公开(公告)号：US09936577B1

公开(公告)日：2018-04-03

申请号：US15703257

申请日：2017-09-13

Applicant: WIESON TECHNOLOGIES CO., LTD.

Inventor： Qiang-Long Hu ,  Wen-Sheng Liu

IPC: H05K1/11 ,  H01R12/62 ,  G06F13/40 ,  H01R12/59 ,  H01R43/20 ,  H05K3/36 ,  H05K1/14 ,  H05K1/02

CPC classification number: H05K1/11 ,  G06F13/409 ,  H01R12/592 ,  H01R12/62 ,  H01R12/79 ,  H01R43/20 ,  H05K1/0284 ,  H05K1/117 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/2009

Abstract: The present disclosure illustrates a dual-channel flexible circuit bridge connector and a dual graphics card system using the same. The dual-channel flexible circuit bridge connector includes a dual-channel flexible circuit board, a first connection interface and a second connection interface. The dual-channel flexible circuit board includes, in a sequential order, a first insulating layer, a first circuit layer, a second insulating layer, a ground layer, a third insulating layer, a second circuit layer and a fourth insulating layer. The first connection interface and the second connection interface can be used to link two graphics cards spaced apart by a non-fixed distance, thereby forming a bridging status. Therefore, the dual graphics card system can manipulate two graphics cards to perform parallel computation, so as to achieve better efficiency in computing process and graphics display.

公开(公告)号：US09905947B2

公开(公告)日：2018-02-27

申请号：US15292746

申请日：2016-10-13

Applicant: Lear Corporation

Inventor： Ferran Juanes Ribas ,  Montserrat Piñol Pedret ,  Enric Aparicio Rollan

IPC: H01R12/00 ,  H01R12/71 ,  H01R4/02 ,  H01R12/58 ,  H01R43/02 ,  H01R43/20 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K3/28

CPC classification number: H01R12/716 ,  H01R4/028 ,  H01R12/58 ,  H01R43/0256 ,  H01R43/205 ,  H05K1/181 ,  H05K1/182 ,  H05K3/28 ,  H05K3/282 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10295 ,  H05K2201/1031 ,  H05K2203/1327

Abstract: In examples of the present disclosure, a vented electrical terminal block may include a body that may be configured to support a plurality of electrical terminals In examples, the body may include a plurality of side walls that may extend from the body. The body may include a plurality of apertures extending through the body. A cavity may be defined by an underside of the body. The cavity may receive a cavity fluid. In examples, at least one side wall may include an opening for receiving a sealing fluid, and apertures may be configured to vent said cavity fluid from the cavity when sealing fluid is introduced into the cavity via the opening.

公开(公告)号：US20180040987A1

公开(公告)日：2018-02-08

申请号：US15786795

申请日：2017-10-18

Applicant: Bel Fuse (Macao Commercial Offshore) Limited

Inventor： Richard D. Marowsky ,  Yakov Belopolsky ,  David H. Gutter

IPC: H01R13/6466 ,  H05K1/02 ,  H01R13/6463 ,  H01R13/66 ,  H01R24/64 ,  H01R24/28

CPC classification number: H01R13/6466 ,  H01R13/6463 ,  H01R13/665 ,  H01R24/28 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/117 ,  H05K2201/09063 ,  H05K2201/10295 ,  H05K2201/10356

Abstract: A modular connector plug includes controlled capacitances to compensate for near end cross talk at the connector interface created by interaction of signals having signal frequencies in a data transmission bandwidth. A printed circuit board (PCB) is configured to receive cable pairs, and a connector assembly includes first and fourth plug contacts corresponding to the first cable pair and second and third plug contacts corresponding to the second cable pair. First ends of each contact are connected to the PCB, and second ends extend in parallel with each other and transversely to the PCB length, collectively defining a contact interface proximate the contact end. Each contact has a maximum width at the contact interface, with at least one plug contact having a maximum width greater than the maximum width of another plug contact. Each contact accordingly defines an electrode of a compensating capacitance formed between adjacent pairs of plug contacts.

公开(公告)号：US20170314922A1

公开(公告)日：2017-11-02

申请号：US15142064

申请日：2016-04-29

Applicant: Navid Poulad

Inventor： Navid Poulad

IPC: G01C19/00 ,  G01P15/02 ,  H05K1/18 ,  H05K7/14

CPC classification number: G01C19/00 ,  G01P1/023 ,  G01P3/00 ,  G01P15/02 ,  H05K1/0271 ,  H05K1/181 ,  H05K5/0078 ,  H05K7/12 ,  H05K7/142 ,  H05K7/1422 ,  H05K2201/068 ,  H05K2201/10151 ,  H05K2201/10295 ,  H05K2201/10393 ,  H05K2201/2036 ,  H05K2201/2045

Abstract: Printed circuit boards (PCBs) are configured with an athermalized mounting suitable for securing and positioning and the PCBs within an inertial measurement unit (IMU). The PCBs include integrated circuit (IC) components, such as accelerometers and/or gyroscopes, which require relative positional stability within the IMU environment in order to provide accurate results. The athermalized mounting configuration of the PCB enables the PCBs to experience thermal expansion within the IMU without causing significant displacement of the IC relative to the IMU environment.

公开(公告)号：US09730326B2

公开(公告)日：2017-08-08

申请号：US14911595

申请日：2014-08-14

Applicant: BROSE FAHRZEUGTEILE GMBH & CO. KOMMANDITGESELLSCHAFT

Inventor： Steffen Ehrmann ,  Katharina Gerlach ,  Artur Schmidt ,  Karl-Heinz Fleischmann

IPC: H01R4/24 ,  H05K1/18 ,  H01R12/53 ,  B23K31/02 ,  H01R9/22 ,  H01R101/00

CPC classification number: H05K1/181 ,  B23K31/02 ,  H01R4/242 ,  H01R9/226 ,  H01R12/53 ,  H01R2101/00 ,  H01R2201/26 ,  H05K2201/10295

Abstract: Electrical contact arrangement for an electric motor and method for producing same. The present invention relates to an electrical contact arrangement for an electric motor, in particular for an EC drive of a motor vehicle fan, comprising an elongate contact which runs perpendicular to a planar basic conductor, wherein the basic conductor is in the form of a leadframe, and a conductive cohesive and/or form-fitting and/or force-fitting connection is provided between the leadframe and the contact. The present invention also relates to a method for the production of said electrical contact arrangement.

公开(公告)号：US20170155203A1

公开(公告)日：2017-06-01

申请号：US15321022

申请日：2015-06-12

Applicant: Sumitomo Wiring Systems, Ltd

Inventor： Hideki Goto

IPC: H01R12/58 ,  H05K1/11

CPC classification number: H01R12/585 ,  H01R12/718 ,  H05K1/11 ,  H05K1/184 ,  H05K2201/10265 ,  H05K2201/10295

Abstract: The present invention provides a terminal-equipped printed circuit board having a novel structure in which a circuit board terminal is stably positioned on and fixed to a printed circuit board, and conduction stability between the circuit board terminal and a conduction portion provided in a through-hole of the printed circuit board can be ensured without needing a soldering step. The printed circuit board includes press-in holes and through-holes that have conduction portions, and the circuit board terminal includes press-in protrusions and press-fit lead portions that have press-fit portions. The circuit board terminal and the conduction portions are brought into conduction by the press-fit lead portions being inserted into the through-holes and the press-fit portions being press-fitted against the conduction portions of the through-holes. The circuit board terminal is positioned on and fixed to the printed circuit board by the press-in protrusions being pressed into the press-in holes.

公开(公告)号：US20170149155A1

公开(公告)日：2017-05-25

申请号：US14952242

申请日：2015-11-25

Applicant: MERCURY SYSTEMS, INC.

Inventor： Darryl J. MCKENNEY ,  Absu METHRATTA ,  Erica OUELLETTE

IPC: H01R12/71 ,  H05K1/02 ,  H01R12/58

CPC classification number: H01R12/58 ,  H01R4/028 ,  H01R12/00 ,  H01R12/526 ,  H01R12/714 ,  H01R12/716 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/3421 ,  H05K3/42 ,  H05K3/421 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2201/10901 ,  H05K2203/0455 ,  Y02P70/611

Abstract: According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation from the surface interconnect during the soldering process. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

公开(公告)号：US20170094746A1

公开(公告)日：2017-03-30

申请号：US15211813

申请日：2016-07-15

Applicant: JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD.

Inventor： AIMING XIONG ,  XINTONG LIU ,  XIAOJIA WU

IPC: H05B33/08 ,  F21K9/272 ,  F21V23/00 ,  F21V23/06 ,  F21V19/02 ,  F21V29/70 ,  F21K9/278 ,  F21V15/015

CPC classification number: H05B33/0887 ,  F21K9/272 ,  F21K9/278 ,  F21V3/02 ,  F21V15/015 ,  F21V19/02 ,  F21V23/003 ,  F21V23/02 ,  F21V23/06 ,  F21V25/04 ,  F21V29/70 ,  F21V29/83 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05B33/0815 ,  H05B33/083 ,  H05K1/147 ,  H05K2201/10106 ,  H05K2201/10295

Abstract: An LED tube lamp is disclosed. The LED tube lamp includes an LED module for emitting light, the LED module comprising an LED unit comprising an LED; a rectifying circuit for rectifying an external driving signal to produce a rectified signal; and a mode determination circuit configured to detect a state of a property of the rectified signal, for selectively determining on performing a first mode or a second mode of lighting according to the state of the property of the rectified signal; wherein when the LED tube lamp performs the first mode of lighting, the mode determination circuit allows continual current to flow through the LED unit until the external driving signal is disconnected from the LED tube lamp; and when the LED tube lamp performs the second mode of lighting, the mode determination circuit regulates the continuity of current to flow through the LED unit.

公开(公告)号：US09592396B2

公开(公告)日：2017-03-14

申请号：US13351899

申请日：2012-01-17

Applicant: Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

Inventor： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC: H05K3/34 ,  A61N1/375 ,  A61N1/05 ,  H05K3/36 ,  H05K1/03 ,  H05K3/32 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC classification number: A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US09564697B2

公开(公告)日：2017-02-07

申请号：US14540480

申请日：2014-11-13

Applicant: LEAR CORPORATION

Inventor： Bert William Eakins ,  George E. Fox

IPC: H05K1/11 ,  H01R12/58 ,  H01R43/20 ,  H01R4/02 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01R12/707 ,  H01R4/02 ,  H01R4/028 ,  H01R12/585 ,  H01R43/205 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/097 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10871 ,  H05K2201/2072 ,  H05K2203/047 ,  H05K2203/1572

Abstract: A method of assembling a circuit board may include inserting a first electrical terminal into a first side of a circuit board, and applying a second layer of solder paste to a second side of the circuit board, the second side disposed opposite of the first side. The first electrical terminal may include a solder tab, a maximum length of the solder tab may be shorter than a minimum thickness of the circuit board, and if the first electrical terminal is inserted into the circuit board, the solder tab may extend at least partially into the circuit board without extending entirely through the circuit board. One or more electrical terminals with short and/or long solder tabs may be inserted into the second side of the circuit board and/or one or more electrical components may be attached to second side of circuit board.

Abstract translation: 组装电路板的方法可以包括将第一电端子插入电路板的第一侧，并且将第二层焊膏施加到电路板的第二侧，第二侧与第一侧相对设置。 第一电端子可以包括焊接片，焊接片的最大长度可以短于电路板的最小厚度，并且如果第一电端子插入到电路板中，则焊料片可以至少部分延伸 进入电路板，而不会完全延伸穿过电路板。 具有短和/或长焊料突片的一个或多个电端子可以插入电路板的第二侧和/或一个或多个电气部件可以附接到电路板的第二侧。