公开(公告)号：JP6354467B2

公开(公告)日：2018-07-11

申请号：JP2014177044

申请日：2014-09-01

申请人： 株式会社デンソー

发明人： 宮脇 正太郎 ,  平野 尚彦 ,  浅井 昭喜 ,  浅井 康富

IPC分类号： H01L21/60

CPC分类号： H01L24/09 ,  H01L23/4334 ,  H01L23/49517 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/0612 ,  H01L2224/0912 ,  H01L2224/16104 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48499 ,  H01L2224/48507 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01046 ,  H01L2924/01033 ,  H01L2224/4554 ,  H01L2224/29099

公开(公告)号：JP2017531323A

公开(公告)日：2017-10-19

申请号：JP2017518344

申请日：2015-10-02

申请人： エムシー10 インコーポレイテッドMc10,Inc. ,  エムシー10 インコーポレイテッドMc10,Inc.

发明人： ダラル、ミトゥル ,  グプタ、サンジェイ

IPC分类号： H01L25/10 ,  H01L23/12 ,  H01L25/065 ,  H01L25/07 ,  H01L25/11 ,  H01L25/18

CPC分类号： H01L25/0655 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/86 ,  H01L24/92 ,  H01L24/95 ,  H01L25/50 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48157 ,  H01L2224/48499 ,  H01L2224/49176 ,  H01L2224/50 ,  H01L2224/73219 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/85005 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85801 ,  H01L2224/86005 ,  H01L2224/86801 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2224/92248 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/19 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2224/05599

摘要： フレキシブル相互接続部、フレキシブル集積回路システムおよびデバイス、並びにフレキシブル集積回路を形成する方法および使用する方法が提示されている。個別のフレキシブル相互接続部によって電気的に接続されている第1および第2の個別デバイスを含むフレキシブル集積回路システムが開示されている。第1の個別デバイスは、その外面に第1の電気接続パッドを備えた第1のフレキシブル多層集積回路(IC)パッケージを含む。第2の個別デバイスは、その外面に第2の電気接続パッドを備えた第2のフレキシブル多層集積回路(IC)パッケージを含む。個別のフレキシブル相互接続部は、第1の個別デバイスの第1の電気接続パッドに取り付けられるとともに同第1の個別デバイスの第1の電気接続パッドを第2の個別デバイスの第2の電気接続パッドに電気的に接続する。

公开(公告)号：JP5894502B2

公开(公告)日：2016-03-30

申请号：JP2012126816

申请日：2012-06-04

申请人： ローム株式会社

发明人： 金田 裕也

IPC分类号： H01L23/48 ,  H01L23/50 ,  H01L21/60

CPC分类号： H01L24/85 ,  H01L23/293 ,  H01L23/4952 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/52 ,  H01L24/06 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/48499 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/4912 ,  H01L2224/49431 ,  H01L2224/49505 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85385 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/73 ,  H01L24/78 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/181

公开(公告)号：JP5343069B2

公开(公告)日：2013-11-13

申请号：JP2010504316

申请日：2009-07-10

申请人： 新日鉄住金マテリアルズ株式会社 ,  日鉄住金マイクロメタル株式会社

发明人： 智裕 宇野 ,  隆 山田 ,  敦夫 池田

IPC分类号： H01L21/60

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/4382 ,  H01L2224/43825 ,  H01L2224/43826 ,  H01L2224/43827 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45673 ,  H01L2224/45676 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48486 ,  H01L2224/48499 ,  H01L2224/48507 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48664 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48764 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48864 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85186 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85986 ,  H01L2225/06562 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/01206 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T428/12222 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/00015 ,  H01L2924/01001 ,  H01L2924/01203 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/20652 ,  H01L2924/20655 ,  H01L2924/20645 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2924/013 ,  H01L2924/01049

摘要： The invention is aimed at providing a bonding structure of a copper-based bonding wire, realizing low material cost, high productivity in a continuous bonding in reverse bonding for wedge bonding on bumps, as well as excellent reliability in high-temperature heating, thermal cycle test, reflow test, HAST test or the like. The bonding structure is for connecting the bonding wire onto a ball bump formed on an electrode of a semiconductor device, the bonding wire and the ball bump respectively containing copper as a major component thereof. The bonding structure comprises a concentrated layer A provided at an interface of a bonding part of the ball bump and the bonding wire, wherein the concentration of a metal R other than copper in the concentrated layer A is not less than ten times the average concentration of the metal R in the ball bump; and a concentrated layer B provided at an interface of a bonding part of the ball bump and the electrode, wherein the concentration of the metal R in the concentrated layer B is not less than ten times the average concentration of the metal R in the ball bump.

公开(公告)号：JP4881620B2

公开(公告)日：2012-02-22

申请号：JP2006001027

申请日：2006-01-06

申请人： ルネサスエレクトロニクス株式会社

发明人： 好彦 嶋貫

IPC分类号： H01L21/60 ,  H01L23/12

CPC分类号： H01L24/85 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/97 ,  H01L25/0657 ,  H01L2221/68331 ,  H01L2223/5442 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48499 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49429 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/85001 ,  H01L2224/85009 ,  H01L2224/85051 ,  H01L2224/8518 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/01079 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/01013 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01006 ,  H01L2224/4554

摘要： A semiconductor device including a package substrate having, at the periphery of the main surface thereof, bonding leads disposed in a row, a semiconductor chip mounted inside of the row of the bonding leads on the main surface of the package substrate, wires for connecting pads of the semiconductor chip and the bonding leads of the substrate, a sealing body for resin sealing the semiconductor chip and the wires, and solder bumps disposed on the back surface of the package substrate. The top of loop of each of the wires is disposed outside the wire connecting portion so that the wire connection between the bonding leads and the pads of the semiconductor chip has a stable loop shape to prevent wire connection failure.

公开(公告)号：JP2005259915A

公开(公告)日：2005-09-22

申请号：JP2004068191

申请日：2004-03-10

申请人： Nec Electronics Corp ,  Necエレクトロニクス株式会社

发明人： OBIYA TOMOMUTSU

IPC分类号： H01L21/60 ,  H01L23/48

CPC分类号： H01L24/48 ,  H01L24/05 ,  H01L24/45 ,  H01L24/50 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4519 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01202 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/01026 ,  H01L2924/01004 ,  H01L2924/00014 ,  H01L2924/00011 ,  H01L2224/85186 ,  H01L2224/45644 ,  H01L2224/48483 ,  H01L2924/00 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00015

摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in long term reliability and equipped with a metal bump composed of a specific composition. SOLUTION: The semiconductor device 100 includes a semiconductor chip 104, aluminum pads 106a, 106b provided on the semiconductor chip 104, alloy ball bumps 108a, 108b provided on the aluminum pads 106a, 106b and containing gold and Pd, and gold wires 110a, 110b connected with the alloy ball bumps 108a, 108b and having a surface comprising gold. The alloy ball bumps 108a, 108b contain, as a composition, gold of ≥98 mass% and ≤99.5 mass% and palladium of ≥0.5 mass% and ≤2 mass%. COPYRIGHT: (C)2005,JPO&NCIPI

摘要翻译： 要解决的问题：提供长期可靠性优异的半导体器件，并且具有由特定组成构成的金属凸块。 解决方案：半导体器件100包括半导体芯片104，设置在半导体芯片104上的铝焊盘106a，106b，设置在铝焊盘106a，106b上并包含金和Pd的合金球凸块108a，108b和金线 110a，110b与合金球凸块108a，108b连接并且具有包括金的表面。 合金球凸块108a，108b含有≥98质量％且≤99.5质量％的金，≥0.5质量％的钯和≤2质量％的组成。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP6263014B2

公开(公告)日：2018-01-17

申请号：JP2013256619

申请日：2013-12-12

申请人： 株式会社日立製作所 ,  株式会社 日立パワーデバイス

发明人： 石丸 哲也 ,  森 睦宏 ,  坂野 順一 ,  恩田 航平

IPC分类号： H02M7/21 ,  H02M1/08 ,  H02M7/219

CPC分类号： H01L29/7808 ,  H01L23/051 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/367 ,  H01L23/373 ,  H01L23/544 ,  H01L24/01 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/66 ,  H01L24/69 ,  H01L24/73 ,  H01L24/75 ,  H01L24/78 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L25/16 ,  H01L29/7805 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37012 ,  H01L2224/37147 ,  H01L2224/40137 ,  H01L2224/40499 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48499 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/75754 ,  H01L2224/78753 ,  H01L2224/78802 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/9221 ,  H01L2924/00011 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H02K11/00 ,  H02K11/046 ,  H02K19/36 ,  H02M1/08 ,  H02M7/003 ,  H02M7/217 ,  H02M7/219 ,  H02M2001/0006 ,  H02P9/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/84

公开(公告)号：JP6196092B2

公开(公告)日：2017-09-13

申请号：JP2013158233

申请日：2013-07-30

申请人： ルネサスエレクトロニクス株式会社

发明人： 今関 洋輔 ,  黒田 壮司

IPC分类号： H01L25/07 ,  H01L25/18 ,  H01L21/60 ,  H01L25/065

CPC分类号： H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L25/065 ,  H01L25/0657 ,  H01L21/561 ,  H01L2224/04042 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/0612 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83101 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L23/3128 ,  H01L23/49894 ,  H01L24/05 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/83 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/15311 ,  H01L2924/181

公开(公告)号：JP5972539B2

公开(公告)日：2016-08-17

申请号：JP2011174576

申请日：2011-08-10

申请人： ピーエスフォー ルクスコ エスエイアールエル ,  PS4 Luxco S.a.r.l.

发明人： 藤原 勝利

IPC分类号： H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L21/60

CPC分类号： H01L24/97 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48499 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/4917 ,  H01L2224/49426 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/8385 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L23/3128 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/73 ,  H01L24/83 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/06 ,  H01L2924/1306 ,  H01L2924/15311 ,  H01L2924/15798 ,  H01L2924/181 ,  H01L2924/381 ,  H01L2924/3862

公开(公告)号：JP2014120593A

公开(公告)日：2014-06-30

申请号：JP2012274261

申请日：2012-12-17

申请人： Renesas Electronics Corp ,  ルネサスエレクトロニクス株式会社

发明人： MASUMURA YOSHIHIRO ,  SASAKI HIDEKI ,  OKAMOTO TOSHIJI

IPC分类号： H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC分类号： H01L25/18 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15174 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/01079 ,  H01L2224/4554

摘要： PROBLEM TO BE SOLVED: To prevent a problem of propagation of noise from a variety of digital circuit regions to an RF analogue circuit region via a variety of paths in a multi-chip package in which a first semiconductor chip including the RF analogue circuit region and a digital circuit region and a second semiconductor chip including a digital circuit region are arranged in a planar configuration on an organic multi-layer wiring substrate and connected to each other via a bonding wire.SOLUTION: A first semiconductor chip has a thickness smaller than that of a second semiconductor chip in a multi-chip package in which a first semiconductor chip including an RF analogue circuit region and a digital circuit region and a second semiconductor chip including a digital circuit region are arranged on an organic multi-layer wiring substrate in a planar configuration and connected to each other via a bonding wire.

摘要翻译： 要解决的问题：为了防止在多芯片封装中经由各种路径将噪声从各种数字电路区域传播到RF模拟电路区域的问题，其中包括RF模拟电路区域的第一半导体芯片和 包括数字电路区域的数字电路区域和第二半导体芯片以有机多层布线基板的平面形式布置并经由接合线相互连接。第一半导体芯片的厚度小于 在多芯片封装中的第二半导体芯片，其中包括RF模拟电路区域和数字电路区域的第一半导体芯片和包括数字电路区域的第二半导体芯片布置在有机多层布线基板上 平面构造，并通过接合线彼此连接。