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    Anisotropically compliant horns for ultrasonic vibratory solid-state bonding
    76.
    发明申请
    Anisotropically compliant horns for ultrasonic vibratory solid-state bonding 审中-公开
    用于超声波振动固态接合的各向异性合适的喇叭

    公开(公告)号：US20100040903A1

    公开(公告)日：2010-02-18

    申请号：US12192075

    申请日：2008-08-14

    申请人： Andrew S. Kalt ,  Marvin Keshner ,  Donald Winston Rice ,  Frederick A. Stawitcke ,  Jessie Ramirez Sanchez

    发明人： Andrew S. Kalt ,  Marvin Keshner ,  Donald Winston Rice ,  Frederick A. Stawitcke ,  Jessie Ramirez Sanchez

    IPC分类号： B32B15/01 ,  B23K20/10

    CPC分类号： B23K20/106 ,  B23K20/002 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01029 ,  Y10T428/12493 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/206

    摘要： A horn for vibratory solid-state ultrasonic welding of metals and similarly-behaved materials “self-levels” to produce wide continuous seams or large-area spot-welds between delicate workpieces without damage, even if the workpieces are not perfectly flat and parallel to the nominal toolface angle. The horn toolface flexes under pressure to conform to skew-angled workpieces because it is disposed on a tool head supported by a tool neck cut from the tool body. The tool head, the tool neck, or both are anisotropically compliant. When resonances are properly optimized for typical VSS modes of vibration, atypical but useful localized modes are excited at the compliant toolface edges, actually intensifying the bond energy where one might normally expect unwanted damping. Various design approaches optimize the characteristics of the tool head and tool neck to various materials and bonding configurations. The horns can be configured for use with existing ultrasonic welders.

    摘要翻译： 用于金属和类似行为的材料的振动固态超声波焊接的喇叭用于“自我级别”，以在不损坏的工件之间产生宽阔的连续接缝或大面积点焊，即使工件不是完全平坦且平行 标称工具面角度。 喇叭工具表面在压力下弯曲以符合斜角工件，因为它设置在由从工具主体切割的工具颈部支撑的工具头上。 工具头，工具颈部或两者都是各向异性的。 当对于典型的VSS振动模式适当地优化谐振时，非标准但有用的局部模式在兼容的工具面边缘处被激发，实际上增强了通常可能期望不希望的阻尼的结合能。 各种设计方法将刀头和刀颈的特性优化到各种材料和接合结构。 喇叭可以配置用于现有的超声波焊接机。

    Wire bond encapsulant application control
    77.
    发明授权
    Wire bond encapsulant application control 有权
    电线键合密封剂应用控制

    公开(公告)号：US07659141B2

    公开(公告)日：2010-02-09

    申请号：US11860541

    申请日：2007-09-25

    申请人： Laval Chung-Long-Shan ,  Kiangkai Tankongchumruskul ,  Kia Silverbrook

    发明人： Laval Chung-Long-Shan ,  Kiangkai Tankongchumruskul ,  Kia Silverbrook

    IPC分类号： H01L21/00

    CPC分类号： H01L23/3157 ,  H01L21/56 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/78 ,  H01L2224/8592 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/20753 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/20754 ,  H01L2224/05599

    摘要： A method of applying encapsulant to a die mounted to a support structure by providing a die mounted to the support structure, the die having a back surface in contact with the support structure and an active surface opposing the back surface, the active surface having electrical contact pads, positioning a barrier proximate the electrical contact pads and spaced from the active surface to define a gap and, depositing a bead of encapsulant onto the electrical contact pads such that one side of the bead contacts the barrier and a portion of the bead extends into the gap and onto the active surface. Placing a barrier over the active surface so that it defines a narrow gap allows the geometry of the encapsulant front (the line of contact between the encapsulant and the active surface) can be more closely controlled. Any variation in the flowrate of encapsulant from the needle tends to cause bulges or valleys in the height of the bead and or the PCB side of the bead. The fluidic resistance generated by the gap between the barrier and the active surface means that the amount of encapsulant that flows into the gap and onto the active surface is almost constant. The reduced flow variations make the encapsulant front closely correspond to the shape of the barrier. Greater control of the encapsulant front allows the functional elements of the active surface of the die to be closer to the contact pads.

    摘要翻译： 一种通过提供安装到支撑结构的模具将密封剂施加到安装到支撑结构上的模具的方法，模具具有与支撑结构接触的后表面和与背面相对的活动表面，活性表面具有电接触 焊盘，邻近电接触焊盘定位屏障并且与有源表面间隔开以限定间隙，并且将密封剂珠填充到电接触焊盘上，使得焊道的一侧接触屏障并且一部分焊珠延伸成 间隙和活动表面。 在活性表面上设置阻挡层，使得其限定窄的间隙允许密封剂前部的几何形状（密封剂和活性表面之间的接触线）可以被更加严密地控制。 密封剂从针头流出的任何变化趋向于在珠子的高度和珠子的PCB侧产生凸起或凹陷。 由阻挡层和活性表面之间的间隙产生的流体阻力意味着流入间隙和活性表面上的密封剂的量几乎恒定。 减少的流动变化使得密封剂前端紧密对应于屏障的形状。 密封剂前沿的更好的控制允许模具的有效表面的功能元件更接近接触垫。