公开(公告)号：US20070205496A1

公开(公告)日：2007-09-06

申请号：US11799771

申请日：2007-05-03

申请人： Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John Riley ,  Ilyas Mohammed

发明人： Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John Riley ,  Ilyas Mohammed

IPC分类号： H01L23/02

CPC分类号： H01L23/49811 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.

摘要翻译： 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。

公开(公告)号：US20050285246A1

公开(公告)日：2005-12-29

申请号：US11140312

申请日：2005-05-27

申请人： Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John Riley ,  Ilyas Mohammed

发明人： Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John Riley ,  Ilyas Mohammed

IPC分类号： H01L23/02 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L25/10

CPC分类号： H01L23/49811 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate. The package includes a support element in contact with the microelectronic element and the compliant layer, whereby the support element overlies the outer region of the flexible substrate.

摘要翻译： 微电子封装包括具有面，触点和外周边的微电子元件，以及覆盖并与微电子元件的第一面间隔开的柔性基板，柔性基板的外部区域延伸超出微电子元件的外周边。 所述封装包括暴露在所述柔性基板的表面处并与所述微电子元件电互连的多个导电柱，其中至少一个所述导电柱设置在所述柔性基板的外部区域中，并且柔性层设置在所述柔性基板之间 微电子元件和柔性基板的第一面，其中柔性层覆盖设置在柔性基板的外部区域中的至少一个导电柱。 该封装包括与微电子元件和柔性层接触的支撑元件，由此支撑元件覆盖在柔性基板的外部区域上。

公开(公告)号：US09640437B2

公开(公告)日：2017-05-02

申请号：US12842612

申请日：2010-07-23

申请人： Vage Oganesian ,  Belgacem Haba ,  Craig Mitchell ,  Ilyas Mohammed ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Craig Mitchell ,  Ilyas Mohammed ,  Piyush Savalia

IPC分类号： H01L23/48 ,  H01L21/768 ,  B24C1/04 ,  B24C3/32 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L21/76898 ,  B24C1/045 ,  B24C3/322 ,  H01L23/481 ,  H01L23/4985 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L2224/03464 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/06181 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2224/05552 ,  H01L2924/00

摘要： A method of fabricating a microelectronic unit includes providing a semiconductor element having a front surface and a rear surface remote from the front surface, forming at least one first opening extending from the rear surface partially through the semiconductor element towards the front surface by directing a jet of fine abrasive particles towards the semiconductor element, and forming at least one conductive contact and at least one conductive interconnect coupled thereto. The semiconductor element can include a plurality of active semiconductor devices therein. The semiconductor element can include a plurality of conductive pads exposed at the front surface. Each conductive interconnect can extend within one or more of the first openings and can be coupled directly or indirectly to at least one of the conductive pads. Each of the conductive contacts can be exposed at the rear surface of the semiconductor element for electrical connection to an external device.

公开(公告)号：US09137903B2

公开(公告)日：2015-09-15

申请号：US13157722

申请日：2011-06-10

申请人： Teck-Gyu Kang ,  Wei-Shun Wang ,  Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

发明人： Teck-Gyu Kang ,  Wei-Shun Wang ,  Hiroaki Sato ,  Kiyoaki Hashimoto ,  Yoshikuni Nakadaira ,  Norihito Masuda ,  Belgacem Haba ,  Ilyas Mohammed ,  Philip Damberg

IPC分类号： H05K1/11 ,  H05K3/40 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L24/81 ,  B23K1/0016 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/8138 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/831 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/113 ,  H05K3/341 ,  H05K3/4007 ,  H05K2201/0195 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00014

摘要： A microelectronic assembly may include a substrate including a rigid dielectric layer having electrically conductive elements, a microelectronic element having a plurality of contacts exposed at a face thereof, and conductive vias extending through a compliant dielectric layer overlying the rigid dielectric layer. The vias electrically connect the substrate contacts respectively to the conductive elements, and the substrate contacts are joined respectively to the contacts of the microelectronic element. The vias, compliant layer and substrate contacts are adapted to appreciably relieve stress at the substrate contacts associated with differential thermal contact and expansion of the assembly.

摘要翻译： 微电子组件可以包括包括具有导电元件的刚性介电层的基板，具有在其表面暴露的多个触点的微电子元件以及延伸穿过刚性介电层上的柔性介电层的导电通孔。 通孔将基板触点分别电连接到导电元件，并且基板触点分别连接到微电子元件的触点。 通孔，柔性层和衬底触点适于明显地减轻与组件的差分热接触和膨胀相关联的衬底触点处的应力。

公开(公告)号：US09041133B2

公开(公告)日：2015-05-26

申请号：US13111258

申请日：2011-05-19

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L31/0232 ,  H01L27/146

CPC分类号： H01L27/14609 ,  H01L27/1461 ,  H01L27/14621 ,  H01L27/1464 ,  H01L27/14645

摘要： A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has an opening overlying at least one of first and second light sensing elements, the semiconductor region having a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face. A light-absorbing material overlies the semiconductor region within the opening above at least one of the light sensing elements such that the first and second light sensing elements receive light of substantially the same intensity.

摘要翻译： 提供一种用于背面照明的微电子图像传感器组件及其制造方法。 该组件包括具有在正面暴露的触点的微电子元件和被布置成通过后表面接收不同波长的光的光感测元件。 半导体区域具有覆盖第一和第二光感测元件中的至少一个的开口，该半导体区域在第一光感测元件和后表面之间具有第一厚度，在第二光感测元件与后表面之间具有第二厚度。 光吸收材料覆盖至少一个感光元件之内的开口内的半导体区域，使得第一和第二光感测元件接收基本上相同强度的光。

公开(公告)号：US08847380B2

公开(公告)日：2014-09-30

申请号：US12884649

申请日：2010-09-17

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： A01C1/04 ,  A01C1/00 ,  H01L21/50 ,  H01L21/283 ,  H01L25/065 ,  H01L23/00 ,  H01L23/48 ,  H01L25/00 ,  H01L21/768

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L23/50 ,  H01L24/03 ,  H01L24/05 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of fabricating a semiconductor assembly can include providing a semiconductor element having a front surface, a rear surface, and a plurality of conductive pads, forming at least one hole extending at least through a respective one of the conductive pads by processing applied to the respective conductive pad from above the front surface, forming an opening extending from the rear surface at least partially through a thickness of the semiconductor element, such that the at least one hole and the opening meet at a location between the front and rear surfaces, and forming at least one conductive element exposed at the rear surface for electrical connection to an external device, the at least one conductive element extending within the at least one hole and at least into the opening, the conductive element being electrically connected with the respective conductive pad.

摘要翻译： 制造半导体组件的方法可以包括提供具有前表面，后表面和多个导电焊盘的半导体元件，形成至少一个至少通过相应的一个导电焊盘延伸的孔， 形成从所述后表面至少部分地延伸半导体元件的厚度的开口，使得所述至少一个孔和所述开口在前表面和后表面之间的位置相遇，以及 形成在所述后表面处暴露的至少一个导电元件以电连接到外部装置，所述至少一个导电元件在所述至少一个孔内延伸并且至少进入所述开口中，所述导电元件与相应的导电垫电连接 。

公开(公告)号：US08841763B2

公开(公告)日：2014-09-23

申请号：US13097943

申请日：2011-04-29

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L23/12 ,  H01L23/00 ,  H01L23/538

CPC分类号： H01L25/50 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2225/06524 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/00

摘要： A microelectronic assembly can include first, second and third stacked substantially planar elements, e.g., of dielectric or semiconductor material, and which may have a CTE of less than 10 ppm/° C. The assembly may be a microelectronic package and may incorporate active semiconductor devices in one, two or more of the first, second or third elements to function cooperatively as a system-in-a-package. In one example, an electrically conductive element having at least a portion having a thickness less than 10 microns, may be formed by plating, and may electrically connect two or more of the first, second or third elements. The conductive element may entirely underlie a surface of another one of the substantially planar elements.

摘要翻译： 微电子组件可以包括例如电介质或半导体材料的第一，第二和第三堆叠的基本平坦的元件，并且其可以具有小于10ppm /℃的CTE。组件可以是微电子封装，并且可以并入有源半导体 在第一，第二或第三元件中的一个，两个或更多个元件中的装置可以协同地作为系统级封装。 在一个示例中，具有厚度小于10微米的至少一部分的导电元件可以通过电镀形成，并且可以电连接第一，第二或第三元件中的两个或更多个。 导电元件可以完全位于另一个基本上平面的元件的表面之下。

公开(公告)号：US08823165B2

公开(公告)日：2014-09-02

申请号：US13346185

申请日：2012-01-09

申请人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp ,  Ilyas Mohammed

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp ,  Ilyas Mohammed

IPC分类号： H01L23/34

CPC分类号： H01L23/481 ,  G11C5/04 ,  H01L23/12 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49838 ,  H01L23/538 ,  H01L23/5386 ,  H01L24/06 ,  H01L24/09 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L27/108 ,  H01L2224/0401 ,  H01L2224/061 ,  H01L2224/091 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/1203 ,  H01L2924/1205 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/15786 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/301 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package can include a substrate having first and second opposed surfaces, at least two pairs of microelectronic elements, and a plurality of terminals exposed at the second surface. Each pair of microelectronic elements can include an upper microelectronic element and a lower microelectronic element. The pairs of microelectronic elements can be fully spaced apart from one another in a horizontal direction parallel to the first surface of the substrate. Each lower microelectronic element can have a front surface facing the first surface of the substrate and a plurality of contacts at the front surface. A surface of each of the upper microelectronic elements can at least partially overlie a rear surface of the lower microelectronic element in its pair. The microelectronic package can also include electrical connections extending from at least some of the contacts of each lower microelectronic element to at least some of the terminals.

摘要翻译： 微电子封装可以包括具有第一和第二相对表面的衬底，至少两对微电子元件和在第二表面处暴露的多个端子。 每对微电子元件可以包括上微电子元件和下微电子元件。 这些微电子元件对可以在平行于衬底的第一表面的水平方向上彼此完全间隔开。 每个下部微电子元件可以具有面向基板的第一表面的前表面和在前表面处的多个触点。 每个上部微电子元件的表面可以至少部分地覆盖在其对中的下部微电子元件的后表面。 微电子封装还可以包括从每个下部微电子元件的至少一些触点延伸到至少一些端子的电连接。

公开(公告)号：US08816505B2

公开(公告)日：2014-08-26

申请号：US13193814

申请日：2011-07-29

申请人： Ilyas Mohammed ,  Belgacem Haba ,  Cyprian Uzoh

发明人： Ilyas Mohammed ,  Belgacem Haba ,  Cyprian Uzoh

IPC分类号： H01L23/48 ,  H01L21/283

CPC分类号： H01L23/5226 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/5329 ,  H01L2224/10135 ,  H01L2924/07811 ,  H01L2924/00

摘要： A component can include a substrate having a front surface and a rear surface remote therefrom, an opening extending from the rear surface towards the front surface, and a conductive via extending within the opening. The substrate can have a CTE less than 10 ppm/° C. The opening can define an inner surface between the front and rear surfaces. The conductive via can include a first metal layer overlying the inner surface and a second metal region overlying the first metal layer and electrically coupled to the first metal layer. The second metal region can have a CTE greater than a CTE of the first metal layer. The conductive via can have an effective CTE across a diameter of the conductive via that is less than 80% of the CTE of the second metal region.

摘要翻译： 部件可以包括具有远离其前表面和后表面的基板，从后表面朝向前表面延伸的开口以及在开口内延伸的导电通孔。 基底可以具有小于10ppm /℃的CTE。开口可以限定前表面和后表面之间的内表面。 导电通孔可以包括覆盖在内表面上的第一金属层和覆盖第一金属层并电耦合到第一金属层的第二金属区域。 第二金属区域可具有大于第一金属层的CTE的CTE。 导电通孔可以在导电通孔的直径上具有小于第二金属区域的CTE的80％的有效CTE。

公开(公告)号：US08742541B2

公开(公告)日：2014-06-03

申请号：US13182890

申请日：2011-07-14

申请人： Ilyas Mohammed ,  Belgacem Haba ,  Cyprian Uzoh ,  Piyush Savalia ,  Vage Oganesian

发明人： Ilyas Mohammed ,  Belgacem Haba ,  Cyprian Uzoh ,  Piyush Savalia ,  Vage Oganesian

IPC分类号： H01L21/02 ,  H01L27/108 ,  H01L29/94

CPC分类号： H01L23/642 ,  H01G4/06 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L25/0657 ,  H01L25/16 ,  H01L28/40 ,  H01L28/91 ,  H01L28/92 ,  H01L2223/6622 ,  H01L2924/0002 ,  H01L2924/00

摘要： A capacitor can include a substrate having a first surface, a second surface remote from the first surface, and a through opening extending between the first and second surfaces, first and second metal elements, and a capacitor dielectric layer separating and insulating the first and second metal elements from one another at least within the through opening. The first metal element can be exposed at the first surface and can extend into the through opening. The second metal element can be exposed at the second surface and can extend into the through opening. The first and second metal elements can be electrically connectable to first and second electric potentials. The capacitor dielectric layer can have an undulating shape.

摘要翻译： 电容器可以包括具有第一表面的基板，远离第一表面的第二表面，以及在第一和第二表面之间延伸的通孔，第一和第二金属元件以及将第一和第二表面分离和绝缘的电容器介电层 至少在通孔内的金属元​​件彼此之间。 第一金属元件可以在第一表面暴露并且可以延伸到通孔中。 第二金属元件可以在第二表面处露出并且可以延伸到通孔中。 第一和第二金属元件可以电连接到第一和第二电位。 电容器介电层可以具有起伏的形状。