公开(公告)号：US20090032822A1

公开(公告)日：2009-02-05

申请号：US11939552

申请日：2007-11-13

Applicant: Chun-Cheng Lin ,  Abram Chang ,  Sheng-Jia Sheu ,  Eddie Huang

Inventor： Chun-Cheng Lin ,  Abram Chang ,  Sheng-Jia Sheu ,  Eddie Huang

IPC: H01L33/00

CPC classification number: H05K1/0203 ,  H01L33/647 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/10659

Abstract: A high power light emitting diode, The high power light emitting diode comprises a light emitting diode chip, a main module, two first electrode pins, two second electrode pins, and at least one heat dissipation board. The main module has a concave and the light emitting diode chip is positioned in the concave. The first electrode pins are connected to a first side of the main module and also electrically connected to the light emitting diode chip. The second electrode pins are arranged on a second side of the main module that is relative to the first electrode pins wherein the second electrode pins and the first electrode pins are electrically opposite. The second electrode pins are electrically connected to the light emitting diode chip. The heat dissipation board is connected to a part of the main module between the first electrode pin and the second electrode pin.

Abstract translation: 大功率发光二极管，大功率发光二极管包括发光二极管芯片，主模块，两个第一电极引脚，两个第二电极引脚和至少一个散热板。 主模块具有凹面，发光二极管芯片位于凹面。 第一电极引脚连接到主模块的第一侧，并且电连接到发光二极管芯片。 第二电极引脚布置在主模块的相对于第一电极引脚的第二侧，其中第二电极引脚和第一电极引脚电气相对。 第二电极引脚电连接到发光二极管芯片。 散热板与主模块的一部分连接在第一电极销和第二电极销之间。

公开(公告)号：US20080117622A1

公开(公告)日：2008-05-22

申请号：US11600094

申请日：2006-11-16

Applicant: Chun-Cheng Lin

Inventor： Chun-Cheng Lin

IPC: F21V33/00 ,  A47J37/07

CPC classification number: F21L4/04 ,  A47J37/0786 ,  F21V17/007 ,  F21V21/0965 ,  F21V33/008

Abstract: A lighting device for a barbecue stove includes a fixing seat mounted on a faceplate of the barbecue stove, a lamp body detachably mounted on the fixing seat, a lighting member mounted on a first end of the lamp body, a drive member mounted on a second end of the lamp body to drive the lamp body, and a magnetic member mounted on the drive member. Thus, the magnetic member of the lighting device is magnetically attached to a metallic surface located at any position of the barbecue stove so that the lighting device is arbitrarily attached to any position of the barbecue stove to provide a lighting effect.

Abstract translation: 一种用于烧烤炉的照明装置包括安装在烧烤炉的面板上的固定座，可拆卸地安装在固定座上的灯体，安装在灯体的第一端上的照明件，安装在第二个 灯体的端部以驱动灯体，以及安装在驱动构件上的磁性构件。 因此，照明装置的磁性构件被磁性地附接到位于烧烤炉的任何位置的金属表面，使得照明装置任意地附接到烧烤炉的任何位置以提供照明效果。

公开(公告)号：US20070054407A1

公开(公告)日：2007-03-08

申请号：US11487823

申请日：2006-07-17

Applicant: Yu-Ju Chen ,  Po-Chiao Lin ,  Chun-Cheng Lin ,  Shu-Hua Chen ,  Po-Hung Chou ,  Hsin Liao

Inventor： Yu-Ju Chen ,  Po-Chiao Lin ,  Chun-Cheng Lin ,  Shu-Hua Chen ,  Po-Hung Chou ,  Hsin Liao

IPC: G01N33/551

CPC classification number: B82Y15/00 ,  B82Y30/00 ,  G01N33/54333 ,  G01N33/6851

Abstract: The present invention provides methods, compositions, and systems for mass spectrometric analysis of magnetic nanoparticles displaying ligands on their surface. For example, the present invention provides methods of screening a sample for the presence of at least one analyte using ligand conjugated magnetic nanoparticles, magnetic separation, and mass spectrometric analysis. The present invention also relates to MALDI matrix compositions comprising ligand conjugated magnetic nanoparticles.

Abstract translation: 本发明提供了在其表面上显示配体的磁性纳米颗粒的质谱分析的方法，组合物和系统。 例如，本发明提供了使用配体共轭磁性纳米颗粒筛选样品以存在至少一种分析物的方法，磁分离和质谱分析。 本发明还涉及包含配体缀合的磁性纳米颗粒的MALDI基质组合物。

公开(公告)号：US20050287552A1

公开(公告)日：2005-12-29

申请号：US11091649

申请日：2005-03-28

Applicant: Chun-Cheng Lin ,  Yu-Ju Chen

Inventor： Chun-Cheng Lin ,  Yu-Ju Chen

IPC: A61K47/48 ,  C12Q1/68 ,  G01N33/53 ,  G01N33/554 ,  G01N33/569 ,  G01N33/58

CPC classification number: B82Y5/00 ,  G01N33/54346 ,  G01N33/56916 ,  G01N33/587 ,  G01N33/6851 ,  G01N2400/00

Abstract: The present invention provides methods and compositions for carbohydrate encapsulated nanoparticle based mass spectrometry. For example, the present invention provides methods of screening samples for carbohydrate binding molecules, methods of characterizing carbohydrate binding epitopes in target molecules, and MALDI matrix compositions comprising carbohydrate encapsulated nanoparticles.

Abstract translation: 本发明提供了用于碳水化合物包封的纳米颗粒的质谱法的方法和组合物。 例如，本发明提供筛选碳水化合物结合分子的样品的方法，表征靶分子中碳水化合物结合表位的方法，以及包含碳水化合物包封的纳米颗粒的MALDI基质组合物。

公开(公告)号：US20050046204A1

公开(公告)日：2005-03-03

申请号：US10653267

申请日：2003-09-03

Applicant: Chun-Cheng Lin

Inventor： Chun-Cheng Lin

IPC: E05B1/00 ,  E05B3/00 ,  E05B55/00

CPC classification number: E05B3/003 ,  E05B1/0007 ,  E05B55/005 ,  Y10T292/93

Abstract: A latching axle assembly includes an axle having a head formed at an end of the axle. Multiple recesses are defined at an outer periphery of the head. A cap has multiple protrusions formed at an inner wall of the cap and respectively positioned in the recesses to detachably mount the cap on the head. The cap can be easily and quickly mounted on the axle, and can be detached from an axle found to be defective.

Abstract translation: 锁定轴组件包括具有在轴的端部处形成的头部的车轴。 多个凹口限定在头部的外周。 帽在盖的内壁处形成有多个突出部，并且分别定位在凹部中以将帽可拆卸地安装在头部上。 盖可以方便快捷地安装在轴上，并且可以从发现有缺陷的轴上拆下。

公开(公告)号：US20230023998A1

公开(公告)日：2023-01-26

申请号：US17853861

申请日：2022-06-29

Applicant: Chun-Cheng Lin ,  Shy-Luen Chern ,  Chih-Hsiang Tang ,  Hong-Wen Lee

Inventor： Chun-Cheng Lin ,  Shy-Luen Chern ,  Chih-Hsiang Tang ,  Hong-Wen Lee

IPC: H01R13/17 ,  H01R13/629 ,  H01R13/502 ,  H01R13/24

Abstract: An electrical connector assembly including a first connector and a second connector to be mated with each other is provided. The first connector includes a first body, and at least one first terminal and multiple second terminals disposed therein. The second terminals are symmetrically arranged at opposite sides of the first terminal. The second connector includes a second body, at least one third terminal movably disposed in the second body, multiple fourth terminals disposed in the second body and symmetrically arranged at opposite sides of the third terminal, and a driving module electrically connected to at least one of the fourth terminals and structurally connected to the third terminal. In the mating process of the first and second connector, the second terminals and the fourth terminals are electrically connected firstly, to trigger the driving module to move the third terminal to be structurally and electrically connected to the first terminal.

公开(公告)号：US09412689B2

公开(公告)日：2016-08-09

申请号：US13357379

申请日：2012-01-24

Applicant: Chun-Cheng Lin ,  Chung-Shi Liu ,  Kuei-Wei Huang ,  Cheng-Ting Chen ,  Wei-Hung Lin ,  Ming-Da Cheng

Inventor： Chun-Cheng Lin ,  Chung-Shi Liu ,  Kuei-Wei Huang ,  Cheng-Ting Chen ,  Wei-Hung Lin ,  Ming-Da Cheng

IPC: H01L23/02 ,  H01L23/498 ,  H01L25/10 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/0273 ,  H01L21/486 ,  H01L21/56 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/0239 ,  H01L2224/03452 ,  H01L2224/0401 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/1131 ,  H01L2224/11424 ,  H01L2224/1152 ,  H01L2224/1162 ,  H01L2224/11825 ,  H01L2224/11849 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13611 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01048 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15747 ,  H01L2924/18161 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.

Abstract translation: 提供一种用于封装半导体管芯的系统和方法。 实施例包括具有第一触点和第二触点的第一封装。 在第一接触件上形成接触后材料，以便调节接触垫之间的接头的高度，导体凸块。 在另一个实施例中，使用导电柱来控制接触垫和外部连接之间的接头的高度。

公开(公告)号：US09312214B2

公开(公告)日：2016-04-12

申请号：US13240629

申请日：2011-09-22

Applicant: Meng-Tse Chen ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L23/498 ,  H01L21/60 ,  H01L21/50 ,  H01L21/56 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L21/486 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2924/12042 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method includes applying a polymer-comprising material over a carrier, and forming a via over the carrier. The via is located inside the polymer-comprising material, and substantially penetrates through the polymer-comprising material. A first redistribution line is formed on a first side of the polymer-comprising material. A second redistribution line is formed on a second side of the polymer-comprising material opposite to the first side. The first redistribution line is electrically coupled to the second redistribution line through the via.

Abstract translation: 一种方法包括在载体上涂覆含聚合物的材料，并在载体上形成通孔。 通孔位于含聚合物的材料的内部，并且基本上穿透包含聚合物的材料。 在包含聚合物的材料的第一面上形成第一再分配线。 第二再分配线形成在与第一侧相对的含聚合物材料的第二侧上。 第一再分配线通过通孔电耦合到第二再分配线。

公开(公告)号：US08809117B2

公开(公告)日：2014-08-19

申请号：US13270890

申请日：2011-10-11

Applicant: Wen-Hsiung Lu ,  Ming-Da Cheng ,  Wei-Hung Lin ,  Kuei-Wei Huang ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Chung-Shi Liu

Inventor： Wen-Hsiung Lu ,  Ming-Da Cheng ,  Wei-Hung Lin ,  Kuei-Wei Huang ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Chung-Shi Liu

IPC: H01L21/00

CPC classification number: H01L21/6835 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/562 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05554 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/11444 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75754 ,  H01L2224/7698 ,  H01L2224/81001 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83102 ,  H01L2224/9205 ,  H01L2224/92125 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/3841 ,  Y10T29/41 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2224/05552 ,  H01L2924/013

Abstract: Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region.

Abstract translation: 公开了用于半导体器件的封装处理工具和封装方法。 在一个实施例中，用于半导体器件的封装处理工具包括包括框架的机械结构。 框架包括适于将多个集成电路管芯保持在其中的多个孔。 框架包括至少一个中空区域。

公开(公告)号：US20130143361A1

公开(公告)日：2013-06-06

申请号：US13309311

申请日：2011-12-01

Applicant: Wei-Hung Lin ,  Kuei-Wei Huang ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Wei-Hung Lin ,  Kuei-Wei Huang ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/60 ,  H01L23/12

CPC classification number: H01L21/6835 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/562 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05554 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/11444 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75754 ,  H01L2224/7698 ,  H01L2224/81001 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83102 ,  H01L2224/9205 ,  H01L2224/92125 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/3841 ,  Y10T29/41 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2224/05552 ,  H01L2924/013

Abstract: Packaging process tools and systems, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure for supporting package substrates or integrated circuit die during a packaging process for the integrated circuit die. The mechanical structure includes a low thermal conductivity material disposed thereon.

Abstract translation: 公开了用于半导体器件的封装加工工具和系统以及封装方法。 在一个实施例中，用于半导体器件的封装处理工具包括用于在集成电路管芯的封装工艺期间支撑封装衬底或集成电路管芯的机械结构。 机械结构包括设置在其上的低热导率材料。