公开(公告)号：US20060033190A1

公开(公告)日：2006-02-16

申请号：US11257428

申请日：2005-10-24

申请人： Larry Kinsman ,  Walter Moden ,  Warren Farnworth

发明人： Larry Kinsman ,  Walter Moden ,  Warren Farnworth

IPC分类号： H01L23/02

CPC分类号： H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： A semiconductor device package includes a die, a package encapsulating at least a portion of the die, and a plurality of leads. Each lead of the plurality includes an external portion. The external portion of each lead is substantially planar and extends outward from a bottom edge of the package. The external portion of each lead may be oriented in a plane that is substantially parallel to a plane within which the die is located. A semiconductor device including these features may be part of an assembly that also includes an alignment device for orienting the semiconductor device package in nonparallel relation to a substrate.

摘要翻译： 半导体器件封装包括管芯，封装至少一部分裸片的封装以及多个引线。 多个的每个引线包括外部部分。 每个引线的外部部分基本上是平面的并且从封装的底部边缘向外延伸。 每个引线的外部部分可以在基本上平行于管芯所在的平面的平面内取向。 包括这些特征的半导体器件可以是组件的一部分，该组件还包括用于将半导体器件封装以非平行关系定向到衬底的对准装置。

公开(公告)号：US20060003549A1

公开(公告)日：2006-01-05

申请号：US11216866

申请日：2005-08-31

申请人： Alan Wood ,  Warren Farnworth ,  David Hembree ,  Sidney Rigg ,  William Hiatt ,  Peter Benson ,  Kyle Kirby ,  Salman Akram

发明人： Alan Wood ,  Warren Farnworth ,  David Hembree ,  Sidney Rigg ,  William Hiatt ,  Peter Benson ,  Kyle Kirby ,  Salman Akram

IPC分类号： H01L21/30

CPC分类号： G03F7/0037 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  G03F7/0047

摘要： A fabrication substrate for use in fabricating integrated circuits and other electronic devices includes a substrate that comprises semiconductor material, as well as a support structure on an active surface of the substrate. The support structure is located at or adjacent to an entire outer peripheral edge of the substrate. The support structure may be configured as a ring-like element or as a member which substantially covers an active surface of the semiconductor substrate and forms a protective structure over each semiconductor device carried by the active surface.

摘要翻译： 用于制造集成电路和其它电子器件的制造衬底包括：衬底，其包含半导体材料，以及在衬底的有源表面上的支撑结构。 支撑结构位于或邻近基板的整个外周边缘。 支撑结构可以被构造为环状元件或者作为基本上覆盖半导体衬底的有源表面并且在由有源表面承载的每个半导体器件上形成保护结构的构件。

公开(公告)号：US20060003481A1

公开(公告)日：2006-01-05

申请号：US11216959

申请日：2005-08-31

申请人： Warren Farnworth ,  Alan Wood

发明人： Warren Farnworth ,  Alan Wood

IPC分类号： H01L21/00 ,  H01L29/06

CPC分类号： H01L23/3128 ,  G01R1/0483 ,  G01R3/00 ,  G01R31/2867 ,  H01L21/4846 ,  H01L23/32 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0218 ,  H05K1/113 ,  H05K3/027 ,  H05K2201/09363 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method for fabricating semiconductor components such as printed circuit boards, multi chip modules, chip scale packages, and test carriers is provided. The method includes providing a substrate having a blanket deposited conductive layer thereon. Using a laser machining process, grooves are formed in the conductive layer to define patterns of conductors on the substrate. The conductors can be formed with a desired size and spacing, and can include features such as bond pads, conductive vias, and external ball contacts. In addition, selected conductors can be configured as co-planar ground or voltage traces, for adjusting impedance values in other conductors configured as signal traces.

公开(公告)号：US20060001150A1

公开(公告)日：2006-01-05

申请号：US11219134

申请日：2005-09-01

申请人： Larry Kinsman ,  Walter Moden ,  Warren Farnworth

发明人： Larry Kinsman ,  Walter Moden ,  Warren Farnworth

IPC分类号： H01L23/48

CPC分类号： H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： A semiconductor device including a plurality of stub contacts extending from a single edge thereof. A complementary alignment device includes at least one receptacle for receiving the semiconductor device. The alignment device is securable to a carrier substrate. A contact element may be configured to bias the semiconductor device in such a way as to establish and maintain electrical communication between the semiconductor device and the carrier substrate.

摘要翻译： 一种半导体器件，包括从其单个边缘延伸的多个短截线触点。 互补对准装置包括用于接收半导体器件的至少一个插座。 对准装置可固定到载体基板。 接触元件可以被配置为以这样的方式偏置半导体器件，以便建立和维持半导体器件和载体衬底之间的电连通。

公开(公告)号：US20050287783A1

公开(公告)日：2005-12-29

申请号：US10879838

申请日：2004-06-29

申请人： Kyle Kirby ,  Salman Akram ,  David Hembree ,  Sidney Rigg ,  Warren Farnworth ,  William Hiatt

发明人： Kyle Kirby ,  Salman Akram ,  David Hembree ,  Sidney Rigg ,  Warren Farnworth ,  William Hiatt

IPC分类号： H01L21/44 ,  H01L21/4763 ,  H01L21/768 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H05K1/03 ,  H05K3/40 ,  H05K3/42

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0306 ,  H05K3/4038 ,  H05K3/422 ,  H05K3/423 ,  H05K2201/0305 ,  H05K2201/09827 ,  H05K2203/072 ,  H05K2203/1147 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backside. The substrate has a microelectronic die including an integrated circuit and a terminal operatively coupled to the integrated circuit. The method also includes forming a passage at least partially through the substrate and having an opening at the front side and/or backside of the substrate. The method further includes sealing the opening with a conductive cap that closes one end of the passage while another end of the passage remains open. The method then includes filling the passage with a conductive material.

摘要翻译： 本文公开了微电子器件，用于封装微电子器件的方法，以及用于在微电子器件中形成互连的方法。 在一个实施例中，一种方法包括提供具有正面和背面的微电子衬底。 衬底具有包括集成电路的微电子管芯和可操作地耦合到集成电路的端子。 该方法还包括至少部分地形成通过基底并且在基底的前侧和/或后侧具有开口的通道。 该方法还包括用封闭通道一端的导电盖密封开口，同时通道的另一端保持打开。 该方法然后包括用导电材料填充通道。

公开(公告)号：US20050282383A1

公开(公告)日：2005-12-22

申请号：US11212226

申请日：2005-08-25

申请人： Warren Farnworth

发明人： Warren Farnworth

IPC分类号： G03F7/00 ,  H01L21/48 ,  H01L21/68 ,  H01L21/768 ,  H01L23/48 ,  H01L23/498 ,  H05K3/00 ,  H05K3/44 ,  H01L21/44 ,  H01L21/31 ,  H01L21/469 ,  H01L21/4763

CPC分类号： H01L21/4763 ,  B29C64/106 ,  B29C64/135 ,  G03F7/0037 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76831 ,  H01L21/76898 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2221/6835 ,  H01L2223/6622 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/445 ,  H05K2203/107 ,  H05K2203/1476 ,  H01L2924/00

摘要： An insulative coating for an aperture of a semiconductor device component includes a plurality of adjacent, mutually adhered regions. The adjacent, mutually adhered regions may be formed by programmed material consolidation processes, such as stereolithography. Such an insulative coating may electrically isolate conductive features, such as conductive vias, from the substrate of a semiconductor device component.

摘要翻译： 用于半导体器件部件的孔的绝缘涂层包括多个相邻的相互粘合的区域。 相邻的相互粘合的区域可以通过程序化材料固结方法形成，例如立体光刻。 这种绝缘涂层可以将导电特征（例如导电通孔）与半导体器件部件的衬底电隔离。

公开(公告)号：US20050251282A1

公开(公告)日：2005-11-10

申请号：US11155947

申请日：2005-06-17

申请人： Warren Farnworth ,  Mark Johnson

发明人： Warren Farnworth ,  Mark Johnson

IPC分类号： B29C31/00 ,  B29C67/00 ,  B29C70/70 ,  G01R31/26 ,  G06F19/00 ,  H01L21/00

CPC分类号： H01L21/67259 ,  B29C64/135 ,  B29C70/70 ,  B29L2031/3061 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  B33Y80/00 ,  H01L21/67126 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： A method and apparatus for applying packaging material to workpieces, with a high degree of precision, and resulting articles. A machine vision system including at least one camera is operably associated with a computer controlling a system for application of material so that the system may recognize the position and orientation of workpieces proximate to which the material is to be applied. The requirement for precise mechanical workpiece alignment is eliminated, and the ability of the machine vision system to recognize size, configuration and topography of different workpieces affords greater manufacturing flexibility. The method includes application of flowable material in separate volumes and draws formation of the material to at least a semisolid state for packaging electronic components, and the electronic components so packaged are also part of the invention.

摘要翻译： 一种用于将包装材料以高精度应用于工件的方法和装置，以及所得制品。 包括至少一个相机的机器视觉系统与控制用于施加材料的系统的计算机可操作地相关联，使得系统可以识别靠近该材料的工件的位置和取向。 消除了对精密机械工件对准的要求，并且机器视觉系统识别不同工件的尺寸，配置和形貌的能力提供了更大的制造灵活性。 该方法包括将可流动材料应用于分开的体积中并且将材料的形成作为包装电子部件的至少半固体状态，并且如此包装的电子部件也是本发明的一部分。

公开(公告)号：US20050230810A1

公开(公告)日：2005-10-20

申请号：US11151928

申请日：2005-06-14

申请人： Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

发明人： Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

IPC分类号： G01R1/073 ,  H01L21/66 ,  H01L23/48 ,  H01L23/498 ,  H01L23/58 ,  H01R13/24 ,  H05K3/32 ,  H05K3/40 ,  H05K7/06 ,  H05K7/10

CPC分类号： G01R1/0735 ,  G01R1/07314 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/714 ,  H01R13/24 ,  H01R2201/20 ,  H05K3/326 ,  H05K7/1069 ,  H05K2201/0314 ,  H05K2201/09036 ,  H05K2201/10378 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599

摘要： A compliant contact pin assembly and a contactor card are provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

摘要翻译： 提供了柔性接触销组件和接触器卡。 柔性接触销组件包括由衬底的一部分形成的接触针，其中触发销通过柔性耦合结构顺应地保持悬挂在衬底内。 衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。 接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。 在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

公开(公告)号：US20050229393A1

公开(公告)日：2005-10-20

申请号：US11152496

申请日：2005-06-14

申请人： Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

发明人： Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

IPC分类号： G01R1/073 ,  H01L21/66 ,  H01L23/48 ,  H01L23/498 ,  H01L23/58 ,  H01R13/24 ,  H05K3/32 ,  H05K3/40 ,  H05K7/06 ,  H05K7/10

CPC分类号： G01R1/0735 ,  G01R1/07314 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/714 ,  H01R13/24 ,  H01R2201/20 ,  H05K3/326 ,  H05K7/1069 ,  H05K2201/0314 ,  H05K2201/09036 ,  H05K2201/10378 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599

摘要： A compliant contact pin assembly method for making is provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

摘要翻译： 提供了一种用于制造的柔性接触销组装方法。 柔性接触销组件包括由衬底的一部分形成的接触针，其中触发销通过柔性耦合结构顺应地保持悬挂在衬底内。 衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。 接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。 在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

公开(公告)号：US20050191913A1

公开(公告)日：2005-09-01

申请号：US10788941

申请日：2004-02-27

申请人： Warren Farnworth ,  William Hiatt ,  Charles Watkins

发明人： Warren Farnworth ,  William Hiatt ,  Charles Watkins

IPC分类号： H01R4/48 ,  H01R13/24

CPC分类号： H01R13/02 ,  B33Y30/00 ,  B33Y80/00 ,  H01R13/2414 ,  H01R2201/20

摘要： An electrical contact for use with a semiconductor device, a carrier, a probe card, or another substrate includes a stereolithographically fabricated portion, which may comprise a plurality of at least partially superimposed, contiguous, mutually adhered layers. The electrical contact may include a dielectric core and a conductive coating on at least a portion thereof, or it may be completely formed from conductive material. The electrical contact may be rigid or flexible and resilient. Protective structures for use with flexible resilient contacts prevent deformation of such contacts beyond their elastic limits. Probe cards are also disclosed, as are methods for fabricating the electrical contacts, protective structures, and probe cards.

摘要翻译： 与半导体器件，载体，探针卡或另一基底一起使用的电触点包括立体光刻制造部分，其可以包括多个至少部分重叠的邻接的相互附着的层。 电接触可以在其至少一部分上包括介质芯和导电涂层，或者它可以由导电材料完全形成。 电触点可以是刚性的或柔性的和弹性的。 与柔性弹性触点一起使用的保护结构可防止这种触点变形超出其弹性极限。 还公开了探针卡，以及制造电触点，保护结构和探针卡的方法。