are penetrating through the central layer at centers of the first and second cavities in the thickness direction.

Abstract translation: 布线板包括电子部件，包括绝缘层和导电层的多层芯基板，使得绝缘层包括在芯的厚度方向的中心位置的中心绝缘层，包括绝缘层的第一累积层和 导电层，使得所述绝缘层具有与所述芯中的绝缘层的树脂组合物不同的树脂组合物，以及包括绝缘层和导电层的第二堆积层，使得所述绝缘层具有与所述绝缘层不同的树脂组合物 核心中的绝缘层。 芯具有分别容纳电子元件的空腔，并且包括第一空腔和第二空腔，使得第一和第二空腔在厚度方向上具有不同的长度，并且在第一和第二空腔的中心穿过中心层 厚度方向。

公开(公告)号：US20160194759A1

公开(公告)日：2016-07-07

申请号：US14910966

申请日：2014-08-07

Applicant: LG CHEM, LTD.

Inventor： Jae Hyun KIM ,  Shin Hee JUN ,  Jae Jin KIM ,  Chee-Sung PARK ,  Eun Kyu SEONG ,  Su Jeong LEE ,  Cheol-Hee PARK ,  Han Nah JEONG ,  Sang Yun JUNG

IPC: C23C18/20 ,  H05K1/02 ,  C23C18/16

CPC classification number: C23C18/31 ,  C09D5/24 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1689 ,  C23C18/204 ,  C23C18/2053 ,  C23C18/22 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C25D5/02 ,  C25D5/56 ,  H05K1/0296 ,  H05K1/09 ,  H05K3/02 ,  H05K3/181 ,  H05K2201/09009

Abstract: Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers by a simplified process, and appropriately implementing the polymer resin products having white color or various colors, and the like, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed therefrom.The method for forming the conductive pattern by direct radiation of the electromagnetic wave includes: forming a first region having a predetermined surface roughness by selectively radiating the electromagnetic wave on a polymer resin substrate containing titanium dioxide (TiO2); forming a conductive seed on the polymer resin substrate; forming a metal layer by plating the polymer resin substrate having the conductive seed formed thereon; and removing the conductive seed and the metal layer from a second region of the polymer resin substrate, wherein the second region has surface roughness smaller than that of the first region.

Abstract translation: 提供一种通过简单的方法通过直接辐射能够在各种聚合物树脂产品或树脂层上形成精细导电图案的电磁波形成导电图案的方法，并适当地实施具有白色或各种颜色的聚合物树脂产品， 即使在聚合物树脂本身中也不含有特定的无机添加剂，也具有由其形成导电图案的树脂结构体。 通过电磁波的直接辐射形成导电图案的方法包括：通过在包含二氧化钛（TiO 2）的聚合物树脂基板上选择性地辐射电磁波，形成具有预定表面粗糙度的第一区域; 在聚合物树脂基材上形成导电种子; 通过对其上形成有导电种子的聚合物树脂基板进行电镀而形成金属层; 以及从所述聚合物树脂基板的第二区域去除所述导电种子和所述金属层，其中所述第二区域的表面粗糙度小于所述第一区域的表面粗糙度。

公开(公告)号：US20160052469A1

公开(公告)日：2016-02-25

申请号：US14779025

申请日：2014-03-10

Applicant: SUMITOMO WIRING SYSTEMS, LTD.

Inventor： Yuji Kawashima ,  Mitsuhiro Shimamura ,  Satoru Itou

IPC: B60R16/023 ,  H05K1/18 ,  H05K1/02 ,  H05K1/05

CPC classification number: B60R16/0231 ,  B60R16/0215 ,  H05K1/0296 ,  H05K1/05 ,  H05K1/181 ,  H05K7/02 ,  H05K2201/09009

Abstract: A wiring unit (U) for automatic transmission mounted in an automatic transmission of an automotive vehicle and configured to execute a control relating to a speed changing operation includes a wiring harness (WH), a ROM (1) connected to the wiring harness and a holding plate (2) made of metal for holding these. The holding plate (2) is formed with a holding portion (33) on which the ROM (1) is to be placed, and the holding portion (33) is integrally formed with a plurality of swaging pieces (36) for fixing the ROM (1) on the holding portion (33) by being swaged to the ROM (1). Further, the ROM (1) is formed with a positioning protrusion (37), and the holding portion (33) is formed with a receiving hole (39) into which the positioning protrusion (37) is aligned and fitted.

Abstract translation: 一种用于自动变速器的接线单元（U），其安装在机动车辆的自动变速器中，并被配置为执行与变速操作有关的控制，包括线束（WH），连接到线束的ROM（1）和 用金属制成的夹持板（2）用于固定。 保持板（2）形成有要放置ROM（1）的保持部分（33），并且保持部分（33）与用于固定ROM（1）的多个模锻件（36）整体形成， （1）上的保持部（33）上。 此外，ROM（1）形成有定位突起（37），保持部（33）形成有定位突起（37）对准并嵌合的接收孔（39）。

公开(公告)号：US20160021780A1

公开(公告)日：2016-01-21

申请号：US14797304

申请日：2015-07-13

Applicant: Infineon Technologies AG

Inventor： Alexander Schwarz

IPC: H05K7/20 ,  H05K1/09 ,  H05K1/03 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K7/205 ,  H01L23/13 ,  H01L23/15 ,  H01L23/367 ,  H01L23/49838 ,  H01L2224/32225 ,  H05K1/0204 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/303 ,  H05K2201/066 ,  H05K2201/09009 ,  H05K2201/09036 ,  H05K2201/09745

Abstract: A semiconductor module includes a carrier having a first carrier surface and a second carrier surface opposite the first carrier surface, a first semiconductor chip mounted over the first carrier surface and a heatsink coupled to the second carrier surface with a first heatsink surface facing the carrier. The second carrier surface or the first heatsink surface has at least one cavity in the form of one or more of dimples and trenches.

Abstract translation: 半导体模块包括具有第一载体表面和与第一载体表面相对的第二载体表面的载体，安装在第一载体表面上的第一半导体芯片和耦合到第二载体表面的散热器，其具有面向载体的第一散热器表面。 第二载体表面或第一散热表面具有凹坑和沟槽中的一个或多个形式的至少一个空腔。

公开(公告)号：US20150047884A1

公开(公告)日：2015-02-19

申请号：US14388381

申请日：2013-03-26

Applicant: JX Nippon Mining & Metals Corporation

Inventor： Tomota Nagaura ,  Michiya Kohiki ,  Terumasa Moriyama

IPC: H05K3/38 ,  H05K3/18 ,  H05K3/02 ,  H05K3/06 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/09 ,  B32B3/30 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2457/08 ,  C22C9/00 ,  C25D1/04 ,  C25D3/12 ,  C25D3/38 ,  C25D5/12 ,  C25D9/08 ,  H05K1/0313 ,  H05K3/022 ,  H05K3/025 ,  H05K3/06 ,  H05K3/181 ,  H05K3/188 ,  H05K3/381 ,  H05K3/383 ,  H05K3/388 ,  H05K2201/09009 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/12792 ,  Y10T428/12847 ,  Y10T428/12903 ,  Y10T428/1291

Abstract: Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 μm, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.

Abstract translation: 提供一种用于印刷电路板的铜箔，其在其至少一个表面上包括粗糙层。 在粗糙层中，粒子底部的平均粒径D1与粒子的底部相隔10％的粒子长度为0.2〜1.0μm，粒子长度L1与平均直径D1的比L1 / D1 在颗粒底部为15或更小。 在印刷电路板用铜箔中，当将具有粗糙层的印刷布线用铜箔层压到树脂上，然后通过蚀刻除去铜层时，占据具有凹凸的树脂粗糙面的孔面积之和为 20％以上。 本发明涉及开发用于半导体封装基板的铜箔，其可以避免电路侵蚀而不会导致铜箔的其它性能的劣化。 特别地，本发明的目的是提供一种用于印刷线路板的铜箔和铜箔的制造方法，其中可以通过改善粗糙层来提高铜箔和树脂之间的粘附强度 的铜箔。

公开(公告)号：US20140374143A1

公开(公告)日：2014-12-25

申请号：US14369356

申请日：2012-12-25

Applicant: TAIYO INK MFG. CO., LTD.

Inventor： Daichi Okamoto ,  Nobuhito Ito ,  Shoji Minegishi

IPC: H05K1/02 ,  G03F7/20 ,  G03F7/09

CPC classification number: H05K1/02 ,  G03F7/0045 ,  G03F7/0047 ,  G03F7/032 ,  G03F7/038 ,  G03F7/0388 ,  G03F7/094 ,  G03F7/095 ,  G03F7/105 ,  G03F7/20 ,  H05K3/287 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/09009 ,  H05K2201/09827 ,  H05K2203/0577 ,  H05K2203/0594

Abstract: The present invention provides a dry film which can obtain a solder resist having an excellent resolution while maintaining various characteristics including PCT resistance, a laminated structure such as a printed writing board, and a method of producing the laminated structure.A dry film comprising: a film; and a photosensitive resin layer formed on the film, wherein the absorption coefficient (α) of the photosensitive resin layer at a wavelength of 365 nm has an increase gradient or a decrease gradient from a surface of the photosensitive resin layer toward a surface of the film.

Abstract translation: 本发明提供了一种可以获得具有优异分辨率的阻焊剂的干膜，同时保持包括PCT电阻在内的各种特性，诸如印刷书写板的层压结构，以及制造层压结构的方法。 一种干膜，包括：膜; 以及形成在所述膜上的感光性树脂层，其中所述感光性树脂层在365nm的波长处的吸收系数（α）具有从所述感光性树脂层的表面朝向所述膜的表面的增加的梯度或降低的梯度 。