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    Managing data center resources to achieve a quality of service
    11.
    发明授权
    Managing data center resources to achieve a quality of service 有权

    公开(公告)号：US10554505B2

    公开(公告)日：2020-02-04

    申请号：US13630545

    申请日：2012-09-28

    Applicant: Intel Corporation

    Inventor： Mrittika Ganguli ,  Muthuvel M. I ,  Ananth S. Narayan ,  Jaideep Moses ,  Andrew J. Herdrich ,  Rahul Khanna

    IPC: H04L12/24

    Abstract: In accordance with some embodiments, a cloud service provider may operate a data center in a way that dynamically reallocates resources across nodes within the data center based on both utilization and service level agreements. In other words, the allocation of resources may be adjusted dynamically based on current conditions. The current conditions in the data center may be a function of the nature of all the current workloads. Instead of simply managing the workloads in a way to increase overall execution efficiency, the data center instead may manage the workload to achieve quality of service requirements for particular workloads according to service level agreements.

    Adaptive thermoelectric cooling in a processor
    16.
    发明授权
    Adaptive thermoelectric cooling in a processor 有权
    处理器中的自适应热电冷却

    公开(公告)号：US09297559B2

    公开(公告)日：2016-03-29

    申请号：US14036655

    申请日：2013-09-25

    Applicant: Intel Corporation

    Inventor： Thanunathan Rangarajan ,  Rahul Khanna ,  Richard Marian Thomaiyar ,  Minh T Le

    IPC: F25B21/02 ,  G06F1/20 ,  G06F1/32

    CPC classification number: F25B21/02 ,  G06F1/206 ,  G06F1/324 ,  G06F1/3287 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/171 ,  Y02D10/172

    Abstract: In an embodiment, a processor includes a thermoelectric cooling (TEC) controller to obtain a platform cooling level associated with the processor; obtain a temperature associated with the processor; calculate a TEC power level based at least in part on the platform cooling level and the temperature; and provide the TEC power level to a TEC device associated with the processor, wherein the TEC device is to transfer heat from the processor to a heat sink. Other embodiments are described and claimed.

    Abstract translation: 在一个实施例中，处理器包括热电冷却（TEC）控制器，以获得与处理器相关联的平台冷却水平; 获得与处理器相关联的温度; 至少部分基于平台冷却水平和温度计算TEC功率水平; 并且向与处理器相关联的TEC设备提供TEC功率级，其中TEC设备将热量从处理器传送到散热器。 描述和要求保护其他实施例。

    INSTRUCTION BLOCK BASED PERFORMANCE MONITORING
    18.
    发明申请
    INSTRUCTION BLOCK BASED PERFORMANCE MONITORING 有权

    公开(公告)号：US20250110739A1

    公开(公告)日：2025-04-03

    申请号：US18479027

    申请日：2023-09-30

    Applicant: Intel Corporation

    Inventor： Kshitij Arun Doshi ,  Rahul Khanna

    IPC: G06F9/30

    Abstract: Techniques for block based performance monitoring are described. In an embodiment, an apparatus includes execution hardware to execute a plurality of instructions; and block-based sampling hardware. The block-based sampling hardware is to identify, based on a first branch instruction of the plurality of instructions and a second branch instruction of the plurality of instructions, a block of instructions; and to collect, during execution of the block of instructions, performance information.

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