公开(公告)号：US20170208684A1

公开(公告)日：2017-07-20

申请号：US15476235

申请日：2017-03-31

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler ,  Ralf Otremba

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/02 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/036 ,  H05K1/0203 ,  H05K1/032 ,  H05K1/0373 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/0094 ,  H05K3/02 ,  H05K3/105 ,  H05K3/4038 ,  H05K3/4626 ,  H05K2201/0104 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0281 ,  H05K2203/107 ,  H05K2203/1136 ,  Y10T29/49126 ,  Y10T428/24909

Abstract: A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer. The polymer includes at least one of a carbon layer structure and a carbon-like layer structure.

公开(公告)号：US09648735B2

公开(公告)日：2017-05-09

申请号：US14729158

申请日：2015-06-03

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler ,  Ralf Otremba

IPC: H05K1/03 ,  H05K3/00 ,  H05K1/11 ,  H05K3/10 ,  H05K3/46

CPC classification number: H05K1/036 ,  H05K1/0203 ,  H05K1/032 ,  H05K1/0373 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/0094 ,  H05K3/02 ,  H05K3/105 ,  H05K3/4038 ,  H05K3/4626 ,  H05K2201/0104 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0281 ,  H05K2203/107 ,  H05K2203/1136 ,  Y10T29/49126 ,  Y10T428/24909

Abstract: A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer, wherein the polymer includes metallic particles.

公开(公告)号：US20160366761A1

公开(公告)日：2016-12-15

申请号：US15173697

申请日：2016-06-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKASHI HOSHI ,  TAKESHI KITAMURA ,  KEIKO KASHIHARA ,  HIROHARU INOUE

IPC: H05K1/03 ,  H05K1/11 ,  C08J5/24

CPC classification number: H05K1/0366 ,  B32B15/14 ,  B32B2260/046 ,  C08G59/62 ,  C08J5/24 ,  C08J2363/00 ,  C08J2433/02 ,  C08J2433/06 ,  C08J2433/08 ,  C08L63/00 ,  H05K1/0271 ,  H05K1/0373 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/029

Abstract: A prepreg includes a resin composition including: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic hardener having a naphthalene skeleton; (B) a polymer having at least the structures of formulae (2) and (3) among formulae (1), (2) and (3) and having a weight-average molecular weight of from 200,000 to 850,000 inclusive; and (C) an inorganic filler: wherein x:y:z (molar fraction)=0:0.95:0.05 to 0.2:0.6:0.2 (where x+y+z≦1, 0≦x≦0.2, 0.6≦y≦0.95, 0.05≦z≦0.2); R1 represents a hydrogen atom or a methyl group and R2 includes at least one of a glycidyl group and an epoxidized alkyl group among a hydrogen atom, an alkyl group, a glycidyl group and an epoxidized alkyl group in formula (2); and R3 represents a hydrogen atom or a methyl group and R4 represents Ph (phenyl group), —COOCH2Ph or —COO(CH2)2Ph in formula (3).

公开(公告)号：US20160309585A1

公开(公告)日：2016-10-20

申请号：US15098679

申请日：2016-04-14

Applicant: Seiko Epson Corporation

Inventor： Hidefumi NAKAMURA ,  Taku KAWASAKI

IPC: H05K1/02 ,  H01B1/22 ,  H03H9/10 ,  H01B19/00 ,  H05K3/22

CPC classification number: H05K1/0296 ,  B22F1/0059 ,  B22F1/02 ,  B22F3/02 ,  B22F2009/0828 ,  B22F2998/10 ,  H01B1/22 ,  H01B19/00 ,  H03H9/10 ,  H05K1/0373 ,  H05K3/105 ,  H05K3/1216 ,  H05K3/22 ,  H05K3/4038 ,  H05K2201/0224 ,  H05K2201/09118 ,  H05K2203/0278 ,  H05K2203/107 ,  H05K2203/1126 ,  H05K2203/1131 ,  H05K2203/1136 ,  H05K2203/1461 ,  B22F3/105 ,  B22F2003/023

Abstract: A method for producing an electrical wiring member includes press-molding a composition containing a resin material and metal particles with an insulating layer, each of which is constituted by a metal particle and a surface insulating layer covering the metal particle and containing a glass material as a main material, thereby obtaining a powder-compacted layer and irradiating the powder-compacted layer with an energy beam, thereby causing the irradiated regions to exhibit electrical conductivity.

Abstract translation: 一种电气布线构件的制造方法包括：将含有树脂材料的组合物和具有绝缘层的金属颗粒加压成型，所述绝缘层由金属颗粒和覆盖所述金属颗粒的表面绝缘层构成，并且含有玻璃材料作为 从而获得粉末压实层并用能量束照射粉末压实层，从而使照射区域呈现导电性。

公开(公告)号：US09457406B2

公开(公告)日：2016-10-04

申请号：US13496550

申请日：2010-09-13

Applicant: Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Katsuyuki Masuda ,  Yoshinori Ejiri ,  Maki Inada ,  Kyoko Kuroda

Inventor： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Katsuyuki Masuda ,  Yoshinori Ejiri ,  Maki Inada ,  Kyoko Kuroda

IPC: B22F3/24 ,  B22F9/26 ,  B32B15/01 ,  C22C5/04 ,  C22C9/00 ,  H01B1/02 ,  H05K3/12 ,  B22F9/22 ,  B22F1/02 ,  H05K1/09 ,  H05K3/10

CPC classification number: B22F9/26 ,  B22F1/02 ,  B22F9/22 ,  B22F9/24 ,  B22F2201/01 ,  B22F2301/10 ,  B22F2302/25 ,  B22F2999/00 ,  B32B15/01 ,  C22C5/04 ,  C22C9/00 ,  H01B1/026 ,  H05K1/097 ,  H05K3/105 ,  H05K3/1283 ,  H05K2201/0224 ,  H05K2201/0272 ,  H05K2203/0315 ,  H05K2203/1131 ,  H05K2203/1157 ,  Y10T156/10 ,  Y10T428/12903 ,  B22F2201/013 ,  B22F2202/13

Abstract: Disclosed are: a copper metal film which has good adhesion to a substrate, low volume resistivity, and good deep-part metal properties; and a method for producing a copper metal film, wherein the copper metal film can be produced by reducing a substrate to a deep part thereof without damaging the substrate. Specifically disclosed is a copper metal film obtained by treating a copper-based particle deposition layer containing both copper oxides and a metallic transition metal or alloy, or a transition metal complex containing a metal element, with gaseous formic acid and/or formaldehyde heated to 120° C. or higher. The copper oxide is preferably copper (I) oxide and/or copper (II) oxide. The transition metal, alloy or metal complex are preferably a metal selected from the group consisting of Cu, Pd, Pt, Ni, Ag, Au and Rh, an alloy containing the metal, or a complex containing the metal element, respectively.

Abstract translation: 公开了一种对基板具有良好粘合性的铜金属膜，体积电阻率小，以及良好的深部金属性质; 以及铜金属膜的制造方法，其中可以通过将基板还原到其深部而不损坏基板来制造铜金属膜。 具体公开了通过将含有氧化铜和金属过渡金属或合金的铜基颗粒沉积层或含有金属元素的过渡金属络合物与加热至120℃的气态甲酸和/或甲醛处理而获得的铜金属膜 ℃以上。 氧化铜优选为氧化铜（I）和/或氧化铜（II）。 过渡金属，合金或金属络合物优选为分别选自Cu，Pd，Pt，Ni，Ag，Au和Rh的金属，含金属的合金或含金属元素的复合物。

公开(公告)号：US20160280969A1

公开(公告)日：2016-09-29

申请号：US14904495

申请日：2014-07-28

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU

IPC: C09J9/02 ,  H05K3/36 ,  H01R43/16 ,  C09J7/02

CPC classification number: C09J9/02 ,  C08K3/04 ,  C08K3/08 ,  C08K7/18 ,  C09J7/22 ,  C09J7/30 ,  C09J11/04 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2467/006 ,  H01R43/16 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0224 ,  H05K2203/0139 ,  H05K2203/0534 ,  H05K2203/0545

Abstract: Electrically conductive particles filled in the openings are securely transferred and attached to the binder resin layer. The invention further includes a step of filling a solvent and electrically conductive particles in a plurality of openings formed on a surface of a substrate in a predetermined pattern, a step of pasting a surface on which a binder resin layer is formed of an adhesive film having the binder resin layer formed on a base film on a surface on which the openings are formed of the substrate, and a step of peeling off the adhesive film from the surface of the substrate and transferring and attaching the electrically conductive particles filled in the openings to the binder resin layer while heating the substrate.

Abstract translation: 填充在开口中的导电颗粒被牢固地转移并附着到粘结剂树脂层上。 本发明还包括在预定图案的基板的表面上形成的多个开口填充溶剂和导电性粒子的步骤，将由粘合剂树脂层形成的表面粘贴在其上形成有粘合剂膜的工序， 在由基板形成开口的表面上形成在基膜上的粘合剂树脂层，以及从基板表面剥离粘合剂膜并将填充在开口中的导电颗粒转移并附着到 粘合剂树脂层，同时加热基板。

公开(公告)号：US20150359091A1

公开(公告)日：2015-12-10

申请号：US14729158

申请日：2015-06-03

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler ,  Ralf Otremba

IPC: H05K1/03 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/036 ,  H05K1/0203 ,  H05K1/032 ,  H05K1/0373 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/0094 ,  H05K3/02 ,  H05K3/105 ,  H05K3/4038 ,  H05K3/4626 ,  H05K2201/0104 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0281 ,  H05K2203/107 ,  H05K2203/1136 ,  Y10T29/49126 ,  Y10T428/24909

Abstract: A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer, wherein the polymer includes metallic particles.

Abstract translation: 印刷电路板包括导电层和包括聚合物的介电层，其中聚合物包括金属颗粒。

公开(公告)号：US20150053753A1

公开(公告)日：2015-02-26

申请号：US14389668

申请日：2012-03-30

Applicant: Teruo Komatsu ,  Ryo Matsubayashi

Inventor： Teruo Komatsu ,  Ryo Matsubayashi

IPC: B23K35/02 ,  B23K35/36 ,  B23K1/20 ,  B23K35/30

CPC classification number: B23K35/025 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B23K1/20 ,  B23K35/302 ,  B23K35/3612 ,  H01B1/026 ,  H01B1/22 ,  H05K1/092 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0272

Abstract: The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity, and electrical property.The present invention is a copper-filler-containing composite nanometal paste that contains composite nanometal particles each comprising a metal core and an organic coating layer formed thereon. The metal paste contains a copper filler and contains, as binders, first composite nanometal particles and second composite nanometal particles which differ from the first composite nanometal particles in the thermal decomposition temperature of the organic coating layer, wherein the mass proportion W1 of the organic coating layer in the first composite nanometal particles is in the range of 2-13 mass %, the mass proportion W2 of the organic coating layer in the second composite nanometal particles is in the range of 5-25 mass %, and these particles satisfy the relationships W1.

Abstract translation: 本发明解决了提供价格相对低廉并且在结合特性，导热性和电性能方面优异的复合纳米金属糊的问题。 本发明是一种含有铜填料的复合纳米金属浆料，其含有复合纳米金属颗粒，每个复合纳米金属颗粒均包含金属芯和形成在其上的有机涂层。 金属糊包含铜填料，在有机涂层的热分解温度中含有与第一复合纳米金属颗粒不同的第一复合纳米金属颗粒和第二复合纳米金属颗粒作为粘合剂，其中有机涂层的质量比例W1 第一复合纳米金属颗粒中的层在2-13质量％的范围内，第二复合纳米金属颗粒中的有机涂层的质量比例W2在5〜25质量％的范围内，并且这些颗粒满足关系 W1。

公开(公告)号：US20140287158A1

公开(公告)日：2014-09-25

申请号：US14219047

申请日：2014-03-19

Applicant: Intrinsiq Materials, Inc.

Inventor： Janet Heyen ,  Michael Carmody

IPC: C09D5/24

CPC classification number: H05K1/095 ,  C08K9/10 ,  H01B1/22 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/0326 ,  H05K3/1216 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0224 ,  H05K2201/0245 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/0514 ,  H01L2924/00

Abstract: A conductive paste for screen application has a mixture of copper flake having a mean diameter between 1.0-8.0 micrometers and copper nanoparticles having a mean diameter from 10 nm to 100 nm, wherein the ratio of the copper flake to the nanoparticles is between 2:1 and 5:1 by weight; and a resin comprising about half of a polymer having a molecular weight in excess of 10,000 and one or more solvents.

Abstract translation: 用于筛网的导电糊剂具有平均直径在1.0-8.0微米之间的铜薄片和平均直径为10nm至100nm的铜纳米颗粒的混合物，其中铜片与纳米颗粒的比例为2:1 和5：1重量比; 以及包含分子量超过10,000的聚合物的大约一半的树脂和一种或多种溶剂。

公开(公告)号：US20130292168A1

公开(公告)日：2013-11-07

申请号：US13880975

申请日：2011-09-23

Applicant: Daniel Wolde-Giorgis ,  Andrea Feiock

Inventor： Daniel Wolde-Giorgis ,  Andrea Feiock

IPC: H05K13/04 ,  B23K35/34 ,  H05K1/11

CPC classification number: H05K13/0465 ,  B22F1/0074 ,  B22F1/02 ,  B22F3/1039 ,  B23K35/34 ,  C22C1/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/27003 ,  H01L2224/2731 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/29 ,  H01L2224/29078 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29338 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29439 ,  H01L2224/29487 ,  H01L2224/29493 ,  H01L2224/32221 ,  H01L2224/37986 ,  H01L2224/37993 ,  H01L2224/75101 ,  H01L2224/75102 ,  H01L2224/75272 ,  H01L2224/83055 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/8309 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/351 ,  H05K1/097 ,  H05K1/11 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2201/0224 ,  H05K2203/121 ,  Y10T403/477 ,  H01L2924/0541 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a starter material for a sintering compound, said starter material comprising particles which at least proportionally contain an organic metal compound and/or a precious metal oxide, the organic metal compound and/or the precious metal oxide being converted during heat treatment of the starter material into the elemental metal and/or precious metal. The invention is characterized in that the particles have a coating containing a reducing agent by means of which the organic metal compound and/or precious metal oxide is reduced to the elemental metal and/or precious metal at a temperature below the sintering temperature of the elemental metal and/or precious metal.

Abstract translation: 本发明涉及一种用于烧结化合物的起始材料，所述起始材料包括至少成比例地含有有机金属化合物和/或贵金属氧化物的颗粒，在热处理期间转化的有机金属化合物和/或贵金属氧化物 的起始材料进入元素金属和/或贵金属。 本发明的特征在于，颗粒具有含有还原剂的涂层，借助该还原剂，有机金属化合物和/或贵金属氧化物在低于元素的烧结温度的温度下还原成元素金属和/或贵金属 金属和/或贵金属。