公开(公告)号：US07967184B2

公开(公告)日：2011-06-28

申请号：US11280419

申请日：2005-11-16

申请人： Chih-Chin Liao ,  Ken Jian Ming Wang ,  Han-Shiao Chen ,  Chin-Tien Chiu ,  Jack Chang Chien ,  Shrikar Bhagath ,  Cheemen Yu ,  Hem Takiar

发明人： Chih-Chin Liao ,  Ken Jian Ming Wang ,  Han-Shiao Chen ,  Chin-Tien Chiu ,  Jack Chang Chien ,  Shrikar Bhagath ,  Cheemen Yu ,  Hem Takiar

IPC分类号： B23K31/02

CPC分类号： H05K1/111 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10727 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

摘要： A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component may be any type of component which may be surface mounted on a substrate according to an SMT process, including for example passive components and various packaged semiconductors.

摘要翻译： 公开了一种具有低轮廓的半导体封装。 在实施例中，表面安装部件可以直接安装到半导体封装基板的芯部，使得在部件和基板芯之间不存在导电层，镀层或焊膏。 表面安装部件可以是根据SMT工艺可以表面安装在基板上的任何类型的部件，包括例如无源部件和各种封装半导体。

公开(公告)号：US07816181B1

公开(公告)日：2010-10-19

申请号：US12494803

申请日：2009-06-30

申请人： Shrikar Bhagath ,  Hem Takiar

发明人： Shrikar Bhagath ,  Hem Takiar

IPC分类号： H01L23/29 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L21/76898 ,  H01L23/3121 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of under-filling semiconductor die in a die stack and a semiconductor device formed thereby are disclosed. Once the semiconductor die are formed, they may be stacked and interconnected. The interconnection may leave a small space between semiconductor die in the die stack. This space is advantageously completely filled using a vapor deposition process where a coating is deposited as a vapor which flows over all surfaces of the die stack, including into the spaces between the die in the stack. The vapor then deposits on the surfaces between and around the die and forms a film which completely fills the spaces between the die in the die stack. The material used in the vapor deposition under-fill process may for example be a member of the parylene family of polymers, and in embodiments, may be parylene-N.

摘要翻译： 公开了一种芯片堆叠中的半导体管芯的填充方法及由此形成的半导体器件。 一旦半导体管芯形成，它们可以被堆叠和互连。 互连可能在芯片堆叠中的半导体管芯之间留下小的空间。 该空间有利地使用气相沉积方法完全填充，其中涂层作为蒸汽沉积，该蒸汽流过管芯堆叠的所有表面，包括进入堆叠中的管芯之间的空间。 然后，蒸汽沉积在模具之间和周围的表面上并形成完全填充模具堆叠中的模具之间的空间的膜。 在气相沉积填充过程中使用的材料可以例如是聚对二甲苯聚合物族的成员，并且在实施方案中可以是聚对二甲苯-N。

公开(公告)号：US20090321951A1

公开(公告)日：2009-12-31

申请号：US12165362

申请日：2008-06-30

申请人： Hem Takiar ,  Shrikar Bhagath

发明人： Hem Takiar ,  Shrikar Bhagath

IPC分类号： H01L23/49

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2924/00015

摘要： A low profile semiconductor package is disclosed including at least first and second stacked semiconductor die mounted to a substrate. The first and/or second semiconductor die may be fabricated with a plurality of redistribution pads formed over and electrically coupled to a plurality of bond pads. After the semiconductor die are formed and diced from the wafer, the die may be mounted to the substrate using a low profile reverse wire bond according to the present invention. In particular, a wedge bond may be formed between the wire and the redistribution pad without having to use a second wire bond ball on the die bond pad as in conventional reverse ball bonding processes.

摘要翻译： 公开了一种低剖面半导体封装，其包括至少安装到衬底的第一和第二层叠半导体管芯。 第一和/或第二半导体管芯可以被制造成多个再分配焊盘，其形成在多个接合焊盘上并电耦合到多个接合焊盘。 在半导体管芯从晶片形成和切割之后，可以使用根据本发明的低剖面反向引线接合将管芯安装到衬底上。 特别地，在传统的反向接合工艺中，可以在导线和再分布垫之间形成楔形键，而不必在芯片接合焊盘上使用第二线接合球。

公开(公告)号：US07488620B2

公开(公告)日：2009-02-10

申请号：US11321350

申请日：2005-12-29

申请人： Hem Takiar ,  Shrikar Bhagath

发明人： Hem Takiar ,  Shrikar Bhagath

IPC分类号： H01L21/44

CPC分类号： H01L23/49541 ,  G06K19/07732 ,  H01L23/3107 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Methods for forming leadframe-based semiconductor packages having curvilinear shapes are disclosed. The leadframes may each include one or more curvilinear slots corresponding to curvilinear edges in the finished and singulated semiconductor package. After encapsulation, the integrated circuit packages on the panel may be singulated by cutting the integrated circuits from the leadframe panel into a plurality of individual integrated circuit packages. The slots in the leadframe advantageously allow each leadframe to be singulated using a saw blade making only straight cuts.

摘要翻译： 公开了形成具有曲线形状的引线框半导体封装的方法。 引线框可以各自包括对应于精加工和分割半导体封装中的曲线边缘的一个或多个曲线槽。 在封装之后，面板上的集成电路封装可以通过将集成电路从引线框板切割成多个单独的集成电路封装而被分割。 引线框中的槽有利地允许使用仅制成直线切割的锯片来切割每个引线框。

公开(公告)号：US20080242076A1

公开(公告)日：2008-10-02

申请号：US11693654

申请日：2007-03-29

申请人： Hem Takiar ,  Shrikar Bhagath

发明人： Hem Takiar ,  Shrikar Bhagath

IPC分类号： H01L21/44

CPC分类号： H01L24/85 ,  H01L23/49575 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/291 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/78302 ,  H01L2224/78307 ,  H01L2224/8385 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/48471 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00015 ,  H01L2224/4554 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of making a semiconductor device is disclosed including die bond pads which are heightened to allow wire bonding of offset stacked die even in tight offset configurations. After a first die is affixed to a substrate, one or more layers of an electrical conductor may be provided on some or all of the die bond pads of the first substrate to raise the height of the bond pads. The conductive layers may for example be conductive balls deposited on the die bond pads of the first substrate using a known wire bond capillary. Thereafter, a second die may be added, and wire bonding of the first die may be accomplished using a known wire bond capillary mounting a wire bond ball on a raised surface of a first semiconductor die bond pad.

摘要翻译： 公开了一种制造半导体器件的方法，其包括芯片接合焊盘，其加强以允许偏移堆叠焊盘的引线接合，即使在紧密偏移配置中。 在将第一裸片固定到基底之后，可以在第一衬底的一些或全部芯片接合焊盘上提供一层或多层电导体，以提高焊盘的高度。 导电层可以例如是使用已知的引线键合毛细管沉积在第一衬底的管芯接合焊盘上的导电球。 此后，可以添加第二管芯，并且可以使用在第一半导体管芯接合焊盘的凸起表面上安装引线接合球的公知的引线接合毛细管来实现第一管芯的引线接合。

公开(公告)号：US20080131998A1

公开(公告)日：2008-06-05

申请号：US11566097

申请日：2006-12-01

申请人： Hem Takiar ,  Shrikar Bhagath ,  Chin-Tien Chiu ,  Ong King Hoo

发明人： Hem Takiar ,  Shrikar Bhagath ,  Chin-Tien Chiu ,  Ong King Hoo

IPC分类号： H01L21/768

CPC分类号： H01L25/0657 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48992 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/85186 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A low profile semiconductor package is disclosed including at least first and second stacked semiconductor die mounted to a substrate. The first and second semiconductor die are separated by a low profile intermediate adhesive layer in which the wire bond loops from the first semiconductor die are embedded. After the intermediate layer is applied, the second semiconductor die may be stacked on top of the intermediate layer. A dielectric layer may be formed on a back surface of the second semiconductor die. As the back side of the second semiconductor die is an electrical insulator, the intermediate layer need not space the wire bond loops from the second semiconductor die as in the prior art, and the apex of bond wires may come into contact with the dielectric layer. The intermediate layer may thus be made thinner in comparison to conventional stacked semiconductor die configurations.

摘要翻译： 公开了一种低剖面半导体封装，其包括至少安装到衬底的第一和第二层叠半导体管芯。 第一半导体管芯和第二半导体管芯由嵌入第一半导体管芯的引线接合环路的低剖面中间粘合剂层分开。 在施加中间层之后，第二半导体管芯可以堆叠在中间层的顶部上。 可以在第二半导体管芯的后表面上形成电介质层。 由于第二半导体管芯的背面是电绝缘体，所以如现有技术那样，中间层不需要与第二半导体管芯的引线接合环空间，并且接合线的顶点可能与介电层接触。 因此，与传统的堆叠半导体管芯配置相比，中间层可以被制成更薄。

公开(公告)号：US20070257352A1

公开(公告)日：2007-11-08

申请号：US11777027

申请日：2007-07-12

申请人： Hem Takiar ,  Shrikar Bhagath

发明人： Hem Takiar ,  Shrikar Bhagath

IPC分类号： H01L23/488

CPC分类号： H01L24/73 ,  H01L22/34 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor package is disclosed including test pads formed of solder bumps affixed to the semiconductor package during fabrication. When the package is encapsulated, due to the pressure exerted on the package during the encapsulation process, portions of the solder bumps get flattened out to be generally flush with and exposed on a surface of the semiconductor package. These exposed portions of the solder bumps form the test pads by which the finished package may be tested.

摘要翻译： 公开了一种半导体封装，其包括在制造期间由固定到半导体封装的焊料凸块形成的测试焊盘。 当包装被封装时，由于在封装过程中施加在包装上的压力，焊料凸块的部分变平整，以与半导体封装的表面大致平齐并暴露。 焊料凸块的这些暴露部分形成测试焊盘，通过该测试焊盘可以测试成品封装。

公开(公告)号：US08575724B2

公开(公告)日：2013-11-05

申请号：US12906523

申请日：2010-10-18

申请人： Shrikar Bhagath ,  Hem Takiar

发明人： Shrikar Bhagath ,  Hem Takiar

IPC分类号： H01L23/492

CPC分类号： H01L21/563 ,  H01L21/76898 ,  H01L23/3121 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device including a semiconductor die in a die stack under-filled with a film. Once the semiconductor die are formed, they may be stacked and interconnected. The interconnection may leave a small space between semiconductor die in the die stack. This space is advantageously completely filled using a vapor deposition process where a coating is deposited as a vapor which flows over all surfaces of the die stack, including into the spaces between the die in the stack. The vapor then deposits on the surfaces between and around the die and forms a film which completely fills the spaces between the die in the die stack. The material used in the vapor deposition under-fill process may for example be a member of the parylene family of polymers, and in embodiments, may be parylene-N.

摘要翻译： 一种半导体器件，其包括在被填充有薄膜的裸片堆叠中的半导体管芯。 一旦半导体管芯形成，它们可以被堆叠和互连。 互连可能在芯片堆叠中的半导体管芯之间留下小的空间。 该空间有利地使用气相沉积工艺完全填充，其中涂层作为蒸汽沉积，该蒸汽流过管芯堆叠的所有表面，包括进入堆叠中的管芯之间的空间。 然后，蒸汽沉积在模具之间和周围的表面上并形成完全填充模具堆叠中的模具之间的空间的膜。 在气相沉积填充过程中使用的材料可以例如是聚对二甲苯聚合物族的成员，并且在实施方案中可以是聚对二甲苯-N。

公开(公告)号：US08470640B2

公开(公告)日：2013-06-25

申请号：US12165297

申请日：2008-06-30

申请人： Hem Takiar ,  Shrikar Bhagath ,  Cheemen Yu ,  Chih-Chin Liao

发明人： Hem Takiar ,  Shrikar Bhagath ,  Cheemen Yu ,  Chih-Chin Liao

IPC分类号： H01L21/00

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/32506 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49174 ,  H01L2224/83801 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/078 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/78 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of fabricating a semiconductor die and a low profile semiconductor package are disclosed. The semiconductor package may include at least first and second stacked semiconductor die mounted to a substrate. The first and/or second semiconductor die may be fabricated with localized cavities through a bottom surface of the semiconductor die, along a side edge of the semiconductor die. The one or more localized cavities in a side take up less than the entire side. Thus, the localized cavities allow low height stacking of semiconductor die while providing each die with a high degree of structural integrity to prevent cracking or breaking of the die edge during fabrication.

摘要翻译： 公开了半导体管芯和低剖面半导体封装的制造方法。 半导体封装可以包括安装到衬底的至少第一和第二堆叠半导体管芯。 第一和/或第二半导体管芯可以沿着半导体管芯的侧边缘通过半导体管芯的底表面被制造成具有局部空腔。 一个侧面中的一个或多个局部空腔占据整个侧面。 因此，局部空腔允许半导体芯片的低高度堆叠，同时为每个模具提供高度的结构完整性，以防止在制造期间模头边缘的破裂或断裂。

公开(公告)号：US20120279651A1

公开(公告)日：2012-11-08

申请号：US13257285

申请日：2011-05-05

申请人： Wei Gu ,  Zhong Lu ,  Shrikar Bhagath ,  Chin-Tien Chiu ,  Hem Takiar ,  XiangYang Liu

发明人： Wei Gu ,  Zhong Lu ,  Shrikar Bhagath ,  Chin-Tien Chiu ,  Hem Takiar ,  XiangYang Liu

IPC分类号： H01L21/64 ,  B05C11/00 ,  B32B3/10 ,  B05D5/10 ,  C09J7/02 ,  B05C21/00 ,  B05B1/00

CPC分类号： H01L24/83 ,  B05B12/20 ,  B05B13/02 ,  B05B14/00 ,  H01L21/56 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/2732 ,  H01L2224/27418 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29034 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/83856 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1438 ,  H01L2924/181 ,  Y10T156/1092 ,  Y10T428/24802 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A system and method are disclosed for applying a die attach epoxy to substrates on a panel of substrates. The system includes a window clamp having one or more windows through which the epoxy may be applied onto the substrate panel. The size and shape of the one or more windows correspond to the size and shape of the area on the substrate to receive the die attach epoxy. Once the die attach epoxy is sprayed onto the substrate through the windows of the window clamp, the die may be affixed to the substrate and the epoxy cured in one or more curing steps. The system may further include a clean-up follower for cleaning epoxy off of the window clamp, and a window cleaning mechanism for cleaning epoxy off of the sidewalls of the windows of the window clamp.

摘要翻译： 公开了一种用于将芯片附着环氧树脂施加到基板面板上的基板的系统和方法。 该系统包括具有一个或多个窗口的窗口夹具，环氧树脂可以通过该窗口施加到基板面板上。 一个或多个窗口的尺寸和形状对应于基板上的区域的尺寸和形状以接收管芯附着环氧树脂。 一旦模具附着环氧树脂通过窗口夹具的窗口喷涂到基材上，模具可以固定在基材上，环氧树脂在一个或多个固化步骤中固化。 该系统还可以包括用于清洁窗夹的环氧树脂的清理跟随器，以及用于从窗夹的窗口侧壁清洁环氧树脂的窗清洁机构。