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公开(公告)号：US20110201195A1
公开(公告)日：2011-08-18
申请号：US13091801
申请日：2011-04-21
IPC分类号： H01L21/283
CPC分类号： H01L24/16 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11001 , H01L2224/11003 , H01L2224/1141 , H01L2224/11502 , H01L2224/11522 , H01L2224/13022 , H01L2224/13099 , H01L2224/13105 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/16225 , H01L2224/16227 , H01L2224/165 , H01L2224/2741 , H01L2224/27436 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/29299 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/83192 , H01L2224/832 , H01L2224/83856 , H01L2224/83862 , H01L2224/83874 , H01L2224/8388 , H01L2224/83885 , H01L2224/83886 , H01L2224/83887 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H01L2924/1579 , H01L2924/381 , H01L2924/3841 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/0264 , H05K2203/087 , H05K2203/1178 , Y02P70/613 , H01L2924/01031 , H01L2924/01049 , H01L2924/01051 , H01L2924/01083 , H01L2924/00011 , H01L2924/00015 , H01L2924/066 , H01L2924/06 , H01L2924/0675 , H01L2924/0695 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The invention involves mounting a solder resin composition (6) including a solder powder (5a) and a resin (4) on the first electronic component (2); arranging such that the connecting terminals (3) of the first electronic component (2) and the electrode terminals (7) of the second electronic component (8) are facing each other; ejecting a gas (9a) from a gas generation source (1) included in the first electronic component (2) by heating the first electronic component (2) and the solder resin composition; and inducing the flow of the solder powder (5a) in the solder resin composition (6) by inducing convection of the gas (9a) in the solder resin composition (6), and electrically connecting the connecting terminals (3) and the electrode terminals (7) by self-assembly on the connecting terminals (3) and the electrode terminals (7). Through this are provided a flip chip packaging method that enables connecting, with high connection reliability, electrode terminals of a semiconductor chip wired with narrow pitch and connecting terminals of a circuit board, and a bump formation method for packaging on a circuit board.
摘要翻译： 本发明涉及将包含焊料粉末（5a）和树脂（4）的焊料树脂组合物（6）安装在第一电子部件（2）上; 排列成使得第一电子部件（2）的连接端子（3）和第二电子部件（8）的电极端子（7）彼此面对; 通过加热第一电子部件（2）和焊料树脂组合物，从包括在第一电子部件（2）中的气体发生源（1）喷出气体（9a） 并且通过引起焊料树脂组合物（6）中的气体（9a）的对流而引起焊料粉末（5a）在焊料树脂组合物（6）中的流动，并将连接端子（3）和电极端子 （7）通过在连接端子（3）和电极端子（7）上的自组装。 通过这种方式提供了一种倒装芯片封装方法，其以高连接可靠性连接具有窄间距的半导体芯片的电极端子和电路板的连接端子，以及用于封装在电路板上的凸块形成方法。
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2.发明申请FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MOUNTING APPARATUS 有权浮动芯片安装体，浮动芯片安装方法和浮动芯片安装设备公开(公告)号：US20100203675A1
公开(公告)日：2010-08-12
申请号：US12764455
申请日：2010-04-21
IPC分类号： H01L21/60
CPC分类号： H01L24/81 , H01L21/563 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/83007 , H01L2224/83097 , H01L2224/83192 , H01L2224/83815 , H01L2224/83874 , H01L2224/8388 , H01L2224/83888 , H01L2224/9201 , H01L2924/00014 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/0695 , H01L2224/05599
摘要： The flip chip mounted body of the present invention includes: a circuit board (213) having a plurality of connection terminals (211); a semiconductor chip (206) having a plurality of electrode terminals (207) that are disposed opposing the connection terminals (211); and a porous sheet (205) having a box shape that is provided on an opposite side of a formation surface of the electrode terminal (207) of the semiconductor chip (206), is folded on an outer periphery of the semiconductor chip (206) on the formation surface side of the electrode terminal (207) and is in contact with the circuit board (213), wherein the connection terminal (211) of the circuit board (213) and the electrode terminal (207) of the semiconductor chip (206) are connected electrically via a solder layer (215), and the circuit board (213) and the semiconductor chip (206) are fixed by a resin (217). Thereby, the flip chip mounted body with excellent productivity and reliability that can mount the semiconductor chip on the circuit board, and a method and an apparatus for mounting the flip chip mounted body are provided.
摘要翻译： 本发明的倒装芯片安装体包括：具有多个连接端子（211）的电路板（213）; 具有与所述连接端子相对设置的多个电极端子（207）的半导体芯片（206）。 在所述半导体芯片（206）的外周折叠具有设置在所述半导体芯片（206）的所述电极端子（207）的形成面的相反侧的盒状的多孔片（205） 在电极端子（207）的形成面侧与电路基板（213）接触，电路基板（213）的连接端子（211）和半导体芯片的电极端子（207） 206）通过焊料层（215）电连接，并且电路板（213）和半导体芯片（206）由树脂（217）固定。 因此，提供了将半导体芯片安装在电路板上的优异的生产率和可靠性的倒装芯片安装体以及安装倒装芯片安装体的方法和装置。
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3.发明申请METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY, AND MUTUAL CONNECTION STRUCTURE BETWEEN SUBSTRATES 有权用于将基板，浮动芯片安装体进行连接的方法以及基板之间的相互连接结构公开(公告)号：US20100001411A1
公开(公告)日：2010-01-07
申请号：US12489895
申请日：2009-06-23
CPC分类号： H05K3/3436 , H01L23/3121 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/32 , H01L24/33 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/06515 , H01L2224/10165 , H01L2224/10175 , H01L2224/11015 , H01L2224/11522 , H01L2224/13099 , H01L2224/14515 , H01L2224/1601 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/812 , H01L2224/81801 , H01L2224/8314 , H01L2224/83855 , H01L2224/83886 , H01L2224/83951 , H01L2224/9201 , H01L2224/9212 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H05K3/323 , H05K2201/09909 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , H05K2203/1147 , H05K2203/1178 , Y02P70/613 , H01L2924/00 , H01L2924/00012
摘要： A resin containing conductive particles and a gas bubble generating agent is supplied between a first substrate and a second substrate, and then the resin is heated to generate gas bubbles from the gas bubble generating agent contained in the resin so that the resin is self-assembled between electrodes. Then, the resin is further heated to melt the conductive particles contained in the resin, thereby forming connectors between electrodes. A partition member sealing the gap between the substrates is provided near a peripheral portion of the resin, and gas bubbles in the resin are discharged to the outside through the peripheral portion of the resin where the partition member is absent.
摘要翻译： 在第一基板和第二基板之间提供含有导电粒子和气泡生成剂的树脂，然后将树脂加热，从树脂中包含的气泡生成剂产生气泡，使树脂自组装 电极之间。 然后，进一步加热树脂以熔化包含在树脂中的导电颗粒，从而在电极之间形成连接器。 在树脂的周边部附近设置密封基板之间的间隔的分隔部件，树脂中的气泡通过不存在分隔部件的树脂的周边部排出到外部。
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4.发明申请CONDUCTIVE RESIN COMPOSITION, CONNECTION METHOD BETWEEN ELECTRODES USING THE SAME, AND ELECTRIC CONNECTION METHOD BETWEEN ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE USING THE SAME 有权导电树脂组合物，使用该电极的电极之间的连接方法以及使用该电极的电子元件和电路基板之间的电连接方法公开(公告)号：US20090200522A1
公开(公告)日：2009-08-13
申请号：US12424867
申请日：2009-04-16
IPC分类号： H01B1/22
CPC分类号： H05K3/3484 , B23K1/0016 , B23K35/025 , B23K35/262 , B23K35/264 , B23K35/268 , B23K35/3613 , C22C11/00 , C22C12/00 , C22C13/00 , H01L24/11 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16227 , H01L2224/29101 , H01L2224/29111 , H01L2224/2929 , H01L2224/293 , H01L2224/29386 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2224/83801 , H01L2224/83855 , H01L2224/8388 , H01L2224/83886 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/351 , H05K3/323 , H05K2201/10674 , H05K2201/10977 , H01L2924/00 , H01L2924/01083 , H01L2224/29311 , H01L2924/00014 , H01L2224/1319 , H01L2224/133 , H01L2924/05442 , H01L2924/05432 , H01L2224/16225
摘要： The present invention provides a conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium includes a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other. Thereby, a flip chip packaging method that can be applied to flip chip packaging of LSI and has high productivity and high reliability is provided.
摘要翻译： 本发明提供一种导电树脂组合物，用于电连接电极，其中金属颗粒分散在流动介质中，其中流动介质包括与金属颗粒相比具有较高润湿性的第一流动介质和具有相对较高的第二流动介质 与金属颗粒的低润湿性，以及第一流动介质和第二流动介质在彼此不相容的状态下分散。 因此，提供了可以应用于LSI的倒装芯片封装并且具有高生产率和高可靠性的倒装芯片封装方法。
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5.发明申请MAGNETIC SHEET WITH STRIPE-ARRANGED MAGNETIC GRAINS, RFID MAGNETIC SHEET, MAGNETIC SHIELDING SHEET AND METHOD OF MANUFACTURING THE SAME 有权具有条状磁性颗粒的磁性片，RFID磁性片，磁性屏蔽片及其制造方法公开(公告)号：US20080070003A1
公开(公告)日：2008-03-20
申请号：US11848407
申请日：2007-08-31
CPC分类号： G06K19/07749 , G06K19/07771 , Y10T428/24355 , Y10T428/32
摘要： A water-repelling layer is formed on a resin film, and a stripe pattern region is formed so as to be positioned within a surface region of the water-repelling layer and so as to be relatively hydrophilic with respect to water repellency of the water-repelling layer. A magnetic stripe pattern is formed of needle-shaped magnetic grains oriented and aggregated in the stripe pattern region. The needle-shaped magnetic grains are arranged in a desirable state in a predetermined stripe pattern, with a high magnetic permeability and a magnetic sheet with stripe-arranged magnetic grains that is thin and flexible is obtained.
摘要翻译： 在树脂膜上形成防水层，并且形成条纹图案区域，以便位于防水层的表面区域内，并且相对于水溶性防水层的防水性而相对亲水， 排斥层。 磁条图案由在条纹图案区域中定向和聚集的针状磁性颗粒形成。 针状磁性颗粒以预定的条纹图案被布置成期望的状态，具有高磁导率，并且获得薄且柔性的带状排列的磁性颗粒的磁性片。
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6.发明申请公开(公告)号：US20070262447A1
公开(公告)日：2007-11-15
申请号：US11748111
申请日：2007-05-14
IPC分类号： H01L23/48
CPC分类号： H05K1/0271 , H01L23/49811 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/13011 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/81191 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H05K1/09 , H05K1/111 , H05K3/243 , H05K2201/0338 , H05K2201/0355 , H05K2201/09109 , H01L2924/00 , H01L2224/05599
摘要： A circuit board 1 having a base material 10 and an electrode 11 formed on at least one main surface of the base material 10 includes an easy peeling portion 12 formed in at least one of an inner portion and a side portion of the electrode 11, with the adhesive strength between the electrode 11 and the easy peeling portion 12 being less than the adhesive strength between the electrode 11 and the base material 10. A circuit board that has high connection reliability and enables narrow pitch mounting thereby can be provided.
摘要翻译： 具有基材10和形成在基材10的至少一个主表面上的电极11的电路板1包括形成在电极11的内部和侧部中的至少一个中的易剥离部分12， 电极11和容易剥离部12之间的粘合强度小于电极11与基材10之间的粘合强度。可以提供具有高连接可靠性并能实现窄间距安装的电路板。
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公开(公告)号：US20110293874A1
公开(公告)日：2011-12-01
申请号：US13115405
申请日：2011-05-25
CPC分类号： H01L23/49822 , B32B3/08 , B32B3/085 , B32B3/18 , B32B9/005 , B32B9/047 , B32B15/14 , B32B15/20 , B32B37/1009 , B32B2250/40 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2305/188 , B32B2305/20 , B32B2309/02 , B32B2309/04 , B32B2309/105 , B32B2309/12 , B32B2315/02 , B32B2457/00 , B32B2457/202 , B32B2519/02 , H01L23/49827 , H01L23/49894 , H01L2924/0002 , H01L2924/09701 , H05K3/4605 , H05K3/4629 , H05K3/4652 , H05K3/4688 , H05K3/4694 , H05K2201/2018 , Y10T156/10 , Y10T428/163 , Y10T428/166 , H01L2924/00
摘要： The hybrid substrate of the present invention comprises a ceramic substrate assembly composed of a plurality of ceramic substrates, insulating resin layers disposed respectively on both surfaces of the ceramic substrate assembly such that they are opposed to each other, each of the insulating resin layers being made at least of a reinforcing material and a resin, and a metal layer disposed on each of the insulating resin layers. In particular, the hybrid substrate of the present invention comprises the plurality of ceramic substrates which are in the form of a tile arrangement along the same plane positioned between the opposed insulating resin layers.
摘要翻译： 本发明的混合基板包括由多个陶瓷基板构成的陶瓷基板组件，分别设置在陶瓷基板组件的两个表面上的绝缘树脂层，使得它们彼此相对，每个绝缘树脂层被制成 至少是增强材料和树脂，以及设置在每个绝缘树脂层上的金属层。 特别地，本发明的混合基板包括沿位于相对的绝缘树脂层之间的相同平面的瓦片布置形式的多个陶瓷基板。
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8.发明申请公开(公告)号：US20070081314A1
公开(公告)日：2007-04-12
申请号：US11550677
申请日：2006-10-18
申请人： Seiichi NAKATANI
发明人： Seiichi NAKATANI
IPC分类号： H05K7/00
CPC分类号： H01L23/4985 , H01L23/49805 , H01L23/5385 , H01L23/5389 , H01L24/45 , H01L24/48 , H01L25/0652 , H01L25/105 , H01L25/16 , H01L2224/05001 , H01L2224/05023 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2225/06551 , H01L2225/06558 , H01L2225/06568 , H01L2225/1011 , H01L2225/107 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/19107 , H05K1/145 , H05K2201/10734 , Y10T156/1056 , H01L2924/00 , H01L2924/20752 , H01L2224/05005 , H01L2224/05541 , H01L2224/05599 , H01L2224/05099 , H01L2924/00012
摘要： An electronic component packaging structure, includes: circuit boards each having a wiring at least on a surface thereof; and an electronic component package secured between the circuit boards. The electronic component package includes at least one electronic component embedded within an electrical insulating encapsulation resin molded member made of an inorganic filler and a resin, the at least one electronic component being selected from an active component and a passive component, protruding electrodes are arranged on both faces of the electrical insulating encapsulation resin molded member, and the electronic component is connected electrically with at least a part of the protruding electrodes. This configuration allows circuit boards to be connected with each other and a high-density and high-performance structure.
摘要翻译： 一种电子部件封装结构，包括：至少在其表面上具有布线的电路板; 以及固定在电路板之间的电子部件封装。 电子部件封装包括嵌入由无机填料和树脂制成的电绝缘密封树脂模制构件中的至少一个电子部件，所述至少一个电子部件选自有源部件和无源部件，突出电极设置在 电绝缘性封装树脂成型体的两面，电子部件与至少一部分突出电极电连接。 该配置允许电路板彼此连接和高密度和高性能的结构。
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