公开(公告)号：WO2008024726A3

公开(公告)日：2008-02-28

申请号：PCT/US2007/076345

申请日：2007-08-21

Applicant: FORMFACTOR, INC. ,  ELDRIDGE, Benjamin, N. ,  GRITTERS, John K. ,  KHANDROS, Igor, K. ,  MARTENS, Rod ,  MATHIEU, Gaetan, L.

Inventor： ELDRIDGE, Benjamin, N. ,  GRITTERS, John K. ,  KHANDROS, Igor, K. ,  MARTENS, Rod ,  MATHIEU, Gaetan, L.

IPC: H01R12/00

Abstract: A carbon nanotube contact structure (1400) can be used for making pressure connections to a DUT The contact structure can be formed using a carbon nanotube film (1100) or with carbon nanotubes in solution The carbon nanotube film can be grown in a trench in a sacrificial substrate in which a contact structure such as a beam or contact element (1403) is then formed by metal plating The film can also be formed on a contact element and have metal posts dispersed therein to provide rigidity and elasticity Contact structures or portions thereof can also be plated with a solution containing carbon nanotubes The resulting contact structure can be tough, and can provide good electrical conductivity.

公开(公告)号：WO2007075998A2

公开(公告)日：2007-07-05

申请号：PCT/US2006/048989

申请日：2006-12-19

Applicant: FORMFACTOR, INC. ,  MATHIEU, Gaetan, L. ,  FANG, Treliant ,  HOBBS, Eric D.

Inventor： MATHIEU, Gaetan, L. ,  FANG, Treliant ,  HOBBS, Eric D.

IPC: H01L21/00

CPC classification number: B81C1/0046 ,  B33Y10/00 ,  B81B2201/014 ,  B81B2203/0118 ,  B81C2201/0184 ,  B81C2201/0197 ,  C23C18/1608 ,  C23C18/1844 ,  C25D1/003 ,  C25D1/12 ,  C25D5/02 ,  G01R1/06755 ,  G01R3/00 ,  H01L21/288 ,  H01L21/76873 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/1461 ,  H05K3/1275 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.

Abstract translation: 公开了用于在三维阵列中沉积多个液滴的系统和方法。 阵列可以包括设置成形成支撑结构的第一类型的液滴和在支撑结构上形成导电种子层的第二类型的液滴。 结构材料可以电沉积到种子层上以产生三维结构。

公开(公告)号：WO2003062322A1

公开(公告)日：2003-07-31

申请号：PCT/US2003/001577

申请日：2003-01-16

Applicant: FORMFACTOR, INC.

Inventor： KHANDROS, Igor, K. ,  ELDRIDGE, Benjamin, N. ,  FANG, Treliant ,  MATHIEU, Gaetan, L. ,  GRUBE, Gary, W. ,  DRUSH, Michael, A. ,  BUCKHOLTZ, Christopher, C.

IPC: C08L83/04

CPC classification number: C08G77/48 ,  B08B1/00 ,  B08B7/0028 ,  G01R1/06711 ,  G01R3/00 ,  Y10T428/24388 ,  Y10T428/31663

Abstract: A probe cleaning apparatus for cleaning a probe tip use to test semiconductors dies having an abrasive substrate layer an a tacky gel layer on top of the abrasive surface of the abrasive substrate layer. The probe tip is cleaned by passing it through the tacky gel layer so that it comes in contact with the abrasive surface of the abrasive substrate, moving the probe tip across the abrasive surface of the substrate layer, and then removing the probe tip from the successive layers of the cleaning apparatus. The probe tip emerges from the cleaning apparatus free from debris associated with testing the semiconductor dies.

Abstract translation: 用于清洁探针头的探针清洁装置用于测试在磨料基底层的研磨表面的顶部上具有磨料基底层和粘性凝胶层的半导体模具。 通过将探针尖端通过粘性凝胶层进行清洁，使其与磨料基材的研磨表面接触，使探针尖端跨过基底层的研磨表面，然后从连续的 层的清洁装置。 探针尖端从清洁设备中出来，没有与测试半导体管芯相关的碎片。

公开(公告)号：WO1997043654A1

公开(公告)日：1997-11-20

申请号：PCT/US1997008634

申请日：1997-05-15

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  ELDRIDGE, Benjamin, N. ,  MATHIEU, Gaetan, L. ,  PEDERSEN, David, V.

IPC: G01R01/067

CPC classification number: H01L23/49811 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/287 ,  G01R31/2884 ,  G01R31/2889 ,  H01H1/0036 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13173 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/4015 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contact end, and a central body portion. The contact end is offset in the z-axis (at a different height) and in at least one of the x and y directions from the base end. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate. The spring contact elements make temporary (i.e., pressure) or permanent (e.g., joined by soldering or brazing or with a conductive adhesive) connections with terminals of another electronic component to effect electrical connections therebetween. In an exemplary application, the spring contact elements are disposed on semiconductor devices resident on a semiconductor wafer so that temporary connections can be made with the semiconductor devices to burn-in and/or test the semiconductor devices.

Abstract translation: 弹性接触元件通过将至少一层金属材料沉积到沉积在可以是诸如有源半导体器件的电子部件的基板的表面上的掩模层中限定的开口中来制造。 每个弹簧接触元件具有基端，接触端和中心主体部分。 接触端在z轴（在不同的高度）和从基端到x和y方向中的至少一个偏移。 以这种方式，在衬底上以规定的空间关系制造多个弹簧接触元件。 弹簧接触元件使另一个电子元件的端子与其间的电连接暂时（即压力）或永久（例如通过焊接或钎焊或与导电粘合剂连接）连接。 在示例性应用中，弹簧接触元件设置在驻留在半导体晶片上的半导体器件上，使得可以利用半导体器件进行临时连接来老化和/或测试半导体器件。

公开(公告)号：WO1996015458A1

公开(公告)日：1996-05-23

申请号：PCT/US1995014844

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W.

IPC: G01R01/073

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: A probe card assembly (500) includes a probe card (502), a space transformer (506) having resilient contact structures (probe elements) (524) mounted directly to and extending from terminals (522) on a surface thereof, and an interposer (504) disposed between the space transformer (506) and the probe card (502). The space transformer (506) and interposer are "stacked up" so that the orientation of the space transformer (506), hence the orientation of the tips of the probe elements (524), can be adjusted without changing the orientation of the probe card. Suitable mechanisms (532, 536, 538, 546) for adjusting the orientation of the space transformer (506), and for determining what adjustments to make, are disclosed. Multiple die sites on a semiconductor wafer (508) are readily probed using the disclosed techniques, and the probe elements (524) can be arranged to optimize probing of an entire wafer (508). Composite interconnection elements (200) having a relatively soft core (206) covercoated by a relatively hard shell (218, 220) as the resilient contact structures are described.

Abstract translation: 探针卡组件（500）包括探针卡（502），具有弹性接触结构（探针元件）（524）的空间变换器（506），其直接安装在其表面上并从端子（522）延伸， （504），设置在所述空间变压器（506）和所述探针卡（502）之间。 空间变换器（506）和插入器被“堆叠”，使得可以调节空间变换器（506）的取向，从而可以调节探针元件（524）的尖端的取向而不改变探针卡的取向 。 公开了用于调整空间变换器（506）的取向并用于确定要做出什么调整的适当的机构（532,536,538,546）。 使用所公开的技术容易地探测半导体晶片（508）上的多个裸片位置，并且可以布置探针元件（524）以优化整个晶片（508）的探测。 描述具有由相对较硬的外壳（218,220）作为弹性接触结构覆盖的相对软的芯（206）的复合互连元件（200）。

公开(公告)号：WO2009042940A2

公开(公告)日：2009-04-02

申请号：PCT/US2008/077984

申请日：2008-09-26

Applicant: FORMFACTOR, INC. ,  ELDRIDGE, Benjamin, N. ,  HOBBS, Eric D. ,  MATHIEU, Gaetan, L.

Inventor： ELDRIDGE, Benjamin, N. ,  HOBBS, Eric D. ,  MATHIEU, Gaetan, L.

IPC: H01L21/66 ,  H01L21/68

CPC classification number: G01R31/2891 ,  G01R1/06716 ,  G01R1/07342 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L21/682 ,  Y10T29/49002

Abstract: A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.

Abstract translation: 用于对准多个结构的方法或设备可以包括将第一平面中的第一力施加到第一结构。 该方法还可以包括在第一平面中约束相对于第二结构的第一结构，使得第一结构相对于将第一结构上的第一特征与第二结构上的第二特征对准的第二结构处于相对位置。 第二特征可以在通常平行于第一平面的第二平面中。 第一和第二结构可以是第一和第二电子部件，其可以是探针卡组件的部件。

公开(公告)号：WO2007002249A2

公开(公告)日：2007-01-04

申请号：PCT/US2006/024238

申请日：2006-06-21

Applicant: FORMFACTOR, INC. ,  HOBBS, Eric, D. ,  ELDRIDGE, Benjamin, N. ,  MA, Lunyu ,  MATHIEU, Gaetan, L. ,  MURPHY, Steven, T. ,  SHINDE, Makarand, S. ,  SLOCUM, Alexander, H.

Inventor： HOBBS, Eric, D. ,  ELDRIDGE, Benjamin, N. ,  MA, Lunyu ,  MATHIEU, Gaetan, L. ,  MURPHY, Steven, T. ,  SHINDE, Makarand, S. ,  SLOCUM, Alexander, H.

IPC: G01R31/02

CPC classification number: G01R31/2886 ,  G01R1/073 ,  G01R31/31905 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49208 ,  Y10T29/49222

Abstract: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an "x," "y," and/or "z" direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

Abstract translation: 探针卡组件包括附接到安装组件的多个探针基板。 每个探针衬底包括一组探针，并且每个探针衬底上的探针组合在一起组成一组探针，用于接触待测试的器件。 调整机构构造成赋予每个探针基板以相对于安装组件分别移动每个基板的力。 调节机构可以将每个探针基板转换成“x”，“y”和/或“z”方向，并且可以进一步围绕前述方向上的任何一个或多个旋转每个探针基板。 调节机构可以进一步改变一个或多个探针基板的形状。 因此，探针可以相对于要测试的装置上的触点对准和/或平坦化。

公开(公告)号：WO2006047349A2

公开(公告)日：2006-05-04

申请号：PCT/US2005/038063

申请日：2005-10-21

Applicant: FORMFACTOR, INC. ,  ELDRIDGE, Benjamin, N. ,  MATHIEU, Gaetan, L.

Inventor： ELDRIDGE, Benjamin, N. ,  MATHIEU, Gaetan, L.

IPC: B23P21/00

CPC classification number: C25D1/10 ,  C23C18/1657 ,  C23C18/31 ,  C25D1/20 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/07342 ,  G01R3/00 ,  H05K3/32 ,  H05K3/321 ,  H05K3/326 ,  H05K3/341 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/42 ,  H05K2203/0726 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/53378

Abstract: Resilient spring contact structures are manufactured by plating the contact structures on a reusable mandrel, as opposed to forming the contact structures on sacrificial layers that are later etched away. In one embodiment, the mandrel includes a form or mold area that is inserted through a plated through hole in a substrate. Plating is then performed to create the spring contact on the mold area of the mandrel as well as to attach the spring contact to the substrate. In a second embodiment, the mandrel includes a form that is initially plated to form the resilient contact structure and then attached to a region of a substrate without being inserted through the substrate. Attachment in the second embodiment can be achieved during the plating process used to form the spring contact, or by using a conductive adhesive, or solder either before or after releasing the spring contact from the mandrel.

Abstract translation: 通过将接触结构电镀在可重复使用的心轴上来制造弹性弹性接触结构，而不是在随后蚀刻掉的牺牲层上形成接触结构。 在一个实施例中，心轴包括通过衬底中的电镀通孔插入的形状或模具区域。 然后进行电镀以在心轴的模具区域上产生弹簧接触以及将弹簧接触件附接到基底。 在第二实施例中，心轴包括最初电镀以形成弹性接触结构然后在不插入衬底的情况下附着到衬底的区域的形式。 在用于形成弹簧接触的电镀工艺期间，或者在从芯棒释放弹簧接触之前或之后使用导电粘合剂或焊料，可以实现第二实施例中的附接。

公开(公告)号：WO2005104742A2

公开(公告)日：2005-11-10

申请号：PCT/US2005/014377

申请日：2005-04-26

Applicant: FORMFACTOR, INC. ,  GRUBE, Gary, W. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  SOFIELD, Chadwick, D.

Inventor： GRUBE, Gary, W. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  SOFIELD, Chadwick, D.

IPC: B32B9/00 ,  B32B15/04

CPC classification number: G01R3/00 ,  G01R1/06716 ,  G01R1/06744 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T156/10 ,  Y10T428/12347 ,  Y10T428/12375 ,  Y10T428/12535 ,  Y10T428/12542 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/31681 ,  H01L2924/00

Abstract: A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as epoxy. Components, such as spring probes, can then be constructed on the plated foundation. The adhesive polymer material better assures the adhesion of the metal foundation structure to the substrate surface by counteracting forces applied to an element, such as a spring probe, attached to the plated foundation.

Abstract translation: 提供坚固的机械结构以防止形成在基板上的小基础结构从基板表面分离。 强化结构通过在种子层上电镀基础金属层，然后将镀覆的基础结构嵌入诸如环氧树脂的粘合剂聚合物材料中而形成。 然后可以在镀覆的基础上构造诸如弹簧探针的组件。 粘合剂聚合物材料通过抵抗附着在镀覆基底上的诸如弹簧探针的元件的抵抗力，更好地保证金属基础结构与基底表面的粘附。

公开(公告)号：WO2004059330A2

公开(公告)日：2004-07-15

申请号：PCT/US2003/040829

申请日：2003-12-18

Applicant: FORMFACTOR, INC.

Inventor： GRUBE, Gary, W. ,  MATHIEU, Gaetan, L. ,  MADSEN, Alec

IPC: G01R1/067

CPC classification number: G01R1/06733 ,  G01R1/06716 ,  G01R1/0675 ,  G01R1/07314 ,  G01R3/00

Abstract: An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis; the structure is made up of laminated structural layers, each comprised of a structural material. The layers define a substantially rigid base portion at a proximal end of the structure, a resilient intermediate portion extending from the base portion along the central axis, and a contact tip extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.

Abstract translation: 沿着中心纵向轴线设置的细长柱状微机械结构; 该结构由层压结构层组成，每层由结构材料构成。 这些层在结构的近端处限定基本上刚性的基部，从基部延伸的弹性中间部分沿着中心轴线，以及在结构的远端处从弹性部分延伸的接触尖端。 接触结构的弹性部分由限定在层中的弹性臂组成。 弹性臂的相对端部可以相对于中心轴线彼此成角度地偏移。 因此，当接触结构沿轴向压缩时，接触尖端将围绕中心轴线旋转，同时基座保持固定，为接触尖端提供有益的擦拭作用。