公开(公告)号：US06818981B2

公开(公告)日：2004-11-16

申请号：US10765644

申请日：2004-01-26

申请人： Il Kwon Shim ,  Hermes T. Apale ,  Gerry Balanon

发明人： Il Kwon Shim ,  Hermes T. Apale ,  Gerry Balanon

IPC分类号： H01L2310

CPC分类号： H01L23/36 ,  H01L23/10 ,  H01L23/3677 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A PBGA package is provided. The heat spreader interfaces with the substrate with the standoff of the heat spreader. The stand-off of the heat spreader is provided with an opening, the stand-off of the heat spreader is aligned with the substrate of the PBGA package by means of a copper pad that is provided over a second surface of the substrate. A solder bump is further provided over the surface of the copper pad. Thermally conductive solder is deposited over the opening of the heat spreader and over the copper pad. If the heat spreader stand-off is aligned with contact pads, thermally conductive epoxy is deposited over the contact pads.

摘要翻译： 提供PBGA封装。 散热器与散热器的支架与基板相接。 散热器的支架设置有开口，散热器的支架通过设置在基板的第二表面上的铜垫与PBGA封装的基板对准。 在铜焊盘的表面上进一步设置焊料凸块。 导热焊料沉积在散热器的开口上并穿过铜焊盘。 如果散热器对接与接触垫对准，则导热环氧树脂沉积在接触垫上。

公开(公告)号：US06534859B1

公开(公告)日：2003-03-18

申请号：US10116983

申请日：2002-04-05

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Gerry Balanon

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Gerry Balanon

IPC分类号： H01L23495

CPC分类号： H01L23/4334 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A new method and package is provided for face-up packaging of semiconductor devices. The semiconductor device is mounted over the surface of a semiconductor device support surface using conventional methods of device packaging up through device bond wire interconnect to electrical traces on the surface of the semiconductor device support surface over which the device is mounted. An internal mold cap is formed over the device, the internal mold cap has an opening exposing the surface of the device. An external mold cap is formed surrounding the internal mold cap with a cavity separating the external mold cap from the internal mold cap. Thermally conductive epoxy is deposited in the opening of the internal mold cap and in the cavity between the internal and the external mold cap. The heat spreader is placed and attached after which a thermal epoxy and mold cure is applied to the package. The package is further completed by the application of contact balls to a first surface of the semiconductor device support surface, the semiconductor devices is mounted has been mounted over a second surface of the semiconductor device support surface.

摘要翻译： 为半导体器件的正面封装提供了一种新的方法和封装。 使用传统的器件封装技术将半导体器件安装在半导体器件支撑表面的表面上，该器件通过器件接合线互连连接到半导体器件支撑表面上安装器件的表面上的电迹线。 内部模具盖形成在该装置上方，内部模具帽具有露出装置表面的开口。 外部模具盖形成在内部模具盖周围，并且具有将外部模具盖与内部模具盖分离的空腔。 导热环氧树脂沉积在内部模具盖的开口中以及在内部和外部模具盖之间的空腔中。 放置和附接散热器，然后将热环氧树脂和模具固化施加到包装上。 通过将接触球施加到半导体器件支撑表面的第一表面来进一步完成封装，半导体器件被安装在半导体器件支撑表面的第二表面上。

公开(公告)号：US06489667B1

公开(公告)日：2002-12-03

申请号：US09422115

申请日：1999-10-20

申请人： Il Kwon Shim ,  Chang Kyu Park ,  Byung Joon Han ,  Vincent DiCaprio ,  Paul Hoffman

发明人： Il Kwon Shim ,  Chang Kyu Park ,  Byung Joon Han ,  Vincent DiCaprio ,  Paul Hoffman

IPC分类号： H01L23495

CPC分类号： H01L23/4334 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48739 ,  H01L2224/73215 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/48744

摘要： Semiconductor devices and methods of manufacturing such devices are disclosed. In one embodiment of this invention, a semiconductor chip is bonded to a first surface of a substrate. The substrate extends beyond the edge of the chip. Signal input/output pads on the chip are juxtaposed with an opening in the substrate. A molded support is formed on the portion of the first surface of the substrate that extends beyond between the sidewall of the edge of the chip. The support prevents bending of the substrate, and allows solder balls to be formed on the entire area of a second surface of the substrate opposite the first surface of the substrate. A heat dissipating plate is mounted on a surface of the chip opposite the substrate. The heat dissipating plate is attached to the support.

摘要翻译： 公开了半导体器件及其制造方法。 在本发明的一个实施例中，半导体芯片被接合到基板的第一表面。 衬底延伸超过芯片的边缘。 芯片上的信号输入/输出焊盘与衬底中的开口并置。 在衬底的第一表面的延伸超过芯片边缘的侧壁的部分之间形成模制支撑件。 支撑件防止基板的弯曲，并且允许在与基板的第一表面相对的基板的第二表面的整个区域上形成焊球。 散热板安装在与基板相对的芯片的表面上。 散热板附着在支架上。

公开(公告)号：US5864470A

公开(公告)日：1999-01-26

申请号：US883541

申请日：1997-06-25

申请人： Il Kwon Shim ,  Young Wook Heo ,  Robert Francis Darveaux

发明人： Il Kwon Shim ,  Young Wook Heo ,  Robert Francis Darveaux

IPC分类号： H01L23/12 ,  H01L23/14 ,  H01L23/367 ,  H01L23/498 ,  H01L23/50 ,  H05K7/06

CPC分类号： H01L24/32 ,  H01L23/3677 ,  H01L23/4985 ,  H01L23/50 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181

摘要： A flexible circuit board for a ball grid array semiconductor package including a flexible resin film, a plurality of electrically conductive traces formed on an upper surface of the resin film, the conductive traces having solder ball pads, and a die flag including a semiconductor chip paddle located on a central portion of the circuit board, the chip paddle having a plurality of heat-discharging and grounding solder ball pads, and a plurality of lattice-shaped traces adapted to electrically connect the solder ball pads, the traces being shaped into a lattice to prevent a bleed-out of a silver-filled epoxy resin, a ground bonding rim located around the chip paddle, and a plurality of radial traces adapted to electrically connect the chip paddle to the ground bonding rim, and the flexible resin film being perforated to define solder ball lands on lower surfaces of the solder ball pads. Since the semiconductor chip paddle has an enlarged opened portion, it is possible to minimize the gold plated region, thereby greatly reducing the manufacturing costs. It is also possible to minimize a deformation of the package caused by mechanical stress generated due to a difference in thermal expansion coefficient between different materials of package elements. A bleed-out of silver-filled epoxy resin is also surely prevented.

摘要翻译： 一种用于球栅阵列半导体封装的柔性电路板，包括柔性树脂膜，形成在树脂膜的上表面上的多个导电迹线，具有焊球垫的导电迹线和包括半导体芯片片的裸片标记 位于电路板的中心部分上的芯片焊盘具有多个放热和接地焊球焊盘，以及多个格子状迹线，用于电连接焊球焊盘，所述迹线被成形为格子 以防止银填充的环氧树脂渗漏，位于芯片焊盘周围的接地边缘，以及多个径向迹线，其适于将芯片焊盘电连接到接地边缘，并且柔性树脂膜被穿孔 以限定焊球的下表面上的焊球。 由于半导体芯片焊盘具有扩大的开口部分，因此可以使镀金区域最小化，从而大大降低制造成本。 也可能由于包装元件的不同材料之间的热膨胀系数的差异而产生的机械应力引起的包装变形最小化。 也可以防止银填充环氧树脂渗出。

公开(公告)号：US5729432A

公开(公告)日：1998-03-17

申请号：US588172

申请日：1996-01-18

申请人： Il Kwon Shim ,  Young Wook Heo

发明人： Il Kwon Shim ,  Young Wook Heo

IPC分类号： H01L23/12 ,  H01L23/13 ,  H01L23/31 ,  H01L23/34 ,  H01L23/498 ,  H05K7/20

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/32 ,  H01L2224/29007 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181

摘要： A BGA (ball grid array) semiconductor package with improved heat dissipation and dehumidification effect is disclosed. The above BGA package is provided with an open through slot on the chip mounting portion of the printed circuit board and/or the heat sink. The above through slot is occluded by neither the heat conductive epoxy resin nor the solder mask but is simply opened, thus directly exposing the bottom surface of the semiconductor chip to the outside of the package and effectively performing heat dissipation and dehumidification without causing any pop corn phenomenon during the dehumidification reflow. The size of the open through slot is not larger than the semiconductor chip. The open through slot is selected from among a rectangular slot, a large circular slot, a plurality of small circular slots, a radial slot, a cross slot or any combination thereof.

摘要翻译： 公开了具有改善的散热和除湿效果的BGA（球栅阵列）半导体封装。 上述BGA封装在印刷电路板和/或散热器的芯片安装部分上设置有开放通孔。 上述贯穿槽既不是导热环氧树脂也不是阻焊剂而被简单地打开，因此直接将半导体芯片的底面暴露于封装的外部，并且有效地进行散热和除湿，而不会引起任何流行的玉米 除湿回流期间的现象。 开放槽的尺寸不大于半导体芯片。 开放通槽选自矩形槽，大圆形槽，多个小圆形槽，径向槽，十字槽或其任何组合。

公开(公告)号：US09000579B2

公开(公告)日：2015-04-07

申请号：US11694912

申请日：2007-03-30

申请人： Il Kwon Shim ,  Dario S. Filoteo, Jr. ,  Emmanuel Espiritu ,  Rachel Layda Abinan

发明人： Il Kwon Shim ,  Dario S. Filoteo, Jr. ,  Emmanuel Espiritu ,  Rachel Layda Abinan

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L21/44 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85186 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An integrated circuit package system includes a substrate having an opening provided therein, forming a conductor in the opening having a closed end at the bottom, attaching an integrated circuit die over the substrate, and connecting a die interconnect to the integrated circuit die and the closed end of the conductor.

摘要翻译： 一种集成电路封装系统，包括其中设置有开口的基板，在该开口中形成在底部具有封闭端的导体，将集成电路裸片安装在基板上，并将芯片互连连接到集成电路管芯和封闭 导体末端。

公开(公告)号：US08957530B2

公开(公告)日：2015-02-17

申请号：US13023293

申请日：2011-02-08

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Seung Uk Yoon ,  Jong-Woo Ha

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/00 ,  H01L21/683 ,  H01L25/065 ,  H01L25/10

CPC分类号： H01L24/19 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

摘要： An integrated circuit packaging system includes: an integrated circuit device; a conductive post adjacent the integrated circuit device, the conductive post with a contact surface having characteristics of a shaped platform removed; and an encapsulant around the conductive post and the integrated circuit device with the conductive post extending through the encapsulant and each end of the conductive post exposed from the encapsulant.

摘要翻译： 一种集成电路封装系统，包括：集成电路器件; 邻近集成电路器件的导电柱，具有去除成形平台特征的接触表面的导电柱; 以及围绕导电柱和集成电路器件的密封剂，其中导电柱延伸穿过密封剂并且从密封剂暴露出的导电柱的每个端部。

公开(公告)号：US08951834B1

公开(公告)日：2015-02-10

申请号：US13931295

申请日：2013-06-28

申请人： Kyung Moon Kim ,  Il Kwon Shim ,  HeeJo Chi ,  HanGil Shin

发明人： Kyung Moon Kim ,  Il Kwon Shim ,  HeeJo Chi ,  HanGil Shin

IPC分类号： H01L21/00 ,  G01R31/26 ,  H01L21/66 ,  H01L23/02 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/56

CPC分类号： H01L21/565 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/15331 ,  H01L2924/18161 ,  H01L2924/00

摘要： Methods of forming solder balls for semiconductor packages using film-assisted molding include providing a substrate, forming a plurality of solder balls on the substrate where each solder ball has an initial profile, and coupling a substantially planar film to the solder balls. As an encapsulation is deposited over the substrate and around the solder balls, the substantially planar film and the encapsulation, along with the molding process, can cause each solder ball to morph from its initial profile to a final profile, where the final profile is generally different from the initial profile.

摘要翻译： 使用膜辅助成型形成用于半导体封装的焊球的方法包括提供衬底，在衬底上形成多个焊球，其中每个焊球具有初始形状，并将基本上平面的膜耦合到焊球。 当封装沉积在衬底上并且在焊球周围时，基本平坦的膜和封装以及模制过程可以使每个焊球从其初始轮廓变形到最终轮廓，其中最终轮廓通常 与初始配置文件不同。

公开(公告)号：US08912648B2

公开(公告)日：2014-12-16

申请号：US13231789

申请日：2011-09-13

申请人： Yaojian Lin ,  Il Kwon Shim ,  Seng Guan Chow

发明人： Yaojian Lin ,  Il Kwon Shim ,  Seng Guan Chow

IPC分类号： H01L23/04 ,  H01L23/16 ,  H01L23/00 ,  H01L21/56 ,  H01L23/552 ,  H01L23/31 ,  H01L21/683

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/11 ,  H01L24/19 ,  H01L24/20 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device has a stress relief buffer mounted to a temporary substrate in locations designated for bump formation. The stress relief buffer can be a multi-layer composite material such as a first compliant layer, a silicon layer formed over the first compliant layer, and a second compliant layer formed over the silicon layer. A semiconductor die is also mounted to the temporary substrate. The stress relief buffer can be thinner than the semiconductor die. An encapsulant is deposited between the semiconductor die and stress relief buffer. The temporary substrate is removed. An interconnect structure is formed over the semiconductor die, encapsulant, and stress relief buffer. The interconnect structure is electrically connected to the semiconductor die. A stiffener layer can be formed over the stress relief buffer and encapsulant. A circuit layer containing active devices, passive devices, conductive layers, and dielectric layers can be formed within the stress relief buffer.

摘要翻译： 半导体器件具有在指定用于凸块形成的位置中安装到临时衬底的应力释放缓冲器。 应力消除缓冲器可以是多层复合材料，例如第一顺应层，在第一柔性层上形成的硅层，以及形成在硅层上的第二柔性层。 半导体管芯也安装在临时衬底上。 应力消除缓冲器可以比半导体管芯更薄。 密封剂沉积在半导体管芯和应力释放缓冲器之间。 移除临时衬底。 在半导体管芯，密封剂和应力释放缓冲器上形成互连结构。 互连结构电连接到半导体管芯。 可以在应力消除缓冲器和密封剂上形成加强层。 可以在应力消除缓冲器内形成包含有源器件，无源器件，导电层和电介质层的电路层。

公开(公告)号：US08659113B2

公开(公告)日：2014-02-25

申请号：US13446741

申请日：2012-04-13

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

IPC分类号： H01L29/00

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An embedded semiconductor die package is made by mounting a frame carrier to a temporary carrier with an adhesive. The frame carrier includes die mounting sites each including a leadframe interconnect structure around a cavity. A semiconductor die is disposed in each cavity. An encapsulant is deposited in the cavity over the die. A package interconnect structure is formed over the leadframe interconnect structure and encapsulant. The package interconnect structure and leadframe interconnect structure are electrically connected to the die. The frame carrier is singulated into individual embedded die packages. The semiconductor die can be vertically stacked or placed side-by-side within the cavity. The embedded die packages can be stacked and electrically interconnected through the leadframe interconnect structure. A semiconductor device can be mounted to the embedded die package and electrically connected to the die through the leadframe interconnect structure.

摘要翻译： 嵌入式半导体管芯封装通过使用粘合剂将框架载体安装到临时载体上而制成。 框架载体包括每个包括围绕腔的引线框架互连结构的管芯安装位置。 半导体管芯设置在每个腔中。 将密封剂沉积在模具上的空腔中。 封装互连结构形成在引线框架互连结构和密封剂上。 封装互连结构和引线框互连结构电连接到管芯。 帧载体被分成单独的嵌入式芯片封装。 半导体管芯可以垂直堆叠或并排放置在腔内。 嵌入式管芯封装可以通过引线框互连结构堆叠并电互连。 半导体器件可以安装到嵌入式裸片封装并且通过引线框互连结构电连接到裸片。