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    Electronic component overlapping dice of unsingulated semiconductor wafer
    11.
    发明申请
    Electronic component overlapping dice of unsingulated semiconductor wafer 失效
    电子元件重叠的半导体晶片的重叠芯片

    公开(公告)号：US20020074653A1

    公开(公告)日：2002-06-20

    申请号：US09971981

    申请日：2001-10-04

    Applicant: FormFactor, Inc.

    Inventor： Igor Y. Khandros ,  David V. Pedersen ,  Benjamin N. Eldridge ,  Richard S. Roy ,  Gaetan Mathieu

    IPC: H01L023/52

    CPC classification number: H01L24/06 ,  H01L23/50 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00

    Abstract: The present invention provides an ancillary electrical component in very close proximity to a semiconductor device, preferably mounted directly to the semiconductor device. In one preferred embodiment, the ancillary electrical component is a capacitor. In a preferred embodiments a terminal is provided on the semiconductor device such that the capacitor can be electrically connected directly to the terminals, as by soldering or with conductive epoxy. Connecting the capacitor between terminals of a power loop provides superior noise and transient suppression. The very short path between the capacitor and the active circuit provides for extremely low inductance, allowing for the use of relatively small capacitors. The semiconductor device then is connected to an electronic device such as a PC board for further connection to other circuitry. One particularly preferred mode of connection is by incorporating resilient, free-standing contact structures on the same semiconductor device, with the structures standing farther away from the semiconductor and the capacitor. Other useful connectors include providing similar resilient, free-standing contact structures on the other device, then positioning the semiconductor over the resilient contacts and securing the two devices together. A socket with such resilient structures is particularly useful for this application. In an alternative preferred embodiment, the capacitor and resilient contacts all are incorporated in the second device, such as a socket. In one aspect of the invention, the ancillary electrical component may include a travel stop structure which defines a minimum separation between the semiconductor and a substrate such as a printed circuit board.

    Abstract translation: 本发明提供了非常接近半导体器件的辅助电气部件，优选地直接安装在半导体器件上。 在一个优选实施例中，辅助电气部件是电容器。 在优选实施例中，端子设置在半导体器件上，使得电容器可以通过焊接或与导电环氧树脂直接电连接到端子。 在电源回路端子之间连接电容器可提供卓越的噪声和瞬态抑制。 电容器和有源电路之间的非常短的路径提供极低的电感，允许使用相对较小的电容器。 然后，半导体器件连接到诸如PC板的电子设备，用于进一步连接到其它电路。 一个特别优选的连接方式是通过在相同的半导体器件上并入弹性，独立的接触结构，其结构远离半导体和电容器。 其他有用的连接器包括在另一装置上提供类似的弹性，独立的接触结构，然后将半导体定位在弹性触点上并将两个装置固定在一起。 具有这种弹性结构的插座对于该应用特别有用。 在替代的优选实施例中，电容器和弹性触点都被并入第二装置，例如插座。 在本发明的一个方面，辅助电气部件可以包括限定半导体和诸如印刷电路板的基板之间的最小间隔的行进止动结构。

    Special contact points for accessing internal circuitry of an integrated circuit
    14.
    发明申请
    Special contact points for accessing internal circuitry of an integrated circuit 失效
    用于访问集成电路内部电路的特殊接点

    公开(公告)号：US20010020747A1

    公开(公告)日：2001-09-13

    申请号：US09753309

    申请日：2000-12-29

    Applicant: FormFactor, Inc.

    Inventor： Benjamin N. Eldridge ,  Igor Y. Khandros ,  David V. Pedersen ,  Ralph G. Whitten

    IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40

    CPC classification number: G01R1/07307 ,  G01R31/2884 ,  G01R31/31723 ,  H01L22/32 ,  H01L23/50 ,  H01L23/60 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2224/29099 ,  H01L2924/00

    Abstract: One embodiment of the present invention concerns an integrated circuit that includes bond pads and special contact pads or points. The bond pads are for interfacing the integrated circuit as a whole with an external circuit, and are to be bonded to a package or circuit board. The bond pads are disposed on the die in a predetermined alignment such as a peripheral, grid, or lead-on-center alignment. The special contact pads are used to provide external test patterns to internal circuits and/or to externally monitor results from testing the internal circuits. The special contact pads may be advantageously located on the integrated circuit with a high degree of positional freedom. For one embodiment, the special contact pads may be disposed on the die at a location that is not in the same alignment as the bond pads. The special contact pads may be smaller than the bond pads so as not to increase the die size due to the special contact pads. The special contact points may also be used to externally program internal circuits (e.g., nonvolatile circuits) at the die or package level. The special contact points may also be used to select redundant circuits for faulty circuits.

    Abstract translation: 本发明的一个实施例涉及包括接合焊盘和特殊接触焊盘或点的集成电路。 接合焊盘用于将集成电路作为整体与外部电路接口，并且将被连接到封装或电路板。 接合焊盘以预定的对准方式设置在管芯上，例如外围，栅格或中心对准。 特殊接触焊盘用于向内部电路提供外部测试模式和/或外部监测测试内部电路的结果。 特别的接触垫可以有利地以高度的位置自由度位于集成电路上。 对于一个实施例，特殊接触焊盘可以在与焊盘不同于对准的位置处设置在管芯上。 特殊的接触焊盘可以小于接合焊盘，以便不会由于特殊的接触垫而增加管芯的尺寸。 特殊接触点也可以用于在芯片或封装级别外部编程内部电路（例如非易失性电路）。 特殊接触点也可用于选择故障电路的冗余电路。

    Composite motion probing
    17.
    发明申请
    Composite motion probing 失效
    复合运动探测

    公开(公告)号：US20040130312A1

    公开(公告)日：2004-07-08

    申请号：US10328113

    申请日：2002-12-20

    Applicant: FormFactor, Inc.

    Inventor： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

    IPC: G01R007/00

    CPC classification number: G01R31/2887 ,  G01R1/06705 ,  G01R31/2886

    Abstract: An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.

    Abstract translation: 电子设备相对于用于与设备电接触的探针移动到第一位置。 然后将电子设备移动到第二位置，其中电子设备被压靠在探针上，压缩探针。 进入第二位置的运动包括两个部件。 移动的一个组件倾向于将电子装置压靠在探针上，压缩探针并在探针中引起应力。 第二动作往往会减轻压力。 然后通过探头将测试数据传送到电子设备和从电子设备传送。

    Predictive, adaptive power supply for an integrated circuit under test
    19.
    发明申请
    Predictive, adaptive power supply for an integrated circuit under test 失效
    用于被测集成电路的预测，自适应电源

    公开(公告)号：US20040075459A1

    公开(公告)日：2004-04-22

    申请号：US10725824

    申请日：2003-12-01

    Applicant: FORMFACTOR, INC.

    Inventor： Benjamin N. Eldridge ,  Charles A. Miller

    IPC: G01R031/26

    CPC classification number: G06F1/26 ,  G01R31/2851 ,  G01R31/31721 ,  G01R31/31905 ,  G01R31/31924

    Abstract: A main power source supplies current through path impedance to a power terminal of an integrated circuit device under test (DUT). The DUT's demand for current at the power input terminal temporarily increases following edges of a clock signal applied to the DUT during a test as transistors within the IC switch in response to the clock signal edges. To limit variation (noise) in voltage at the power input terminal, an auxiliary power supply supplies an additional current pulse to the power input terminal to meet the increased demand during each cycle of the clock signal. The magnitude of the current pulse is a function of a predicted increase in current demand during that clock cycle, and of the magnitude of an adaption signal controlled by a feedback circuit provided to limit variation in voltage developed at the DUT's power input terminal.

    Abstract translation: 主电源将电流通过路径阻抗提供给被测集成电路器件（DUT）的电源端子。 在测试期间，DUT对电源输入端的电流需求暂时增加了在测试期间施加到DUT的时钟信号的随后边缘，作为IC开关中的晶体管响应于时钟信号的边缘。 为了限制电源输入端子的电压变化（噪声），辅助电源为电源输入端子提供额外的电流脉冲，以满足在时钟信号的每个周期期间增加的需求。 电流脉冲的大小是在该时钟周期期间电流需求的预测增加以及由反馈电路控制的适配信号的大小的函数，以限制在DUT的功率输入端产生的电压变化。

    Microelectronic contact structures, and methods of making same
    20.
    发明申请
    Microelectronic contact structures, and methods of making same 有权
    微电子接触结构及其制造方法

    公开(公告)号：US20030049951A1

    公开(公告)日：2003-03-13

    申请号：US10202768

    申请日：2002-07-25

    Applicant: FormFactor, Inc.

    Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

    IPC: H05K001/00 ,  H01R012/00

    CPC classification number: G01R1/07314 ,  H01H1/0036 ,  H01L2224/02335 ,  H01L2924/00013 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49316 ,  H01L2224/13099

    Abstract: Microelectronic contact structures are fabricated by separately forming, then joining together, various components thereof. Each contact structure has three components: a nullpostnull component, a nullbeamnull component, and a nulltipnull component. The resulting contact structure, mounted to an electronic component, is useful for making an electrical connection with another electronic component. The post component can be fabricated on a sacrificial substrate, joined to the electronic component and its sacrificial substrate removed. Alternatively, the post component can be formed on the electronic component. The beam and tip components can each be fabricated on a sacrificial substrate. The beam component is joined to the post component and its sacrificial substrate is removed, and the tip component is joined to the beam component and its sacrificial substrate is removed.

    Abstract translation: 微电子接触结构通过分别形成，然后连接在一起而制成其各种部件。 每个接触结构具有三个部件：“后”部件，“梁”部件和“尖端”部件。 安装到电子部件上的所得接触结构对于与另一个电子部件进行电连接是有用的。 后部组件可以制造在牺牲基板上，连接到电子部件并且去除其牺牲基板。 或者，可以在电子部件上形成柱部件。 梁和尖端部件可以分别制造在牺牲衬底上。 梁组件连接到柱部件，并且其牺牲基板被移除，并且尖端部件接合到梁部件并且其牺牲基板被移除。

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