公开(公告)号：US20140264832A1

公开(公告)日：2014-09-18

申请号：US13802848

申请日：2013-03-14

申请人： Thorsten Meyer ,  Hans-Joachim Barth ,  Reinhard Mahnkopf ,  Sven Albers ,  Andreas Augustin ,  Christian Mueller

发明人： Thorsten Meyer ,  Hans-Joachim Barth ,  Reinhard Mahnkopf ,  Sven Albers ,  Andreas Augustin ,  Christian Mueller

IPC分类号： H01L23/00

CPC分类号： H01L24/17 ,  H01L23/5256 ,  H01L23/5382 ,  H01L25/0657 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/1703 ,  H01L2224/17107 ,  H01L2224/17154 ,  H01L2224/17181 ,  H01L2224/17517 ,  H01L2224/81193 ,  H01L2924/12042 ,  H01L2924/014 ,  H01L2924/00

摘要： A chip arrangement may include: a first chip including a first contact, a second contact, and a redistribution structure electrically coupling the first contact to the second contact; a second chip including a contact; and a plurality of interconnects electrically coupled to the second contact of the first chip, wherein at least one interconnect of the plurality of interconnects electrically couples the second contact of the first chip to the contact of the second chip.

摘要翻译： 芯片布置可以包括：第一芯片，其包括第一触点，第二触点和将第一触点电耦合到第二触点的再分配结构; 包括触点的第二芯片; 以及电耦合到第一芯片的第二触点的多个互连，其中多个互连件中的至少一个互连将第一芯片的第二触点电耦合到第二芯片的触点。

公开(公告)号：US20140252632A1

公开(公告)日：2014-09-11

申请号：US13786538

申请日：2013-03-06

申请人： Hans-Joachim Barth ,  Reinhard Mahnkopf ,  Thorsten Meyer ,  Sven Albers ,  Andreas Augustin ,  Christian Mueller

发明人： Hans-Joachim Barth ,  Reinhard Mahnkopf ,  Thorsten Meyer ,  Sven Albers ,  Andreas Augustin ,  Christian Mueller

IPC分类号： H01L23/538

CPC分类号： H01L23/5384 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/02375 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

摘要： A semiconductor device includes: a semiconductor chip; an extension layer extending laterally from a boundary of the semiconductor chip; a redistribution layer disposed over at least one side of the extension layer and the semiconductor chip, wherein the redistribution layer electrically couples at least one contact of the semiconductor chip to at least one contact of an interface, wherein at least a part of the interface extends laterally beyond the boundary of the semiconductor chip.

摘要翻译： 半导体器件包括：半导体芯片; 延伸层，其从半导体芯片的边界横向延伸; 重新分配层，其设置在所述延伸层和所述半导体芯片的至少一侧上，其中所述再分配层将所述半导体芯片的至少一个触点电耦合到界面的至少一个触点，其中所述界面的至少一部分延伸 横向超出半导体芯片的边界。

公开(公告)号：US20150282367A1

公开(公告)日：2015-10-01

申请号：US14227977

申请日：2014-03-27

申请人： Hans-Joachim Barth ,  Reinhard Mahnkopf ,  Sven Albers ,  Thorsten Meyer

发明人： Hans-Joachim Barth ,  Reinhard Mahnkopf ,  Sven Albers ,  Thorsten Meyer

IPC分类号： H05K7/02 ,  H05K13/00 ,  H05K3/36

CPC分类号： H05K7/02 ,  H01L23/3128 ,  H01L24/19 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06558 ,  H01L2924/15311 ,  H05K3/36 ,  H05K7/023 ,  H05K13/00 ,  H05K2203/06 ,  Y10T156/10

摘要： An electronic assembly that includes a first electronic component that includes a first substrate having a front side and a back side and at least one electronic assembly mounted on the front side of the first substrate, a second electronic component that includes a second substrate having a front side and a back side and at least one electronic assembly mounted on the front side of the second substrate, and wherein the back side of the first substrate is directly attached to the back side of the second substrate.

摘要翻译： 一种电子组件，其包括第一电子部件，所述第一电子部件包括具有前侧和后侧的第一基板和安装在所述第一基板的前侧上的至少一个电子组件，所述第二电子部件包括具有前部的第二基板 侧面和背面以及安装在第二基板的前侧上的至少一个电子组件，并且其中第一基板的背面直接附接到第二基板的背面。

公开(公告)号：US20150084165A1

公开(公告)日：2015-03-26

申请号：US14034854

申请日：2013-09-24

申请人： Reinhard Mahnkopf ,  Wolfgang Molzer ,  Bernd Memmler ,  Edmund Goetz ,  Hans-Joachim Barth ,  Sven Albers ,  Thorsten Meyer

发明人： Reinhard Mahnkopf ,  Wolfgang Molzer ,  Bernd Memmler ,  Edmund Goetz ,  Hans-Joachim Barth ,  Sven Albers ,  Thorsten Meyer

IPC分类号： H01L23/538 ,  H01L21/768 ,  H01L23/00 ,  H01L25/00 ,  H01L21/56 ,  H01L23/522 ,  H01L25/07

CPC分类号： H01L23/5389 ,  H01L21/56 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/3121 ,  H01L23/5226 ,  H01L23/5384 ,  H01L23/562 ,  H01L24/03 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/50 ,  H01L2224/08146 ,  H01L2224/16148 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2225/06568 ,  H01L2924/181 ,  H01L2924/00012

摘要： Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.

摘要翻译： 本说明书的实施例包括嵌入在微电子衬底中的堆叠微电子骰子及其制造方法。 在一个实施例中，至少一个第一微电子管芯连接到第二微电子管芯，其中在第二微电子管芯和至少一个第一微电子管芯之间提供底部填充材料。 然后通过将第一微电子管芯和第二微电子管芯层压在衬底材料中来形成微电子衬底。

公开(公告)号：US20150282308A1

公开(公告)日：2015-10-01

申请号：US14229476

申请日：2014-03-28

申请人： Thorsten Meyer ,  Gerald Ofner ,  Sven Albers ,  Reinhard Mahnkopf

发明人： Thorsten Meyer ,  Gerald Ofner ,  Sven Albers ,  Reinhard Mahnkopf

IPC分类号： H05K1/03 ,  H05K1/18 ,  H05K7/02 ,  H05K1/02

CPC分类号： H05K1/181 ,  H01L21/568 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5227 ,  H01L23/66 ,  H01L24/00 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/04042 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19105 ,  H05K1/0233 ,  H05K1/0292 ,  H05K1/162 ,  H05K1/165 ,  H05K1/185 ,  H05K3/4644 ,  H05K2201/10636 ,  H05K2203/1469 ,  H05K2203/171 ,  H05K2203/173 ,  H05K2203/175 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00

摘要： Passive electrical devices are described with a polymer carrier. In one example, a conductive layer is formed over a polymer substrate in a pattern to form a passive electrical device and at least two terminals of the device. A plurality of external connection pads are connected to the terminals of the device.

摘要翻译： 无源电器件用聚合物载体描述。 在一个示例中，导电层以图案形成在聚合物基板上，以形成无源电器件和器件的至少两个端子。 多个外部连接焊盘连接到设备的端子。

公开(公告)号：US20150084202A1

公开(公告)日：2015-03-26

申请号：US14038248

申请日：2013-09-26

申请人： Georg Seidemann ,  Sven Albers ,  Teodora Ossiander ,  Michael Skinner ,  Hans-Joachim Barth ,  Harald Gossner ,  Reinhard Mahnkoph ,  Christian Mueller ,  Wolfgang Molzer

发明人： Georg Seidemann ,  Sven Albers ,  Teodora Ossiander ,  Michael Skinner ,  Hans-Joachim Barth ,  Harald Gossner ,  Reinhard Mahnkoph ,  Christian Mueller ,  Wolfgang Molzer

IPC分类号： H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L24/09 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/80 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/03444 ,  H01L2224/0346 ,  H01L2224/03602 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/05013 ,  H01L2224/05014 ,  H01L2224/05015 ,  H01L2224/05016 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/06135 ,  H01L2224/06155 ,  H01L2224/06183 ,  H01L2224/08054 ,  H01L2224/08056 ,  H01L2224/08057 ,  H01L2224/08121 ,  H01L2224/08137 ,  H01L2224/08225 ,  H01L2224/09135 ,  H01L2224/09183 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16137 ,  H01L2224/48137 ,  H01L2224/80201 ,  H01L2224/80895 ,  H01L2224/81203 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/1434 ,  H01L2224/03 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An apparatus comprises a first integrated circuit (IC) die that includes a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, a second IC die including a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, wherein the second IC die is arranged adjacent to the first IC die, and includes an electrically conductive bond in contact with at least one of the top surface or the side surface of the multi-surface contact pad of the first IC die and the top surface of the multi-surface contact pad of the second IC die.

摘要翻译： 一种装置包括第一集成电路（IC）芯片，其包括顶层，底表面，从顶层的顶表面延伸到底表面的侧壁表面，以及至少一个多表面接触垫，第二 IC芯片包括顶层，底面，从顶层的顶表面延伸到底表面的侧壁表面，以及至少一个多表面接触焊盘，其中第二IC管芯被布置为与第一IC 并且包括与第一IC管芯的多表面接触焊盘的顶表面或侧表面中的至少一个与第二IC管芯的多表面接触焊盘的顶表面接触的导电接合 。

公开(公告)号：US20150235920A1

公开(公告)日：2015-08-20

申请号：US14181325

申请日：2014-02-14

申请人： Michael P. Skinner ,  Sven Albers ,  Harald Gossner ,  Peter Baumgartner ,  Hans-Joachim Barth

发明人： Michael P. Skinner ,  Sven Albers ,  Harald Gossner ,  Peter Baumgartner ,  Hans-Joachim Barth

IPC分类号： H01L23/467 ,  H01L23/473

CPC分类号： H01L23/467 ,  H01L23/473 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/00

摘要： Embodiments of flow diversion devices (FDDs) are disclosed herein. An FDD may include a body formed of a body material and a plurality of thermally deformable fins arranged along the body. Individual fins of the plurality of fins may include first and second materials having different coefficients of thermal expansion (CTEs). Other embodiments may be disclosed and/or claimed.

摘要翻译： 流分流装置（FDD）的实施例在此公开。 FDD可以包括由主体材料形成的主体和沿着主体布置的多个可热变形的翅片。 多个翅片中的各个翅片可以包括具有不同热膨胀系数（CTE）的第一和第二材料。 可以公开和/或要求保护其他实施例。

公开(公告)号：US20180095426A1

公开(公告)日：2018-04-05

申请号：US15282615

申请日：2016-09-30

申请人： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

发明人： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

IPC分类号： G04B37/14 ,  H04B1/3827 ,  A44C5/02 ,  A44C5/00 ,  A44C5/14

CPC分类号： G04B37/1486 ,  A44C5/0053 ,  A44C5/02 ,  A44C5/105 ,  A44C5/14 ,  G06F1/163 ,  H04B1/385 ,  H04B2001/3861 ,  H04W4/80

摘要： A flexible band wearable electronic device includes a plurality of rigid links. The flexible band wearable electronic device also includes a number of pivot joints coupling the plurality of rigid links together. The flexible band wearable electronic device further includes a first electronic device on a first of the plurality of rigid links, and a second electronic device on a second of the plurality of rigid links. The flexible band wearable electronic device still further includes an electrical communication pathway between first electronic device and the second electronic device and through at least a portion of one of the number of pivot joints.

公开(公告)号：US20140197530A1

公开(公告)日：2014-07-17

申请号：US13739045

申请日：2013-01-11

申请人： Thorsten Meyer ,  Sven Albers ,  Christian Geissler ,  Andreas Wolter ,  Markus Brunnbauer ,  David O'Sullivan ,  Frank Zudock ,  Jan Proschwitz

发明人： Thorsten Meyer ,  Sven Albers ,  Christian Geissler ,  Andreas Wolter ,  Markus Brunnbauer ,  David O'Sullivan ,  Frank Zudock ,  Jan Proschwitz

IPC分类号： H01L23/29 ,  H01L21/56

CPC分类号： H01L23/315 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/562 ,  H01L24/19 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device is described having at least one semiconductor chip, the chip having an active area on a top side thereof, the active area formed at least in part of low-k material, said low-k material defining a low-k subarea of said active area; an embedding material, in which said at least one semiconductor chip is embedded, at least part of the embedding material forming a coplanar area with said active area; at least one contact area within the low-k subarea; a redistribution layer on the coplanar area, the redistribution layer connected to said contact areas; at least one first-level interconnect, located outside said low-k subarea, the first-level interconnect electrically connected to at least one of said contact areas via the redistribution layer.

摘要翻译： 描述了半导体器件，其具有至少一个半导体芯片，该芯片在其顶侧具有有源区，至少部分形成在低k材料上的有源区，所述低k材料限定低k分区 说活跃区; 嵌入材料，其中所述至少一个半导体芯片被嵌入，所述嵌入材料的至少一部分与所述有源区域形成共面区域; 低k子区域内的至少一个接触区域; 在共面区域上的再分配层，再分配层连接到所述接触区域; 位于所述低k子区域外的至少一个第一级互连，所述第一级互连经由再分配层电连接到所述接触区域中的至少一个。

公开(公告)号：US20180092443A1

公开(公告)日：2018-04-05

申请号：US15282633

申请日：2016-09-30

申请人： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

发明人： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

IPC分类号： A44C5/02 ,  H04B1/3827 ,  A45F5/00 ,  A44C5/00 ,  G01D11/30 ,  A61B5/0205 ,  A61B5/00

CPC分类号： G06F1/163 ,  A44C5/00 ,  A44C5/02 ,  A44C5/105 ,  A45F5/00 ,  A45F2005/008 ,  A45F2200/0508 ,  A61B5/02055 ,  A61B5/021 ,  A61B5/02438 ,  A61B5/1112 ,  A61B5/681 ,  A61B2560/0257 ,  A61B2560/0443 ,  A61B2562/0219 ,  G04B37/1486 ,  G04B47/00 ,  H04B1/385

摘要： A flexible band wearable electronic device includes a plurality of rigid links. The flexible band wearable electronic device also includes a number of pivot joints coupling the plurality of rigid links together. The flexible band wearable electronic device further includes a first electronic device on a first of the plurality of rigid links, and a second electronic device on a second of the plurality of rigid links. The flexible band wearable electronic device still further includes an electrical communication pathway between first electronic device and the second electronic device and through at least a portion of one of the number of pivot joints.