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    Fine Needle Aspiration Device with Distal Anchor
    1.
    发明申请
    Fine Needle Aspiration Device with Distal Anchor 审中-公开
    具有远端锚杆的细针抽吸装置

    公开(公告)号：US20110071432A1

    公开(公告)日：2011-03-24

    申请号：US12888547

    申请日：2010-09-23

    申请人： Oscar R. Carrillo, JR. ,  Adam L. Cohen ,  Michal Weisman ,  Yem Chin ,  Robert Devries

    发明人： Oscar R. Carrillo, JR. ,  Adam L. Cohen ,  Michal Weisman ,  Yem Chin ,  Robert Devries

    IPC分类号： A61B10/02

    CPC分类号： A61B10/0283 ,  A61B2017/00349

    摘要： A device for capturing a tissue sample from within a body comprises a needle slidably comprising a needle lumen extending therethrough to a needle opening in the distal end and a stylet slidably received in the needle lumen for movement between an extended position in which a tissue penetrating distal tip of the stylet extends out of the needle opening to penetrate target tissue and a retracted position in which the distal tip of the stylet is received within the needle opening to substantially seal the needle lumen. The stylet further comprises an anchoring feature located proximally of the tissue penetrating distal tip. The anchoring feature comprises a first gripping member including a first proximal facing abutting surface adjacent to a first tissue receiving gap. Movement of the stylet distally out of the needle lumen brings the first gripping member into engagement with surrounding tissue to anchor the stylet at a desired position within the body.

    摘要翻译： 用于从身体内捕获组织样本的装置包括可滑动地包括从其延伸穿过其中的针腔的针的针头，以及可滑动地容纳在针内腔中的探针，用于在延伸位置之间移动，在延伸位置中组织穿透远端 探针的尖端延伸出针开口以穿透目标组织和缩回位置，其中探针的远端尖端被容纳在针开口内以基本上密封针腔。 探针还包括位于组织穿透远侧末端的近侧的锚固特征。 锚定特征包括第一夹持构件，其包括与第一组织接收间隙相邻的第一近侧邻接的表面。 探针向远端移出针管内腔使第一夹持部件与周围的组织接合，将探针固定在体内所需的位置。

    Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
    2.
    发明授权
    Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures 有权
    在结构的电化学制造期间保持层的平行度和/或实现所需厚度的层的方法和装置

    公开(公告)号：US08702956B2

    公开(公告)日：2014-04-22

    申请号：US13356398

    申请日：2012-01-23

    申请人： Uri Frodis ,  Adam L. Cohen ,  Michael S. Lockard

    发明人： Uri Frodis ,  Adam L. Cohen ,  Michael S. Lockard

    IPC分类号： C25D5/52 ,  C25D5/10 ,  C25D5/02

    CPC分类号： C25D5/48 ,  B33Y10/00 ,  B81C1/00492 ,  B81C99/0065 ,  B81C2201/0104 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76885 ,  Y10T156/1052

    摘要： Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

    摘要翻译： 本发明的一些实施例提供了用于电化学制造多层结构（例如中尺度或微结构）的方法和装置，其具有改进的端点检测和用于在电化学制造过程中被平坦化的材料（例如层）的并行维护。 一些方法涉及在平坦化期间使用夹具，其确保材料的平面化平面平行于给定公差内的其它沉积平面。 一些方法涉及使用端点检测夹具，其相对于第一沉积层或相对于在制造过程期间形成的一些其它层，相对于衬底的初始表面确保沉积材料的精确高度。 在一些实施例中，平面化可以通过研磨发生，而其他实施例可以使用金刚石切片机。

    Electrochemical Fabrication Method Including Elastic Joining of Structures
    4.
    发明申请
    Electrochemical Fabrication Method Including Elastic Joining of Structures 有权
    包括结构弹性连接的电化学制造方法

    公开(公告)号：US20120137497A1

    公开(公告)日：2012-06-07

    申请号：US13287437

    申请日：2011-11-02

    申请人： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard ,  Dennis R. Smalley

    发明人： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard ,  Dennis R. Smalley

    IPC分类号： B23P25/00

    CPC分类号： B29C65/56 ,  B33Y10/00 ,  C25D5/02 ,  Y10T29/49885

    摘要： Embodiments are directed to methods for forming multi-layer three-dimensional structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer three-dimensional structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery and subsequent retention of elements relative to each other, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated and a portion of at least one element is brought into position which in turn locks the at least two elements together via contact with one another including contact with the initial portion of at least one element, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other element and wherein during normal use the first and second elements are configured relative to one another so that the loading region of the second elements is not accessible to the retention region of the first element.

    摘要翻译： 实施例涉及用于形成多层三维结构的方法，所述多层三维结构涉及至少两个结构元件的接合，其中至少一个结构元件形成为多层三维结构，其中通过以下之一进行接合：（ 1）弹性变形和弹性恢复以及随后元件相对于彼此的保持，（2）至少一个元件的初始部分相对于至少一个元件的另一部分的相对变形，直到至少两个元件处于 期望的保持位置，在此之后，变形被减小或消除，并且至少一个元件的一部分进入位置，其又通过彼此接触将至少两个元件锁定在一起，包括与至少一个元件的初始部分的接触， 或（3）将一个元件的保持区域移动到另一个元件的保持区域中，而不会使任一元件变形，沿着包括装载物 g区域，并且其中在正常使用期间，第一和第二元件相对于彼此构造，使得第二元件的加载区域不能被第一元件的保持区域访问。

    Forceps and collection assembly with accompanying mechanisms and related methods of use
    5.
    发明授权
    Forceps and collection assembly with accompanying mechanisms and related methods of use 有权
    镊子和收集组装与附带的机制和相关的使用方法

    公开(公告)号：US08083686B2

    公开(公告)日：2011-12-27

    申请号：US12461262

    申请日：2009-08-05

    申请人： Adam L. Cohen ,  John B. Golden ,  Liem T. Vu

    发明人： Adam L. Cohen ,  John B. Golden ,  Liem T. Vu

    IPC分类号： A61B10/00 ,  A61B17/00

    CPC分类号： A61B10/06 ,  A61B10/0096 ,  A61B17/3462 ,  A61B2010/0225 ,  A61B2017/320064

    摘要： An embodiment of the invention includes a method for acquiring a plurality of tissue samples. The method includes using a device to cut a first tissue sample from an internal tissue tract of a patient and storing the first tissue sample in a container. Without removing the device from the patient, the method further includes using the device to cut a second tissue sample from the internal tissue tract and storing the tissues ample in the container. The method also includes coupling a fluid delivery device to the container to flush the first and second tissue samples from the container.

    摘要翻译： 本发明的实施例包括用于获取多个组织样本的方法。 该方法包括使用装置从患者的内部组织道切割第一组织样品并将第一组织样品储存在容器中。 在不从患者移除装置的情况下，该方法还包括使用该装置从内部组织道切割第二组织样本并将组织充分储存在容器中。 该方法还包括将流体递送装置联接到容器以从容器冲洗第一和第二组织样本。

    Multi-Layer Three-Dimensional Structures Having Features Smaller Than a Minimum Feature Size Associated With the Formation of Individual Layers
    6.
    发明申请
    Multi-Layer Three-Dimensional Structures Having Features Smaller Than a Minimum Feature Size Associated With the Formation of Individual Layers 审中-公开
    具有小于单个层的形成的最小特征尺寸的特征的多层三维结构

    公开(公告)号：US20110198281A1

    公开(公告)日：2011-08-18

    申请号：US13040500

    申请日：2011-03-04

    申请人： Michael S. Lockard ,  Adam L. Cohen ,  Vacit Arat ,  Dennis R. Smalley

    发明人： Michael S. Lockard ,  Adam L. Cohen ,  Vacit Arat ,  Dennis R. Smalley

    IPC分类号： B01D39/00 ,  C25D1/08 ,  B32B5/18

    CPC分类号： C25D1/08 ,  B33Y70/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  Y10T137/86759 ,  Y10T428/12361 ,  Y10T428/12479 ,  Y10T428/19 ,  Y10T428/24975 ,  Y10T428/249981 ,  Y10T428/29

    摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.

    摘要翻译： 多层三维结构和形成方法的实施例提供结构，其具有小于作为形成方法的结果存在于每个层上的最小特征尺寸（MFS）的有效特征（例如开口）尺寸（例如，虚拟间隙） 用于形成结构。 在一些实施例中，多层结构包括第一元件（例如具有间隙的第一图案化层）和邻近第一元件定位的第二元件（例如具有间隙的第二图案化层），以限定第三元件（例如，净间隙或 第一和第二元件的组合间隙产生的开口），其中第一和第二元件具有尺寸至少与最小特征尺寸一样大的特征，并且第三元件至少部分具有尺寸或尺寸小于 最小特征尺寸。

    Method of electrochemical fabrication
    7.
    发明授权
    Method of electrochemical fabrication 有权
    电化学加工方法

    公开(公告)号：US07981269B2

    公开(公告)日：2011-07-19

    申请号：US11927369

    申请日：2007-10-29

    申请人： Adam L. Cohen

    发明人： Adam L. Cohen

    IPC分类号： C25D5/02

    CPC分类号： C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

    摘要： An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

    摘要翻译： 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

    Electrochemical Fabrication Processes Incorporating Non-Platable Metals and/or Metals that are Difficult to Plate On
    10.
    发明申请
    Electrochemical Fabrication Processes Incorporating Non-Platable Metals and/or Metals that are Difficult to Plate On 审中-公开
    掺入难以镀上的不可镀金属和/或金属的电化学制造工艺

    公开(公告)号：US20100314258A1

    公开(公告)日：2010-12-16

    申请号：US12816914

    申请日：2010-06-16

    申请人： Adam L. Cohen ,  Michael S. Lockard ,  Gang Zhang

    发明人： Adam L. Cohen ,  Michael S. Lockard ,  Gang Zhang

    IPC分类号： C25D5/00

    CPC分类号： C25D5/00 ,  B33Y10/00 ,  B81C99/0095 ,  B81C2201/0181 ,  C23C4/02 ,  C23C18/1605 ,  C23C18/1651 ,  C23C26/00 ,  C23C28/021 ,  C23C28/023 ,  C23C28/028 ,  C25D1/003

    摘要： Embodiments are directed to electrochemically fabricating multi-layer three dimensional structures where each layer comprises at least one structural and at least one sacrificial material and wherein at least some metals or alloys are electrodeposited during the formation of some layers and at least some metals are deposited during the formation of some layers that are either difficult to electrodeposit and/or are difficult to electrodeposit onto. In some embodiments, the hard to electrodeposit metals (e.g. Ti, NiTi, W, Ta, Mo, etc.) may be deposited via chemical or physical vacuum deposition techniques while other techniques are used in other embodiments. In some embodiments, prior to electrodepositing metals, the surface of the previously formed layer is made to undergo appropriate preparation for receiving an electrodeposited material. Various surface preparation techniques are possible, including, for example, anodic activation, cathodic activation, and vacuum deposition of a seed layer and possibly an adhesion layer.

    摘要翻译： 实施例涉及电化学制造多层三维结构，其中每层包括至少一种结构和至少一种牺牲材料，并且其中至少一些金属或合金在形成一些层期间被电沉积，并且至少一些金属在 形成难以电沉积和/或难以电沉积的一些层。 在一些实施方案中，可以通过化学或物理真空沉积技术沉积难以电沉积的金属（例如Ti，NiTi，W，Ta，Mo等），而在其它实施方案中使用其它技术。 在一些实施方案中，在电沉积金属之前，使先前形成的层的表面经历适当的准备以接收电沉积材料。 各种表面处理技术是可能的，包括例如阳极活化，阴极活化和种子层以及可能的粘附层的真空沉积。