摘要:
A memory includes multiple non-volatile memory devices, each having multiple nonvolatile memory cells. A write controller is configured to stream bits to the memory devices using a write data channel that optimizes a speed of writing to the memory devices to provide writes at a first speed. A read controller is configured to read bits from the memory devices, at a second speed slower than the first speed, using a read channel. A bi-directional bus that both the write controller and the self-referenced read controller share to access the plurality of non-volatile memory devices.
摘要:
A memory includes non-volatile memory devices, each of which has multiple nonvolatile memory cells. A write controller streams bits to the memory devices in groups of N bits using a write data channel having write bus drivers, receivers and write bus topology that take advantage of high-speed signaling to optimize a speed of writing to the memory devices. Consecutive groups of bits are written to consecutive memory cells within respective memory devices. A self-referenced read controller reads bits from the memory devices using a read channel having read drivers, receivers, and read bus topology that include no design requirements for high-speed or low-latency data transmission.
摘要:
There is provided a semiconductor wafer comprising a plurality of replicated IC modules. Each replicated IC module is capable of forming an individual IC die. The semiconductor wafer further comprises inter-module cross-wafer electrical connections, and the replicated IC modules are further arranged to be cut into IC dies comprising multiple replicated IC modules.There is further provided a method of fabricating an IC die. The method comprises fabricating such a semiconductor wafer, determining a required configuration of replicated IC modules, identifying inter-module boundaries along which to cut the semiconductor wafer to achieve the required configuration of replicated IC modules, and cutting the semiconductor wafer along the identified inter-module boundaries to produce at least one IC die comprising the required configuration of replicated IC modules.
摘要:
Provided are a method and apparatus for a memory module to accept a command in multiple parts. A first half of a command is placed on a bus for a memory module in a first clock cycle. A chip select signal is placed on the bus for the memory module for the first half of the command. A second half of the command is placed on the bus in a second clock cycle following the first clock cycle, wherein the memory module accepts the second half of the command a delay interval from accepting the first half of the command.
摘要:
Volatile memory devices corresponding to a first memory hierarchy may be on a first memory module that is coupled to a memory controller by a first signal path. A nonvolatile memory device corresponding to a second memory hierarchy may be on a second memory module that is coupled to the first memory module by a second signal path. Memory transactions for the nonvolatile memory device may be transferred from the memory controller to the first memory hierarchy using the first signal path, and data associated with an accumulation of the memory transactions may be written from the first memory hierarchy to the second memory hierarchy using the second signal path and a first and second control signal. The first control signal may be generated in view of a detection of wear and the second control signal may be generated in view of a detection of a defect.
摘要:
Provided are a method and apparatus for determining a timing adjustment of output to a host memory controller in a first memory module coupled to a host memory controller and a second memory module over a bus. A determination is made of a timing adjustment based on at least one component in at least one of the first memory module and the second memory module. A timing of output to the host memory controller is adjusted based on the determined timing adjustment to match a timing of output at the second memory module.
摘要:
A memory system is provided, which includes a nonvolatile memory module including a plurality of nonvolatile memory devices, and a memory module controller configured to control the nonvolatile memory module. At least two nonvolatile memory devices of the plurality of nonvolatile memory devices are configured to store serial presence detect (SPD) information. The memory module controller is configured to read the SPD information from the nonvolatile memory module and to set a communication mode with the nonvolatile memory module based on the read SPD information.
摘要:
Provided is a device for use in a memory module coupled to a host memory controller over a bus, comprising memory module control logic to generate a request signal to a host memory controller having a pulse width greater than or equal to a minimum pulse width, wherein the minimum pulse width comprises a number of clock cycles needed to guarantee that the host memory controller detects the request signal, and wherein the pulse width of the request signal indicates at least one function in addition to the request signal to the host memory controller.
摘要:
Flexible command addressing for memory. An embodiment of a memory device includes a dynamic random-access memory (DRAM); and a system element coupled with the DRAM, the system element including a memory controller for control of the DRAM. The DRAM includes a memory bank, a bus, the bus including a plurality of pins for the receipt of commands, and a logic, wherein the logic provides for shared operation of the bus for a first type of command and a second type of command received on a first set of pins.
摘要:
A mass storage memory module system including a memory module having memory holding members which can be connected to each other, and removably connected to a memory controller. One or more modular memory holding members can be connected to each other to expand the overall storage capacity of the memory module. The presently described expandable memory module does not have a storage capacity limit. A memory holding member includes a plate, a plane, a board and another material having at least one memory device, or, on which at least one memory device is held or to which at least one memory device is mounted.