Three-dimensional multichip module
    56.
    发明授权
    Three-dimensional multichip module 有权
    三维多芯片模块

    公开(公告)号:US08598718B2

    公开(公告)日:2013-12-03

    申请号:US13587835

    申请日:2012-08-16

    IPC分类号: H01L23/52

    摘要: A three-dimensional multichip module includes a first integrated circuit chip having at least one first high-temperature functional area and one first low-temperature functional area, and at least one second integrated circuit chip having a second high-temperature functional area and a second low-temperature functional area. The second high-temperature functional area is arranged opposite the first low-temperature functional area. As an alternative, at least one low-temperature chip having only one low-temperature functional area can also be arranged between the first and second chips.

    摘要翻译: 三维多芯片模块包括具有至少一个第一高温功能区和一个第一低温功能区的第一集成电路芯片和至少一个具有第二高温功能区和第二高温功能区的第二集成电路芯片 低温功能区。 第二高温功能区与第一低温功能区相对。 作为替代,也可以在第一和第二芯片之间设置至少一个仅具有一个低温功能区的低温芯片。

    Cooling structures and methods
    60.
    发明授权
    Cooling structures and methods 有权
    冷却结构和方法

    公开(公告)号:US08269341B2

    公开(公告)日:2012-09-18

    申请号:US12275731

    申请日:2008-11-21

    IPC分类号: H01L23/34

    摘要: Cooling structures and methods, methods of manufacturing semiconductor devices, and semiconductor devices are disclosed. In one embodiment, a cooling structure for a semiconductor device includes at least one channel defined between a first workpiece and a second workpiece. The second workpiece is bonded to the first workpiece. The at least one channel is adapted to retain a fluid.

    摘要翻译: 公开了冷却结构和方法,制造半导体器件的方法和半导体器件。 在一个实施例中,用于半导体器件的冷却结构包括限定在第一工件和第二工件之间的至少一个通道。 第二工件结合到第一工件。 至少一个通道适于保持流体。