公开(公告)号：US06218213B1

公开(公告)日：2001-04-17

申请号：US09325262

申请日：1999-06-03

Applicant: Joseph Fjelstad ,  John W. Smith

Inventor： Joseph Fjelstad ,  John W. Smith

IPC: H01L2144

CPC classification number: H01L23/49572 ,  H01L21/4821 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Flexible leads for making electrical connection in microelectronic components include a frangible intermediate section. The frangible intermediate section is formed by a region within the lead having weakened mechanical integrity. The frangible intermediate section is made by providing a sacrificial metal layer and forming a projection on the surface of the metal layer from a portion thereof. Lead forming material is deposited onto the surface of the sacrificial metal layer and over the projection. A dielectric layer is formed on the surface of the lead forming material. Upon removing the sacrificial metal layer, a frangible intermediate section is formed within the lead forming material at the location of the projection.

Abstract translation: 用于在微电子部件中进行电连接的柔性引线包括易碎中间部分。 易碎中间部分由引线内的区域形成，机械完整性降低。 易碎的中间部分是通过提供牺牲金属层制成的，并从金属层的一部分在金属层的表面上形成突起。 引线形成材料沉积在牺牲金属层的表面上并且在突起上。 在引线形成材料的表面上形成介电层。 在去除牺牲金属层时，在突起的位置处，在引线形成材料内形成易碎的中间部分。

公开(公告)号：US06208025B1

公开(公告)日：2001-03-27

申请号：US09413410

申请日：1999-10-06

Applicant: Pieter H. Bellaar ,  Thomas H. Distefano ,  Joseph Fjelstad ,  Christopher M. Pickett ,  John W. Smith

Inventor： Pieter H. Bellaar ,  Thomas H. Distefano ,  Joseph Fjelstad ,  Christopher M. Pickett ,  John W. Smith

IPC: H01L2348

CPC classification number: H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/4084 ,  H05K2201/049 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A microelectronic component for mounting a rigid substrate, such as a hybrid circuit to a rigid support substrate, such as a printed circuit board. The microelectronic component includes a rigid interposer which may have a chip mounted on its first surface; a pattern of contacts on the rigid interposer; a flexible interposer overlying the second surface of the rigid interposer; a pattern of terminals on the flexible interposer; flexible leads; and solder coated copper balls mounted on the flexible interposer. The microelectronic component may have a socket assembly mounted on the first surface of the rigid interposer. The microelectronic component may be mounted on a rigid support substrate.

Abstract translation: 一种微电子部件，用于将诸如混合电路的刚性基板安装到刚性支撑基板，例如印刷电路板。 微电子部件包括可以在其第一表面上安装芯片的刚性插入器; 刚性插入件上的接触图案; 位于刚性插入件的第二表面上的柔性插入件; 柔性插入器上的端子图案; 柔性线 以及焊接涂覆的铜球安装在柔性插入件上。 微电子部件可以具有安装在刚性插入件的第一表面上的插座组件。 微电子部件可以安装在刚性支撑基板上。

公开(公告)号：US6157075A

公开(公告)日：2000-12-05

申请号：US384796

申请日：1999-08-27

Applicant: Konstantine Karavakis ,  Joseph Fjelstad

Inventor： Konstantine Karavakis ,  Joseph Fjelstad

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/02 ,  H01L23/48 ,  H01L23/495

CPC classification number: H01L24/05 ,  H01L23/3157 ,  H01L23/49827 ,  H01L23/562 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48599 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

Abstract: A semiconductor chip assembly with a compliant layer overlying the chip and a flexible dielectric layer overlying the compliant layer. Connecting terminals are provided on the dielectric layer for connection to a larger substrate. The connecting terminals are moveable in vertical directions toward the chip. Bonding terminals, electrically connected to the connecting terminals, are also provided on the top layer. A reinforcing element resists vertical movement of the bonding terminals, and thereby facilitates connection of leads between the bonding terminals and the chip.

公开(公告)号：US6133072A

公开(公告)日：2000-10-17

申请号：US987570

申请日：1997-12-11

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L21/48 ,  H01L21/68 ,  H01L23/498 ,  H01L21/20

CPC classification number: H01L21/568 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4889 ,  H01L21/6835 ,  H01L23/49827 ,  H05K3/4046 ,  H01L2224/05001 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K2201/0133 ,  H05K2201/09118 ,  H05K2201/10378 ,  H05K2203/049 ,  H05K3/20 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: A component for mounting semiconductor chips or other microelectronic units includes a compliant, sheet-like body with arrays of sheet-like conductive pads on upper and lower surfaces of the body. Flexible leads extending through the body interconnect conductive pads on the upper and lower surfaces. The leads are desirably formed from wire, such as gold wire, that is bonded to the conductive pads using a conductive epoxy or a eutectic bonding alloy. The component is made using sacrificial base sheets having conductive terminal portions to which the leads are initially bonded. The compliant body is formed by injecting a flowable material between the base sheets, curing the material and removing the base sheets by etching. The flowable material surrounds the leads such that the leads are supported by the cured compliant layer. The component may be used as an interposer or as a test socket.

公开(公告)号：US6007349A

公开(公告)日：1999-12-28

申请号：US775945

申请日：1997-01-03

Applicant: Thomas H. Distefano ,  Joseph Fjelstad

Inventor： Thomas H. Distefano ,  Joseph Fjelstad

IPC: H01L23/485 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H05K3/34 ,  H05K3/40 ,  H01R9/09

CPC classification number: H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H05K3/3436 ,  H05K3/4092 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K2201/0373 ,  H05K2201/10257 ,  Y02P70/613 ,  Y10T29/49147

Abstract: Flexible connectors having substantially vertical conductive legs allowing the connectors to accommodate deflection in the lateral directions (x-y directions in the plane of the connectors) induced by CTE mismatches between a chip and a substrate during thermal cycling of the chip. The connectors also accommodate deflections in the vertical direction (z direction--perpendicular to the plane of the connectors) which may be caused by connection to a substrate. Such substantially vertical leg features are formed using projection lithography, such as projected x-ray or ultra-violet ("UV") radiation, to selectively expose a photoresist layer such that the substantially vertical metal features may be formed by plating or etching. The sacrificial layer may be in the form of an array of posts, such that "stool-like" post connectors are created, or may be in the form of an array of apertures, such that "basket-like" receptacles or sockets are created. Such a flexible connector may be used in different applications resulting in superior device characteristics, such as: 1) a replacement for flip chip (C4) solder connections or for BGA solder connections; 2) a flexible socket element; or 3) a flexible thermal coupling element.

Abstract translation: 柔性连接器具有基本垂直的导电腿，允许连接器在芯片的热循环期间适应芯片和衬底之间的CTE错配引起的横向（连接器平面中的x-y方向）的偏转。 连接器还可以通过连接到基板而引起垂直方向（z方向 - 垂直于连接器的平面）的偏转。 这种基本上垂直的腿部特征使用诸如投影的x射线或紫外线（“UV”）辐射的投影光刻来形成，以选择性地暴露光致抗蚀剂层，使得可以通过电镀或蚀刻形成基本垂直的金属特征。 牺牲层可以是柱的阵列的形式，使得形成“凳状”柱连接器，或者可以是孔阵列的形式，使得形成“篮状”插座或插座 。 这种柔性连接器可以用于不同的应用中，导致优异的器件特性，例如：1）替代倒装芯片（C4）焊料连接或用于BGA焊料连接; 2）柔性插座元件; 或3）柔性热耦合元件。

公开(公告)号：US5989936A

公开(公告)日：1999-11-23

申请号：US989312

申请日：1997-12-12

Applicant: John W. Smith ,  Joseph Fjelstad

Inventor： John W. Smith ,  Joseph Fjelstad

IPC: H01L21/48 ,  H01L23/22 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H01L23/64 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/44 ,  H01L21/50

CPC classification number: H01L23/22 ,  H01L21/4839 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/13 ,  H05K3/4084 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H05K3/361

Abstract: A structure including a conductive, preferably metallic conductive layer is provided with leads on a bottom surface. The leads have fixed ends permanently attached to the structure and free ends detachable from the structure. The structure is engaged with a microelectronic element such as a semiconductor chip or wafer, the free ends of the leads are bonded to the microelectronic element, and the leads are bent by moving the structure relative to the microelectronic element. Portions of the conductive layer are removed, leaving residual portions of the conductive layer as separate electrical terminals connected to at least some of the leads. The conductive layer mechanically stabilizes the structure before bonding, and facilitates precise registration of the leads with the microelectronic element. After the conductive layer is converted to separate terminals, it does not impair free movement of the terminals relative to the microelectronic element.

Abstract translation: 包括导电优选金属导电层的结构在底表面上设置有引线。 引线具有永久地附接到结构的固定端部和从结构可拆卸的自由端。 该结构与诸如半导体芯片或晶片的微电子元件接合，引线的自由端接合到微电子元件，并且通过相对于微电子元件移动结构而使引线弯曲。 导电层的一部分被去除，导致导电层的剩余部分作为分开的电端子连接到至少一些引线。 导电层在结合之前机械稳定结构，并且有助于引线与微电子元件的精确对准。 在将导电层转换成单独的端子之后，它不会损害端子相对于微电子元件的自由移动。

公开(公告)号：US5904498A

公开(公告)日：1999-05-18

申请号：US008283

申请日：1998-01-16

Applicant: Joseph Fjelstad

Inventor： Joseph Fjelstad

IPC: H01L23/498 ,  H01L23/538 ,  H05K3/40 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L23/5387 ,  H05K3/4092 ,  H01L2924/0002 ,  H01L2924/12044

Abstract: A connection component for a microelectronic device such as a semiconductor chip incorporates a dielectric layer and leads extending across a surface of the dielectric layer. Each lead has one end permanently fastened to the dielectric layer and another end releasably bonded to the dielectric layer. The releasable end is held in place by a bond having a relatively low peel strength, desirably less than about 0.35.times.10.sup.6 dynes/cm.

Abstract translation: 用于诸如半导体芯片的微电子器件的连接部件包括延伸穿过介电层表面的电介质层和引线。 每个引线的一端永久地固定到电介质层，另一端可释放地结合到电介质层。 可释放端通过具有相对较低的剥离强度，理想地小于约0.35×10 6达因/厘米的粘结保持在适当的位置。

公开(公告)号：US5777379A

公开(公告)日：1998-07-07

申请号：US516645

申请日：1995-08-18

Applicant: Konstantine Karavakis ,  Joseph Fjelstad

Inventor： Konstantine Karavakis ,  Joseph Fjelstad

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L24/05 ,  H01L23/3157 ,  H01L23/49827 ,  H01L23/562 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48599 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

Abstract: A semiconductor chip assembly with a compliant layer overlying the chip and a flexible dielectric layer overlying the compliant layer. Connecting terminals are provided on the dielectric layer for connection to a larger substrate. The connecting terminals are moveable in vertical directions toward the chip. Bonding terminals, electrically connected to the connecting terminals, are also provided on the top layer. A reinforcing element resists vertical movement of the bonding terminals, and thereby facilitates connection of leads between the bonding terminals and the chip.

公开(公告)号：US5679194A

公开(公告)日：1997-10-21

申请号：US434552

申请日：1995-05-04

Applicant: Joseph Fjelstad ,  John W. Smith

Inventor： Joseph Fjelstad ,  John W. Smith

IPC: H01L21/60 ,  H01L23/498 ,  H05K3/40

CPC classification number: H05K3/4092 ,  H01L23/4985 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49121

Abstract: A substantially continuous layer of a first metal such as copper is provided with strips of a second metal such as gold by selective electroplating of the second metal. A dielectric support layer is provided in contact with the first metal layer, and the first metal layer is etched to leave strips of the first metal contiguous with the strips of the second metal, thereby providing composite leads with the first and second metal strips connected in series. The process provides simple end economical methods of making microelectronic connection components with leads having a flexible, fatigue resistant lead potion formed from a precious metal.

Abstract translation: 第一金属（例如铜）的基本连续的层通过第二金属的选择性电镀为第二金属（例如金）提供条。 提供与第一金属层接触的电介质支撑层，并且蚀刻第一金属层以留下与第二金属的条带相邻的第一金属的条带，由此提供复合引线，其中第一和第二金属条连接在 系列。 该方法提供了简单的最终经济的方法，使微电子连接部件与具有由贵金属形成的柔性，耐疲劳的铅部分的引线相结合。

公开(公告)号：US08558386B2

公开(公告)日：2013-10-15

申请号：US12587714

申请日：2009-10-13

Applicant: Joseph Fjelstad ,  Konstantine Karavakis

Inventor： Joseph Fjelstad ,  Konstantine Karavakis

IPC: H01L29/40

CPC classification number: H01L21/78 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/498 ,  H01L24/05 ,  H01L24/13 ,  H01L24/20 ,  H01L2224/02313 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/0236 ,  H01L2224/02377 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05572 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05552

Abstract: A method of making a semiconductor chip package is provided in which a compliant layer is provided over a contact bearing face of a semiconductor chip. The compliant layer can have a bottom surface adjacent to the chip face, a top surface facing away from the bottom surface, and at least one sloping surface between the top and bottom surfaces. The compliant layer can be disposed remote in a lateral direction along the contact bearing face from at least one contact adjacent to the sloping surface. Bond ribbons can be formed atop the compliant layer, wherein each bond ribbon electrically connects one of the contacts to an associated conductive terminal at the top surface of the compliant layer. The compliant layer can provide stress relief to the bond ribbons, such as during handling and affixing the assembly to an external substrate. A bond ribbon can include a strip extending along the sloping surface of the compliant layer, the strip having a substantially constant thickness in a direction extending away from the sloping surface.

Abstract translation: 提供一种制造半导体芯片封装的方法，其中柔性层设置在半导体芯片的接触支承面上方。 柔性层可以具有邻近芯片表面的底表面，背离底表面的顶表面以及顶表面和底表面之间的至少一个倾斜表面。 柔性层可以沿着邻近倾斜表面的至少一个接触件沿接触支承面在横向方向上远处设置。 结合带可以形成在顺应层上方，其中每个结合带将触点中的一个电连接到顺应层的顶表面处的相关联的导电端子。 顺应层可以对结合带提供应力消除，例如在处理和将组件固定到外部基板上时。 粘结带可以包括沿柔性层的倾斜表面延伸的条带，该带在远离倾斜表面的方向上具有基本上恒定的厚度。