公开(公告)号：US08754429B2

公开(公告)日：2014-06-17

申请号：US13154999

申请日：2011-06-07

申请人： Hiroshi Koizumi ,  Yasuhide Okada ,  Susumu Obata ,  Tomomichi Naka ,  Kazuhito Higuchi ,  Kazuo Shimokawa ,  Yoshiaki Sugizaki ,  Akihiro Kojima

发明人： Hiroshi Koizumi ,  Yasuhide Okada ,  Susumu Obata ,  Tomomichi Naka ,  Kazuhito Higuchi ,  Kazuo Shimokawa ,  Yoshiaki Sugizaki ,  Akihiro Kojima

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/44 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/16 ,  H01L2933/0058

摘要： According to one embodiment, an optical semiconductor device includes a light emitting layer, a transparent layer, a first metal post, a second metal post and a sealing layer. The light emitting layer includes a first and a second major surface, a first and a second electrode. The second major surface is a surface opposite to the first major surface, and the first electrode and second electrodes are formed on the second major surface. The transparent layer is provided on the first major surface. The first metal post is provided on the first electrode. The second metal post is provided on the second electrode. The sealing layer is provided on the second major surface. The sealing layer covers a side surface of the light emitting layer and seals the first and second metal posts while leaving end portions of the first and second metal posts exposed.

摘要翻译： 根据一个实施例，光学半导体器件包括发光层，透明层，第一金属柱，第二金属柱和密封层。 发光层包括第一和第二主表面，第一和第二电极。 第二主表面是与第一主表面相对的表面，并且第一电极和第二电极形成在第二主表面上。 透明层设置在第一主表面上。 第一金属柱设置在第一电极上。 第二金属柱设置在第二电极上。 密封层设置在第二主表面上。 密封层覆盖发光层的侧表面，并且密封第一和第二金属柱，同时使第一和第二金属柱的端部露出。

公开(公告)号：US20110297987A1

公开(公告)日：2011-12-08

申请号：US13154999

申请日：2011-06-07

申请人： Hiroshi KOIZUMI ,  Yasuhide Okada ,  Susumu Obata ,  Tomomichi Naka ,  Kazuhito Higuchi ,  Kazuo Shimokawa

发明人： Hiroshi KOIZUMI ,  Yasuhide Okada ,  Susumu Obata ,  Tomomichi Naka ,  Kazuhito Higuchi ,  Kazuo Shimokawa

IPC分类号： H01L33/50

CPC分类号： H01L33/44 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/16 ,  H01L2933/0058

摘要： According to one embodiment, an optical semiconductor device includes a light emitting layer, a transparent layer, a first metal post, a second metal post and a sealing layer. The light emitting layer includes a first and a second major surface, a first and a second electrode. The second major surface is a surface opposite to the first major surface, and the first electrode and second electrodes are formed on the second major surface. The transparent layer is provided on the first major surface. The first metal post is provided on the first electrode. The second metal post is provided on the second electrode. The sealing layer is provided on the second major surface. The sealing layer covers a side surface of the light emitting layer and seals the first and second metal posts while leaving end portions of the first and second metal posts exposed.

摘要翻译： 根据一个实施例，光学半导体器件包括发光层，透明层，第一金属柱，第二金属柱和密封层。 发光层包括第一和第二主表面，第一和第二电极。 第二主表面是与第一主表面相对的表面，并且第一电极和第二电极形成在第二主表面上。 透明层设置在第一主表面上。 第一金属柱设置在第一电极上。 第二金属柱设置在第二电极上。 密封层设置在第二主表面上。 密封层覆盖发光层的侧表面，并且密封第一和第二金属柱，同时使第一和第二金属柱的端部露出。

公开(公告)号：US20110312110A1

公开(公告)日：2011-12-22

申请号：US13221634

申请日：2011-08-30

申请人： Akihiko HAPPOYA ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko HAPPOYA ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L33/52

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将所述发光元件，所述第一导电构件和所述第二导电构件密封在所述第一外部电极和所述第二外部电极之间并且被配置为透射从所述发光元件发射的光的外壳。

公开(公告)号：US08241937B2

公开(公告)日：2012-08-14

申请号：US13221634

申请日：2011-08-30

申请人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将所述发光元件，所述第一导电构件和所述第二导电构件密封在所述第一外部电极和所述第二外部电极之间并且被配置为透射从所述发光元件发射的光的外壳。

公开(公告)号：US08039857B2

公开(公告)日：2011-10-18

申请号：US12552504

申请日：2009-09-02

申请人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将所述发光元件，所述第一导电构件和所述第二导电构件密封在所述第一外部电极和所述第二外部电极之间并且被配置为透射从所述发光元件发射的光的外壳。

公开(公告)号：US20100140639A1

公开(公告)日：2010-06-10

申请号：US12552504

申请日：2009-09-02

申请人： Akihiko HAPPOYA ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko HAPPOYA ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将发光元件，第一导电构件和第二导电构件密封在第一外部电极和第二外部电极之间并且被配置为透射从发光元件发射的光的外壳。

公开(公告)号：US08581291B2

公开(公告)日：2013-11-12

申请号：US12556134

申请日：2009-09-09

申请人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Takeshi Miyagi ,  Akihiko Happoya ,  Kazuhito Higuchi ,  Tomoyuki Kitani

发明人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Takeshi Miyagi ,  Akihiko Happoya ,  Kazuhito Higuchi ,  Tomoyuki Kitani

IPC分类号： H01L33/00

CPC分类号： H01L33/507 ,  H01L33/0079 ,  H01L33/38 ,  H01L33/44 ,  H01L33/505 ,  H01L33/56 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is an optical semiconductor device includes: a light-emitting layer having a first main surface, a second main surface opposed to the first main surface, a first electrode and a second electrode which are formed on the second main surface; a fluorescent layer provided on the first main surface; a light-transmissive layer provided on the fluorescent layer and made of a light-transmissive inorganic material; a first metal post provided on the first electrode; a second metal post provided on the second electrode; a sealing layer provided on the second main surface so as to seal in the first and second metal posts with one ends of the respective first and second metal posts exposed; a first metal layer provided on the exposed end of the first metal post; and a second metal layer provided on the exposed end of the second metal post.

摘要翻译： 本发明提供一种光半导体装置，具备：具有第一主面，与第一主面相对的第二主面的发光层，形成在第二主面上的第一电极和第二电极; 设置在所述第一主表面上的荧光层; 设置在荧光层上并由透光性无机材料制成的透光层; 设置在所述第一电极上的第一金属柱; 设置在所述第二电极上的第二金属柱; 密封层，设置在所述第二主表面上，以便密封在所述第一和第二金属柱中，所述第一和第二金属柱的一端暴露; 设置在第一金属柱的暴露端上的第一金属层; 以及设置在第二金属柱的暴露端上的第二金属层。

公开(公告)号：US20100006888A1

公开(公告)日：2010-01-14

申请号：US12498482

申请日：2009-07-07

申请人： Naotake WATANABE ,  Izuru Komatsu ,  Kazuo Shimokawa ,  Hisashi Ito

发明人： Naotake WATANABE ,  Izuru Komatsu ,  Kazuo Shimokawa ,  Hisashi Ito

IPC分类号： H01L33/00 ,  H01L21/56

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

摘要： Provided is a method of manufacturing an optical semiconductor device, the method including: providing a resin layer on a light-emitting substrate to cover a principle surface of the light-emitting substrate, the light-emitting substrate including a pair of electrodes in each section of the principle surface, the resin layer including multiple holes each exposing two of the electrodes located adjacent to each other but in the different sections; providing post electrodes respectively on all the paired electrodes formed in all the sections by filling a conductive material in the holes of the resin layer on the principal surface; and forming multiple optical semiconductor devices by cutting the light-emitting substrate into sections, the light-emitting substrate provided with the post electrodes respectively on all the paired electrodes formed in all the sections.

摘要翻译： 提供一种制造光半导体器件的方法，该方法包括：在发光基板上设置树脂层以覆盖发光基板的主表面，所述发光基板在每个部分中包括一对电极 所述树脂层包括多个孔，每个孔暴露位于彼此相邻但在不同部分中的两个电极; 通过在主表面上的树脂层的孔中填充导电材料，分别在所有部分形成的所有成对电极上分别提供柱状电极; 并且通过将发光基板切割成多个部分形成多个光学半导体器件，分别在所有部分上形成的所有成对电极上设置有柱状电极的发光基板。

公开(公告)号：US20050029651A1

公开(公告)日：2005-02-10

申请号：US10876016

申请日：2004-06-25

申请人： Taizo Tomioka ,  Kazuo Shimokawa

发明人： Taizo Tomioka ,  Kazuo Shimokawa

IPC分类号： H01L23/34 ,  H01L21/56 ,  H01L23/31 ,  H01L23/36 ,  H01L23/492 ,  H01L23/498 ,  H01L25/04 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L21/44 ,  H01L21/50 ,  H01L23/28

CPC分类号： H01L25/072 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/492 ,  H01L23/49861 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L24/91 ,  H01L25/0655 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/83104 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor device comprises a plurality of semiconductor chips each having a surface bonded to a wiring board and being electrically connected thereto, a plurality of metal plates each having a one-end portion bonded to the other surface of each of the plurality of semiconductor chips and having an other-end portion bonded to the wiring board to make electric connection therebetween, thermoplastic resin which seals the metal plates integrally as one body, such that a surface opposing the surface bonded to the semiconductor chip, of each of the metal plates, is exposed to outside, and thermosetting resin which seals an outer peripheral portion of the thermoplastic resin, and the semiconductor chips.

摘要翻译： 一种半导体器件包括多个半导体芯片，每个半导体芯片的表面接合到布线板并与其电连接;多个金属板，每个金属板的一端部分接合到多个半导体芯片的每一个的另一个表面; 具有与所述布线板接合以形成电连接的另一端部，将与所述金属板的与所述半导体芯片接合的表面相对的表面与所述金属板一体地一体地密封的热塑性树脂为 暴露于外部，以及密封热塑性树脂的外周部分的热固性树脂和半导体芯片。

公开(公告)号：US20060055432A1

公开(公告)日：2006-03-16

申请号：US11214730

申请日：2005-08-31

申请人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Masako Ooishi ,  Tatsuya Yamada ,  Osamu Usuda ,  Yoshiki Endo ,  Taiki Miura ,  Masaki Toyoshima ,  Ichiro Omura ,  Akio Nakagawa ,  Kenichi Matsushita ,  Yusuke Kawaguchi ,  Haruki Arai ,  Hiroshi Takei ,  Tomohiro Kawano ,  Noriaki Yoshikawa ,  Morio Takahashi ,  Yasuhito Saito ,  Masahiro Urase

发明人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Masako Ooishi ,  Tatsuya Yamada ,  Osamu Usuda ,  Yoshiki Endo ,  Taiki Miura ,  Masaki Toyoshima ,  Ichiro Omura ,  Akio Nakagawa ,  Kenichi Matsushita ,  Yusuke Kawaguchi ,  Haruki Arai ,  Hiroshi Takei ,  Tomohiro Kawano ,  Noriaki Yoshikawa ,  Morio Takahashi ,  Yasuhito Saito ,  Masahiro Urase

IPC分类号： H03D13/00

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4822 ,  H01L23/49805 ,  H01L23/49844 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/84 ,  H01L25/0655 ,  H01L25/165 ,  H01L29/4175 ,  H01L29/7802 ,  H01L29/7806 ,  H01L29/7809 ,  H01L29/7813 ,  H01L29/7835 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.