Semiconductor wafer and method of fabricating an IC die
    63.
    发明授权
    Semiconductor wafer and method of fabricating an IC die 有权
    半导体晶片及其制造方法

    公开(公告)号:US09406347B2

    公开(公告)日:2016-08-02

    申请号:US14574597

    申请日:2014-12-18

    摘要: There is provided a semiconductor wafer comprising a plurality of replicated IC modules. Each replicated IC module is capable of forming an individual IC die. The semiconductor wafer further comprises inter-module cross-wafer electrical connections, and the replicated IC modules are further arranged to be cut into IC dies comprising multiple replicated IC modules.There is further provided a method of fabricating an IC die. The method comprises fabricating such a semiconductor wafer, determining a required configuration of replicated IC modules, identifying inter-module boundaries along which to cut the semiconductor wafer to achieve the required configuration of replicated IC modules, and cutting the semiconductor wafer along the identified inter-module boundaries to produce at least one IC die comprising the required configuration of replicated IC modules.

    摘要翻译: 提供了包括多个复制IC模块的半导体晶片。 每个复制的IC模块能够形成单个IC芯片。 半导体晶片还包括模块间晶片间电连接,并且复制IC模块还被布置成被切割成包括多个复制IC模块的IC模具。 还提供了一种制造IC芯片的方法。 该方法包括制造这样的半导体晶片,确定复制IC模块的所需配置,识别沿其切割半导体晶片以实现复制IC模块所需配置的模块间边界,以及沿着所识别的间隔区切割半导体晶片, 模块边界以产生至少一个包含复制IC模块所需配置的IC芯片。

    SYSTEM INCLUDING HIERARCHICAL MEMORY MODULES HAVING DIFFERENT TYPES OF INTEGRATED CIRCUIT MEMORY DEVICES
    65.
    发明申请
    SYSTEM INCLUDING HIERARCHICAL MEMORY MODULES HAVING DIFFERENT TYPES OF INTEGRATED CIRCUIT MEMORY DEVICES 有权
    包括具有不同类型的集成电路存储器件的分层存储器模块的系统

    公开(公告)号:US20160098354A1

    公开(公告)日:2016-04-07

    申请号:US14883916

    申请日:2015-10-15

    申请人: Rambus Inc.

    IPC分类号: G06F12/08 G06F3/06

    摘要: Volatile memory devices corresponding to a first memory hierarchy may be on a first memory module that is coupled to a memory controller by a first signal path. A nonvolatile memory device corresponding to a second memory hierarchy may be on a second memory module that is coupled to the first memory module by a second signal path. Memory transactions for the nonvolatile memory device may be transferred from the memory controller to the first memory hierarchy using the first signal path, and data associated with an accumulation of the memory transactions may be written from the first memory hierarchy to the second memory hierarchy using the second signal path and a first and second control signal. The first control signal may be generated in view of a detection of wear and the second control signal may be generated in view of a detection of a defect.

    摘要翻译: 对应于第一存储器层级的易失性存储器件可以在通过第一信号路径耦合到存储器控制器的第一存储器模块上。 对应于第二存储器层级的非易失性存储器件可以在通过第二信号路径耦合到第一存储器模块的第二存储器模块上。 可以使用第一信号路径将非易失性存储器件的存储器事务从存储器控制器传送到第一存储器层级,并且与存储器事务的累积有关的数据可以从第一存储器层次写入第二存储器层次, 第二信号路径和第一和第二控制信号。 考虑到磨损的检测可以产生第一控制信号,并且可以考虑到缺陷的检测而产生第二控制信号。

    FLEXIBLE COMMAND ADDRESSING FOR MEMORY
    69.
    发明申请
    FLEXIBLE COMMAND ADDRESSING FOR MEMORY 有权
    用于存储器的灵活的命令寻址

    公开(公告)号:US20140006699A1

    公开(公告)日:2014-01-02

    申请号:US13536663

    申请日:2012-06-28

    IPC分类号: G06F12/00

    摘要: Flexible command addressing for memory. An embodiment of a memory device includes a dynamic random-access memory (DRAM); and a system element coupled with the DRAM, the system element including a memory controller for control of the DRAM. The DRAM includes a memory bank, a bus, the bus including a plurality of pins for the receipt of commands, and a logic, wherein the logic provides for shared operation of the bus for a first type of command and a second type of command received on a first set of pins.

    摘要翻译: 内存灵活的命令寻址。 存储器件的实施例包括动态随机存取存储器(DRAM); 以及与DRAM耦合的系统元件,所述系统元件包括用于控制DRAM的存储器控​​制器。 DRAM包括存储体,总线,总线包括用于接收命令的多个引脚和逻辑,其中逻辑提供用于第一类型的命令的总线的共享操作和接收的第二类型的命令 在第一组引脚上。

    FLASH MEMORY MODULE AND MEMORY SUBSYSTEM
    70.
    发明申请
    FLASH MEMORY MODULE AND MEMORY SUBSYSTEM 有权
    闪存模块和存储器子系统

    公开(公告)号:US20130107443A1

    公开(公告)日:2013-05-02

    申请号:US13665181

    申请日:2012-10-31

    IPC分类号: G06F1/16

    CPC分类号: G11C5/04 G11C7/1003

    摘要: A mass storage memory module system including a memory module having memory holding members which can be connected to each other, and removably connected to a memory controller. One or more modular memory holding members can be connected to each other to expand the overall storage capacity of the memory module. The presently described expandable memory module does not have a storage capacity limit. A memory holding member includes a plate, a plane, a board and another material having at least one memory device, or, on which at least one memory device is held or to which at least one memory device is mounted.

    摘要翻译: 一种大容量存储器模块系统,包括具有能够彼此连接的存储器保持部件的存储器模块,并且可移除地连接到存储器控制器。 一个或多个模块化存储器保持构件可以彼此连接以扩展存储器模块的总体存储容量。 目前描述的可扩展存储器模块不具有存储容量限制。 存储器保持构件包括板,平面,板和具有至少一个存储器件的另一种材料,或者在其上保持至少一个存储器件或至少一个存储器件被安装在该存储器件上。