公开(公告)号：US6023103A

公开(公告)日：2000-02-08

申请号：US106943

申请日：1998-06-30

Applicant: Sung Chul Chang ,  Igor Y. Khandros ,  William D. Smith

Inventor： Sung Chul Chang ,  Igor Y. Khandros ,  William D. Smith

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L29/417

CPC classification number: H01L23/3114 ,  H01L23/4951 ,  H01L23/49517 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L23/4985 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025

Abstract: A plurality of free-standing resilient contact structures (spring elements) are mounted to a surface of a carrier substrate. The carrier substrate is mounted to a surface of a semiconductor device, or one or more unsingulated semiconductor dies. Bond pads of the semiconductor device are connected to the spring elements by bond wires extending between the bond pads and terminals associated with the spring elements. The carrier substrate is mounted to one or more semiconductor devices prior to the semiconductor devices being singulated from a semiconductor wafer upon which they are formed. Resilience and compliance to effect pressure connections to the semiconductor device are provided by the spring elements extending from the carrier substrate, per se. The carrier substrate is pre-fabricated, by mounting the spring elements thereto prior to mounting the carrier substrate to the semiconductor device(s), or vice-versa.

Abstract translation: 多个独立的弹性接触结构（弹簧元件）被安装到载体基板的表面上。 载体衬底被安装到半导体器件的表面，或者一个或多个未起伏的半导体管芯。 半导体器件的接合焊盘通过在接合焊盘和与弹簧元件相关联的端子之间延伸的接合线连接到弹簧元件。 在半导体器件从形成它们的半导体晶片分离之前，将载体衬底安装到一个或多个半导体器件。 通过从载体基板本身延伸的弹簧元件提供弹性和顺应性来实现与半导体器件的压力连接。 在将载体衬底安装到半导体器件之前，通过将弹簧元件安装到其上来预先制造载体衬底，反之亦然。

公开(公告)号：US5998864A

公开(公告)日：1999-12-07

申请号：US863511

申请日：1997-05-27

Applicant: Igor Y. Khandros ,  David V. Pedersen

Inventor： Igor Y. Khandros ,  David V. Pedersen

IPC: B23K20/00 ,  C25D7/12 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01L23/02 ,  H05K7/00

CPC classification number: B23K20/004 ,  C25D7/12 ,  G01R1/07378 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/16 ,  H05K3/326 ,  H05K3/4015 ,  B23K2201/40 ,  G01R31/2886 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13616 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/141 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/368 ,  Y02P70/611

Abstract: High density packaging of semiconductor devices on an interconnection substrate is achieved by stacking bare semiconductor devices atop one another so that an edge portion of a semiconductor device extends beyond the semiconductor device that it is stacked atop. Elongate interconnection elements extend from the bottommost one of the semiconductor devices, and from the exposed edge portions of the semiconductor devices stacked atop the bottommost semiconductor device. Free-ends of the elongate interconnection elements make electrical contact with terminals of an interconnection substrate, such as a PCB. The elongate interconnection elements extending from each of the semiconductor devices are sized so as to reach the terminals of the PCB, which may be plated through holes. The elongate interconnection elements are suitably resilient contact structures, and may be composite interconnection elements comprising a relatively soft core (e.g., a gold wire) and a relatively hard overcoat (e.g., a nickel plating).

Abstract translation: 半导体器件在互连衬底上的高密度封装通过将裸半导体器件堆叠在一起而实现，使得半导体器件的边缘部分延伸超过其顶部堆叠的半导体器件。 细长的互连元件从最底层的半导体器件中延伸出来，并从半导体器件的暴露的边缘部分堆叠在最底部的半导体器件的顶部。 细长互连元件的自由端与诸如PCB的互连衬底的端子电接触。 从每个半导体器件延伸的细长互连元件的尺寸被设计成到达可以通过孔电镀的PCB的端子。 细长互连元件是合适的弹性接触结构，并且可以是包括相对软的芯（例如，金线）和相对硬的外涂层（例如镀镍）的复合互连元件。

公开(公告)号：US5994152A

公开(公告)日：1999-11-30

申请号：US788740

申请日：1997-01-24

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu

IPC: H01L21/44

CPC classification number: H01L21/44

Abstract: Interconnection elements and/or tip structures for interconnection elements may first be fabricated upon sacrificial substrates for subsequent mounting to electronic components. In this manner, the electronic components are not `at risk` during the fabrication process. The sacrificial substrate establishes a predetermined spatial relationship between the interconnection elements which may be composite interconnection elements having a relatively soft elongate element as a core and a relatively hard (springy material) overcoat. Tip structures fabricated on sacrificial substrates may be provided with a surface texture optimized for mounting to any interconnection elements for making pressure connections to terminals of electronic components. Interconnection elements may be fabricated upon such tip structures, or may first be mounted to the electronic component and the tip structures joined to the free-ends of the interconnection elements. Tip structures formed as cantilever beams are described.

Abstract translation: 用于互连元件的互连元件和/或尖端结构可以首先在牺牲基板上制造以用于随后安装到电子部件。 以这种方式，电子部件在制造过程中不“处于危险中”。 牺牲衬底在互连元件之间建立预定的空间关系，其可以是具有作为芯的相对柔软的细长元件和相对硬（弹性材料）外涂层的复合互连元件。 在牺牲基板上制造的尖端结构可以设置有优化的表面纹理，用于安装到任何互连元件，用于与电子部件的端子进行压力连接。 互连元件可以制造在这样的尖端结构上，或者可以首先安装到电子部件，并且尖端结构连接到互连元件的自由端。 描述形成为悬臂梁的尖端结构。

公开(公告)号：US5773780A

公开(公告)日：1998-06-30

申请号：US797023

申请日：1996-02-07

Applicant: Benjamin N. Eldridge ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gaetan L. Mathieu

IPC: B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: B23K20/004 ,  C25D7/12 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/24 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3426 ,  H05K3/4015 ,  H05K7/1069 ,  B23K2201/40 ,  C25D21/02 ,  C25D5/08 ,  C25D5/22 ,  G01R3/00 ,  G01R31/2884 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/4569 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613

Abstract: The efficacy of electrical discharges for severing bond wires and/or for forming balls at the ends of bond wires (including bond wires already severed by alternative mechanisms) is improved by performing the electrical discharges in the presence of ultraviolet light. A "spark gap" is formed between an EFO electrode and the wire, one of which serves as the cathode of the spark gap. Preferably, the ultraviolet light is directed at the element serving as the cathode of the spark gap. Providing photoemission at the cathode element of the spark gap stabilizes arc/plasma formation and produces more reliable and predictable results. This technique may be used in conjunction with negative EFO systems or with positive EFO systems, and may benefit from either direct or field-assisted photoemission.

Abstract translation: 通过在紫外光的存在下进行放电，提高了在接合线（包括已被替代机构切断的接合线）的端部切断接合线和/或形成球的放电功效。 在EFO电极和导线之间形成“火花隙”，其中一个用作火花隙的阴极。 优选地，紫外线指向用作火花隙的阴极的元件。 在火花间隙的阴极元件处提供光电发射使电弧/等离子体形成稳定，并产生更可靠和可预测的结果。 这种技术可以与负EFO系统或正EFO系统结合使用，并可从直接或场辅助光电发射中受益。

公开(公告)号：US2782310A

公开(公告)日：1957-02-19

申请号：US53358455

申请日：1955-09-12

Applicant: RCA CORP

Inventor： JACK KABELL LOUIS

IPC: H03B5/12 ,  H04N9/455

CPC classification number: H04N9/455 ,  H03B5/1203 ,  H03B5/1231 ,  H03B5/1296

公开(公告)号：US1981926A

公开(公告)日：1934-11-27

申请号：US55833231

申请日：1931-08-20

Applicant: ICI LTD

Inventor： JOSEPH SAVAGE ,  RICHARD THOMAS

CPC classification number: A01N29/04

公开(公告)号：US1731055A

公开(公告)日：1929-10-08

申请号：US73581324

申请日：1924-09-04

Applicant: WESTERN ELECTRIC CO

Inventor： ALFRED MARCHEV

IPC: H01B13/30

CPC classification number: H01B13/30 ,  Y10S118/19

公开(公告)号：US20250067799A1

公开(公告)日：2025-02-27

申请号：US18948055

申请日：2024-11-14

Applicant: FormFactor, Inc.

Inventor： Jörg Hertwig ,  Benedikt Marx

IPC: G01R31/28 ,  G01R1/067

Abstract: Probe systems and methods of operating probe systems. The probe systems include a chuck that defines a support surface. The probe systems also include a cover plate. The probe systems further include a probe positioner that includes a positioner base, a manipulator that extends from the positioner base, and a probe arm that extends from the manipulator. The probe systems also include a probe operatively attached to the probe arm and a positioner attachment structure that separably attaches the positioner base to the cover plate. The positioner attachment structure includes an attachment structure body that defines a positioner base-facing side and a cover plate-facing side. The positioner attachment structure also includes an adhesive material that adheres the positioner base-facing side to the positioner base. The cover plate-facing side of the attachment structure body defines a micropatterned dry adhesive that separably attaches the attachment structure body to the cover plate.

公开(公告)号：US20240345133A1

公开(公告)日：2024-10-17

申请号：US18634655

申请日：2024-04-12

Applicant: FormFactor, Inc.

Inventor： Sterling Tadashi Collins ,  Vinh-Lam Olivier Buu ,  Kevin John Hughes

IPC: G01R1/073

CPC classification number: G01R1/07314

Abstract: A roller mechanism with controlled height is used for probe tap-down in arrays of vertical probes for device testing. The height can be controlled using features of the roller, or external shims. This approach overcomes issues related to guide plate flexure during plate tap down by reducing forces on guide plates. It also avoids issues of probe damage from manual tap down.

公开(公告)号：US20230393174A1

公开(公告)日：2023-12-07

申请号：US18205735

申请日：2023-06-05

Applicant: FormFactor, Inc.

Inventor： Ernest Gammon McReynolds ,  Jerry Martyniuk ,  Tim Lesher ,  Tomoe Yokoyama ,  David Raschko ,  Uyen Nguyen ,  Pratik Bakul Ghate

IPC: G01R1/073 ,  G01R31/28

CPC classification number: G01R1/07378 ,  G01R31/2889

Abstract: Improved performance for attenuated testing when probing a device under test with a probe array is provided. By moving the attenuation components from their conventional location on the printed circuit board of the probe head to the space transformer of the probe head, electrical path lengths can be decreased, thereby improving performance. This is particularly helpful in connection with loopback testing.