公开(公告)号：US11674977B2

公开(公告)日：2023-06-13

申请号：US17682769

申请日：2022-02-28

Applicant: JF MICROTECHNOLOGY SDN. BHD

Inventor： Wei Kuong Foong ,  Kok Sing Goh ,  Shamal Mundiyath ,  Eng Kiat Lee ,  Grace Ann Nee Yee

IPC: H05K1/02 ,  G01R1/04 ,  G01R1/073

CPC classification number: G01R1/0466 ,  G01R1/0735 ,  G01R1/07364 ,  H05K1/0268 ,  H05K1/0283 ,  H05K1/0296 ,  H05K2201/1078 ,  H05K2201/1084 ,  H05K2201/10704 ,  H05K2201/10795

Abstract: An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped concave surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

公开(公告)号：US09955586B2

公开(公告)日：2018-04-24

申请号：US14800751

申请日：2015-07-16

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： Ting-Ying Wu ,  Cheng-Lin Wu ,  Chin-Yuan Lo ,  Wen-Shan Wang

IPC: H05K7/10 ,  H05K3/34 ,  H01L23/498 ,  H01L23/50 ,  H05K7/00 ,  H05K7/12 ,  H05K1/02

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/0215 ,  H05K1/0289 ,  H05K2201/10159 ,  H05K2201/10704 ,  H05K2201/10712 ,  H05K2201/10719 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00

Abstract: A Ball Grid Array (BGA) formed on printed circuit board is provided. The BGA comprises a first solder ball module and a second solder ball module. The first solder ball module comprises a plurality of first solder balls, wherein one of the first solder balls is grounded for shielding two other first solder balls, and one of the first solder balls is floating. The second solder ball module comprises a plurality of second solder balls, wherein two of the second solder balls are grounded and one of the two grounded second solder balls penetrates the printed circuit board through a plated through hole formed on the printed circuit board for shielding two first solder balls among the first solder balls.

公开(公告)号：US09924595B2

公开(公告)日：2018-03-20

申请号：US14567402

申请日：2014-12-11

Applicant: Intel Corporation

Inventor： Beom-Taek Lee ,  Raul Enriquez Shibayama

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H05K1/11 ,  H05K1/14 ,  H01R12/58 ,  H01R12/71 ,  H01R31/06

CPC classification number: H05K1/115 ,  H01R12/585 ,  H01R12/718 ,  H01R31/06 ,  H05K1/147 ,  H05K1/184 ,  H05K2201/10295 ,  H05K2201/10356 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/1059 ,  H05K2201/10704 ,  H05K2201/10901

Abstract: In one embodiment, the apparatus comprises: a substrate having a first side and a second side, the second side being on an opposite side of the substrate from the first side, where the substrate has a first location on the first side at which an semiconductor package is to be coupled; and a cable coupled to the substrate on the second side of the substrate at a second location on the second side, the second location being at least partially below the first location.

公开(公告)号：US09865953B2

公开(公告)日：2018-01-09

申请号：US15646234

申请日：2017-07-11

Applicant: International Business Machines Corporation

Inventor： Na Fan ,  Jun Hu ,  Sen Xiong Huang ,  YongDong Shi ,  XiYuan Yin

IPC: H01R13/415 ,  H01R13/11 ,  H01R43/04 ,  H01R12/71

CPC classification number: H01R13/11 ,  H01R12/57 ,  H01R12/716 ,  H01R43/04 ,  H01R43/205 ,  H05K1/184 ,  H05K3/3447 ,  H05K7/1069 ,  H05K2201/10303 ,  H05K2201/10704 ,  H05K2201/1078 ,  H05K2201/10803

Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

公开(公告)号：US09775242B2

公开(公告)日：2017-09-26

申请号：US15005589

申请日：2016-01-25

Applicant: Intel Corporation

Inventor： Tsung-Yu Chen ,  Rebecca Shia

IPC: H01L23/488 ,  H01L21/60 ,  H05K1/11 ,  H01L23/48 ,  H05K3/10 ,  H01L21/48 ,  H05K5/00 ,  H01R13/04 ,  H01L23/498 ,  H05K3/40 ,  H01L23/373 ,  H05K3/34

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/4885 ,  H01L23/373 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01R13/04 ,  H05K3/103 ,  H05K3/3426 ,  H05K3/4015 ,  H05K5/0069 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10787 ,  H05K2201/10795 ,  H05K2201/1081 ,  H05K2203/1178 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.

公开(公告)号：US20170256875A1

公开(公告)日：2017-09-07

申请号：US15060728

申请日：2016-03-04

Applicant: International Business Machines Corporation

Inventor： Na Fan ,  Jun Hu ,  Sen Xiong Huang ,  YongDong Shi ,  XiYuan Yin

IPC: H01R13/11 ,  H01R12/71 ,  H01R43/04

CPC classification number: H01R13/11 ,  H01R12/57 ,  H01R12/716 ,  H01R43/04 ,  H01R43/205 ,  H05K1/184 ,  H05K3/3447 ,  H05K7/1069 ,  H05K2201/10303 ,  H05K2201/10704 ,  H05K2201/1078 ,  H05K2201/10803

Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

公开(公告)号：US09313877B2

公开(公告)日：2016-04-12

申请号：US13508974

申请日：2010-10-20

Applicant: Hisashi Ishida

Inventor： Hisashi Ishida

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0236 ,  H05K1/0233 ,  H05K1/141 ,  H05K2201/09727 ,  H05K2201/10265 ,  H05K2201/10704 ,  H05K2201/10734 ,  Y10T29/49155

Abstract: A first interconnect substrate includes a first conductor pattern. A second interconnect substrate includes a second conductor pattern. At least a portion of the second conductor pattern is formed in a region opposite the first conductor pattern. At least either the first conductor pattern or the second conductor pattern has a repeated structure. The first conductor pattern and the second conductor pattern constitute at least a portion of an electromagnetic band gap (EBG) structure.

Abstract translation: 第一互连基板包括第一导体图案。 第二互连基板包括第二导体图案。 第二导体图案的至少一部分形成在与第一导体图案相对的区域中。 第一导体图案或第二导体图案中的至少一个具有重复的结构。 第一导体图案和第二导体图案构成电磁带隙（EBG）结构的至少一部分。

公开(公告)号：US20160021745A1

公开(公告)日：2016-01-21

申请号：US14800751

申请日：2015-07-16

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： TING-YING WU ,  CHENG-LIN WU ,  CHIN-YUAN LO ,  WEN-SHAN WANG

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/0215 ,  H05K1/0289 ,  H05K2201/10159 ,  H05K2201/10704 ,  H05K2201/10712 ,  H05K2201/10719 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00

Abstract: A Ball Grid Array (BGA) formed on printed circuit board is provided. The BGA comprises a first solder ball module and a second solder ball module. The first solder ball module comprises a plurality of first solder balls, wherein one of the first solder balls is grounded for shielding two other first solder balls, and one of the first solder balls is floating. The second solder ball module comprises a plurality of second solder balls, wherein two of the second solder balls are grounded and one of the two grounded second solder balls penetrates the printed circuit board through a plated through hole formed on the printed circuit board for shielding two first solder balls among the first solder balls.

Abstract translation: 提供了一种形成在印刷电路板上的球栅阵列（BGA）。 BGA包括第一焊球模块和第二焊球模块。 第一焊球模块包括多个第一焊球，其中第一焊球之一接地以屏蔽两个其它第一焊球，并且第一焊球中的一个浮动。 第二焊球模块包括多个第二焊球，其中两个第二焊球接地，并且两个接地的第二焊球中的一个通过形成在印刷电路板上的电镀通孔穿透印刷电路板，用于屏蔽两个 第一焊球之间的第一焊球。

公开(公告)号：US08803003B2

公开(公告)日：2014-08-12

申请号：US13525531

申请日：2012-06-18

Applicant: Paul L. Mantiply ,  Straty Argyrakis

Inventor： Paul L. Mantiply ,  Straty Argyrakis

IPC: H05K1/11

CPC classification number: H05K1/0228 ,  H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/11 ,  H05K2201/09227 ,  H05K2201/09609 ,  H05K2201/10704 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A circuit board is provided which includes a plurality of signal pairs of connectors. The signal pairs of connectors are disposed in a triangular grouping of three signal pairs of connectors such that a first connector of each signal pair is located at a vertex of the triangular grouping. A second connector of each signal pair is located at a side of the triangular grouping adjacent to the vertex of the first connector. The signal pairs may be differential pairs.

Abstract translation: 提供了包括多个信号对连接器的电路板。 连接器的信号对被布置成三个三组信号对的连接器，使得每个信号对的第一连接器位于三角形分组的顶点。 每个信号对的第二连接器位于与第一连接器的顶点相邻的三角形组的一侧。 信号对可以是差分对。

公开(公告)号：US08549737B2

公开(公告)日：2013-10-08

申请号：US12659777

申请日：2010-03-22

Applicant: Deepak K. Pai

Inventor： Deepak K. Pai

IPC: H05K3/00

CPC classification number: H05K3/3436 ,  H05K1/0271 ,  H05K3/3426 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10704 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49158 ,  Y10T29/49163 ,  Y10T29/49171 ,  Y10T29/49176

Abstract: The present invention relates to a compliant leaded interposer for resiliently attaching and electrically connecting a ball grid array package to a circuit board. The interposer may include a substrate, a plurality of pads, and a plurality of pins. The plurality of pads may be positioned substantially on the top surface of the substrate and arranged in a predetermined pattern substantially corresponding to the solder ball pattern on the ball grid array package. The plurality of pins may be positioned substantially perpendicular to the substrate and may extend through the substrate and the plurality of pads. The interposer may be configured to attach the ball grid array package to the circuit board such that each of the solder balls on the ball grid array package contacts at least a portion the plurality of pins and at least a portion of the plurality of pads and such that the each of the plurality of pins also connects to a contact on the circuit board.

Abstract translation: 本发明涉及一种用于将球栅阵列封装弹性地连接并电连接到电路板的柔性引线插入器。 插入器可以包括基板，多个焊盘和多个引脚。 多个焊盘可以基本上位于衬底的顶表面上并且以基本上对应于球栅阵列封装上的焊球图案的预定图案布置。 多个销可以被定位成基本上垂直于衬底并且可以延伸通过衬底和多个衬垫。 插入器可以被配置为将球栅阵列封装附接到电路板，使得球栅阵列封装上的每个焊球接触多个引脚和多个焊盘的至少一部分的至少一部分， 多个引脚中的每一个也连接到电路板上的触点。