公开(公告)号：US20150035129A1

公开(公告)日：2015-02-05

申请号：US13955206

申请日：2013-07-31

Applicant: Xiaotian Zhang ,  Hua Pan ,  Ming-Chen Lu ,  Jun Lu ,  Hamza Yilmaz

Inventor： Xiaotian Zhang ,  Hua Pan ,  Ming-Chen Lu ,  Jun Lu ,  Hamza Yilmaz

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L21/304 ,  H01L21/56 ,  H01L21/78 ,  H01L22/14 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49534 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/27 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/07 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/118 ,  H01L2224/13022 ,  H01L2224/32245 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40145 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84801 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A stacked multi-chip packaging structure comprises a lead frame, a first semiconductor chip mounted on the lead frame, a second semiconductor chip flipped-chip mounted on the lead frame, a metal clip mounted on top of the first and second semiconductor chips and a third semiconductor chip stacked on the meal clip; bonding wires electrically connecting electrodes on the third semiconductor chip to the first and second semiconductor chips and the pins of the lead frame; plastic molding encapsulating the lead frame, the chips and the metal clip.

Abstract translation: 堆叠多芯片封装结构包括引线框架，安装在引线框架上的第一半导体芯片，安装在引线框架上的第二半导体芯片翻转芯片，安装在第一和第二半导体芯片顶部的金属夹子和 第三个半导体芯片堆叠在餐夹上; 将第三半导体芯片上的电极电连接到第一和第二半导体芯片和引线框架的引脚的接合线; 塑料成型封装引线框架，芯片和金属夹。

公开(公告)号：US20140361420A1

公开(公告)日：2014-12-11

申请号：US13913770

申请日：2013-06-10

Applicant: Hamza Yilmaz ,  Yan Xun Xue ,  Jun Lu ,  Peter Wilson ,  Yan Huo ,  Zhiqiang Niu ,  Ming-Chen Lu

Inventor： Hamza Yilmaz ,  Yan Xun Xue ,  Jun Lu ,  Peter Wilson ,  Yan Huo ,  Zhiqiang Niu ,  Ming-Chen Lu

IPC: H01L23/495

CPC classification number: H01L23/49568 ,  H01L21/4825 ,  H01L21/561 ,  H01L21/565 ,  H01L21/768 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/544 ,  H01L24/40 ,  H01L24/41 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/50 ,  H01L2223/5446 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/06181 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73104 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84801 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/27 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A hybrid packaging multi-chip semiconductor device comprises a lead frame unit, a first semiconductor chip, a second semiconductor chip, a first interconnecting structure and a second interconnecting structure, wherein the first semiconductor chip is attached on a first die paddle and the second semiconductor chip is flipped and attached on a third pin and a second die paddle, the first interconnecting structure electrically connecting a first electrode at a front surface of the first semiconductor chip and a third electrode at a back surface of the second semiconductor chip and a second electrode at the front surface of the first semiconductor chip is electrically connected by second interconnecting structure.

Abstract translation: 一种混合封装多芯片半导体器件，包括引线框单元，第一半导体芯片，第二半导体芯片，第一互连结构和第二互连结构，其中第一半导体芯片附接在第一裸片上，第二半导体 芯片被翻转并附接在第三引脚和第二管芯焊盘上，第一互连结构电连接第一半导体芯片的前表面处的第一电极和第二半导体芯片的后表面处的第三电极和第二电极 在第一半导体芯片的前表面通过第二互连结构电连接。

公开(公告)号：US08877900B2

公开(公告)日：2014-11-04

申请号：US13503729

申请日：2010-10-29

Applicant: Peter Peizhi Luo ,  Kevin Caili Wangr ,  Pingyu Zhong ,  Mark Hsieh ,  Yan Li ,  Xinwei Wang ,  Feng Dong ,  Andrei Golosov ,  Yan Ni ,  Weirong Wang ,  Laurence B. Peterson ,  Rose Cubbon ,  Sujata Sharma ,  Jon Condra ,  Jun Lu ,  Gopalakrishnan Parthasarathy ,  Stephen Soisson ,  Noel Byrne

Inventor： Peter Peizhi Luo ,  Kevin Caili Wangr ,  Pingyu Zhong ,  Mark Hsieh ,  Yan Li ,  Xinwei Wang ,  Feng Dong ,  Andrei Golosov ,  Yan Ni ,  Weirong Wang ,  Laurence B. Peterson ,  Rose Cubbon ,  Sujata Sharma ,  Jon Condra ,  Jun Lu ,  Gopalakrishnan Parthasarathy ,  Stephen Soisson ,  Noel Byrne

IPC: C07K16/40 ,  C07K16/00 ,  A61K39/395

CPC classification number: C07K16/40 ,  C07K2299/00 ,  C07K2317/21 ,  C07K2317/52 ,  C07K2317/55 ,  C07K2317/76 ,  C07K2317/94 ,  C07K2319/00

Abstract: Antagonists of human proprotein convertase subtilisin-kexin type 9 (“PCSK9”) are disclosed. The disclosed antagonists are effective in the inhibition of PCSK9 function and, accordingly, present desirable antagonists for use in the treatment of conditions associated with PCSK9 activity. The present invention also discloses nucleic acid encoding said antagonists, vectors, host cells, and compositions comprising the antagonists. Methods of making PCSK9-specific antagonists as well as methods of using the antagonists for inhibiting or antagonizing PCSK9 function are also disclosed and form important additional aspects of the present disclosure.

Abstract translation: 公开了人前体蛋白转化酶枯草杆菌蛋白酶-Kexin 9型（“PCSK9”）的拮抗剂。 所公开的拮抗剂在抑制PCSK9功能方面是有效的，因此，呈现用于治疗与PCSK9活性相关的病症的所需拮抗剂。 本发明还公开了编码所述拮抗剂，载体，宿主细胞和包含拮抗剂的组合物的核酸。 还公开了制备PCSK9特异性拮抗剂的方法以及使用拮抗剂抑制或拮抗PCSK9功能的方法，并形成了本公开的重要的附加方面。

公开(公告)号：US08783145B2

公开(公告)日：2014-07-22

申请号：US13518023

申请日：2010-12-23

Applicant: Aimin Deng ,  Hui Ding ,  Jun Lu ,  Jianrong Xie

Inventor： Aimin Deng ,  Hui Ding ,  Jun Lu ,  Jianrong Xie

IPC: C25C7/08 ,  C25B9/00 ,  C25D1/00

CPC classification number: C25C7/08 ,  Y10T83/2185 ,  Y10T83/2187 ,  Y10T83/219

Abstract: An apparatus for stripping metal sheets from a cathode blank includes: a frame; a stripping assembly disposed on the frame; and a receiving mechanism including at least one receiving platform which is disposed on the frame for receiving the deposited metal sheets. The stripping assembly includes: first and second clipping mechanisms for clipping a conductive member on an upper end of the cathode blank; first and second stripping mechanisms for stripping the deposited metal sheets from two surfaces of the cathode blank; a bottom positioning mechanism for positioning a lower end of the cathode blank; and first and second loosening mechanisms each including a push rod which is movably disposed on the frame in the transversal direction for pushing the cathode blank.

Abstract translation: 用于从阴极毛坯剥离金属片的设备包括：框架; 设置在框架上的剥离组件; 以及接收机构，其包括设置在所述框架上的用于接收所沉积的金属片的至少一个接收平台。 剥离组件包括：第一和第二夹持机构，用于夹住阴极毛坯的上端上的导电构件; 用于从阴极坯料的两个表面剥离沉积的金属片的第一和第二剥离机构; 用于定位阴极毛坯的下端的底部定位机构; 以及第一和第二松动机构，每个松动机构包括推杆，所述推杆在横向方向上可移动地设置在框架上以推动阴极坯料。

公开(公告)号：US08778874B2

公开(公告)日：2014-07-15

申请号：US11791446

申请日：2005-11-24

Applicant: Hirokazu Arimoto ,  Jun Lu ,  Yoshinori Yamano ,  Tatsuro Yasukata ,  Osamu Yoshida ,  Tsutomu Iwaki ,  Yutaka Yoshida ,  Issei Kato ,  Kenji Morimoto ,  Kayo Yasoshima

Inventor： Hirokazu Arimoto ,  Jun Lu ,  Yoshinori Yamano ,  Tatsuro Yasukata ,  Osamu Yoshida ,  Tsutomu Iwaki ,  Yutaka Yoshida ,  Issei Kato ,  Kenji Morimoto ,  Kayo Yasoshima

IPC: A61K38/00 ,  A61P31/04 ,  A61K38/14 ,  C07K9/00 ,  A61K38/04

CPC classification number: C07K9/008 ,  A61K38/00 ,  A61K38/04

Abstract: Novel glycopeptide antibiotic derivatives. These derivatives are represented by the formula (aglycon part of glycopeptide antibiotic derivative)-(Sac-NH)—RA [wherein (aglycon part of glycopeptide antibiotic derivative) is the part formed by removing the sugar part from a known glycopeptide antibiotic derivative; (Sac-NH) part is an amino sugar part or a sugar chain part containing an amino sugar; and RA represents, e.g., the formula —X1—Ar1—X2—Y—X3—Ar2 (wherein X1, X2, and X3 each represents 1) a single bond or 2) a heteroatom or heteroatom-containing group selected from the group consisting of —N═, ═N—, —NR1—, —O—, etc.; Y represents —NR2CO— or —CONR2— (wherein R2 represents hydrogen or lower alkyl), etc.)]. These derivatives have antibacterial activity against vancomycin-resistant bacteria.

Abstract translation: 新型糖肽抗生素衍生物。 这些衍生物由式（糖肽抗生素衍生物的糖苷配基） - （Sac-NH）-RA [其中（糖肽抗生素衍生物的糖苷配基部分）是通过从已知的糖肽抗生素衍生物中除去糖部分而形成的部分） （Sac-NH）部分是含有氨基糖的氨基糖部分或糖链部分; RA表示例如式-X1-Ar1-X2-Y-X3-Ar2（其中X1，X2和X3各自表示1）单键或2）选自以下的杂原子或含杂原子的基团： 的-N =，-N =，-NR1-，-O-等; Y表示-NR2CO-或-CONR2-（其中R2表示氢或低级烷基）等）。 这些衍生物对万古霉素抗性细菌具有抗菌活性。

公开(公告)号：US20140192952A1

公开(公告)日：2014-07-10

申请号：US14131896

申请日：2012-07-27

Applicant: Paul J. Keall ,  Ricky O'Brien ,  Benjamin J. Cooper ,  Jun Lu ,  Jeffrey F. Williamson

Inventor： Paul J. Keall ,  Ricky O'Brien ,  Benjamin J. Cooper ,  Jun Lu ,  Jeffrey F. Williamson

IPC: A61B6/00

CPC classification number: A61B6/541 ,  A61B6/4085 ,  A61B6/486 ,  A61B6/5205 ,  A61B6/5264 ,  A61B6/583 ,  A61N2005/1061

Abstract: A method of optimizing 4D cone beam computed tomography (4DCBCT) imaging is provided that includes using a scanner to generate projections of a target, where the projections are used to form a cone beam computed tomography (CBCT) scan of the target, where the CBCT includes a 3D image of the target, and using an appropriately programmed computer to control rotation speed of a gantry and projection acquisition of the CBCT in real-time according to a measured patient respiratory signal, where the real-time acquisition of the CBCT forms an optimized 4DCBCT image set.

Abstract translation: 提供了一种优化4D锥形束计算机断层摄影（4DCBCT）成像的方法，其包括使用扫描仪产生靶的投影，其中投影用于形成目标的锥束计算机断层摄影（CBCT）扫描，其中CBCT 包括目标的3D图像，并且使用适当编程的计算机根据所测量的患者呼吸信号实时地控制台架的转速和CBCT的投影采集，其中CBCT的实时采集形成 优化的4DCBCT图像集。

公开(公告)号：US20140135497A1

公开(公告)日：2014-05-15

申请号：US14072146

申请日：2013-11-05

Applicant: Li Liu ,  Deniz Akalay ,  Weitong Dong ,  Jianqing Feng ,  Christian Wolfgang Hemp ,  Jun Lu ,  Le Xie ,  Jinsong Yang

Inventor： Li Liu ,  Deniz Akalay ,  Weitong Dong ,  Jianqing Feng ,  Christian Wolfgang Hemp ,  Jun Lu ,  Le Xie ,  Jinsong Yang

IPC: C07D239/30 ,  C07D239/54

CPC classification number: C07D239/30 ,  C07D239/54

Abstract: This invention relates to a novel method for the synthesis of 2,4-dichloro-5-trifluoromethyl-pyrimidine useful as intermediate in the manufacture of pharmaceutically active ingredients.

Abstract translation: 本发明涉及一种合成2,4-二氯-5-三氟甲基 - 嘧啶的新方法，其用作制备药物活性成分的中间体。

公开(公告)号：US08703545B2

公开(公告)日：2014-04-22

申请号：US13408185

申请日：2012-02-29

Applicant: Zhiqiang Niu ,  Ming-Chen Lu ,  Yan Xun Xue ,  Yan Huo ,  Hua Pan ,  Guo Feng Lian ,  Jun Lu

Inventor： Zhiqiang Niu ,  Ming-Chen Lu ,  Yan Xun Xue ,  Yan Huo ,  Hua Pan ,  Guo Feng Lian ,  Jun Lu

IPC: H01L21/56 ,  H01L23/495

CPC classification number: H01L23/3107 ,  H01L21/565 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor package is provided with an Aluminum alloy lead-frame without noble metal plated on the Aluminum base lead-frame. Aluminum alloy material with proper alloy composition and ratio for making an aluminum alloy lead-frame is provided. The aluminum alloy lead-frame is electroplated with a first metal electroplating layer, a second electroplating layer and a third electroplating layer in a sequence. The lead-frame electroplated with the first, second and third metal electroplating layers is then used in the fabrication process of a power semiconductor package including chip connecting, wire bonding, and plastic molding. After the molding process, the area of the lead-frame not covered by the molding compound is electroplated with a fourth metal electroplating layer that is not easy to be oxidized when exposing to air.

Abstract translation: 半导体封装设置有没有贵金属的铝合金引线框架，镀在铝基底引线框架上。 提供具有适当的合金组成和制造铝合金引线框架的比例的铝合金材料。 铝合金引线框架依次电镀有第一金属电镀层，第二电镀层和第三电镀层。 然后，利用第一，第二和第三金属电镀层电镀的引线框架用于包括芯片连接，引线接合和塑性模制的功率半导体封装的制造过程中。 在模制过程之后，未被模塑料覆盖的引线框架的区域用暴露于空气中不容易氧化的第四金属电镀层电镀。

公开(公告)号：US08686546B2

公开(公告)日：2014-04-01

申请号：US13077720

申请日：2011-03-31

Applicant: Yueh-Se Ho ,  Hamza Yilmaz ,  Yan Xun Xue ,  Jun Lu

Inventor： Yueh-Se Ho ,  Hamza Yilmaz ,  Yan Xun Xue ,  Jun Lu

IPC: H01L23/495 ,  H01L23/02

CPC classification number: H01L23/49524 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/84 ,  H01L25/074 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/4118 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/8385 ,  H01L2224/8485 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2224/84 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012

Abstract: A combined packaged power semiconductor device includes a flipped top source low-side MOSFET electrically connected to a top surface of a die paddle, a first metal interconnection plate connecting between a bottom drain of a high-side MOSFET or a top source of a flipped high-side MOSFET to a bottom drain of the low-side MOSFET, and a second metal interconnection plate stacked on top of the high-side MOSFET chip. The high-side, low-side MOSFET and the IC controller can be packaged three-dimensionally that reduces the overall size of semiconductor devices and can maximize the chip's size within a package of the same size and improves the performance of the semiconductor devices. The top source of flipped low-side MOSFET is connected to the top surface of the die paddle and thus is grounded through the exposed bottom surface of die paddle, which simplifies the shape of exposed bottom surface of the die paddle and maximizes the area to facilitate heat dissipation.

Abstract translation: 组合封装的功率半导体器件包括电连接到管芯焊盘的顶表面的翻转顶部源极低侧MOSFET，连接在高侧MOSFET的底部漏极或翻转高电平的顶部源的第一金属互连板 的低端MOSFET的底部漏极和堆叠在高侧MOSFET芯片的顶部上的第二金属互连板。 高侧，低端MOSFET和IC控制器可以三维封装，从而减小半导体器件的总体尺寸，并可在相同尺寸的封装内最大限度地提高芯片的尺寸，并提高半导体器件的性能。 翻转的低侧MOSFET的顶部源极连接到管芯焊盘的顶表面，并且因此通过裸片的裸露的底表面接地，这简化了裸片焊盘的暴露的底面的形状，并使面积最大化 散热。

公开(公告)号：US08642385B2

公开(公告)日：2014-02-04

申请号：US13205864

申请日：2011-08-09

Applicant: Yan Xun Xue ,  Ping Huang ,  Yueh-Se Ho ,  Hamza Yilmaz ,  Jun Lu ,  Ming-Chen Lu

Inventor： Yan Xun Xue ,  Ping Huang ,  Yueh-Se Ho ,  Hamza Yilmaz ,  Jun Lu ,  Ming-Chen Lu

IPC: H01L23/498 ,  H01L21/78

CPC classification number: H01L21/76898 ,  H01L21/561 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/1184 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

Abstract: The present invention proposes a package for semiconductor device and the fabrication method for integrally encapsulating a whole semiconductor chip within a molding compound. In the semicondcutor device package, bonding pads distributed on the top of the chip are redistributed into an array of redistributed bonding pads located in an dielectric layer by utilizing the redistribution technique. The electrodes or signal terminals on the top of the semiconductor chip are connected to an electrode metal segment on the bottom of the chip by conductive materials filled in through holes formed in a silicon substrate of a semiconductor wafer. Furthermore, the top molding portion and the bottom molding portion seal the semiconductor chip completely, thus providing optimum mechanical and electrical protections.

Abstract translation: 本发明提出了一种用于半导体器件的封装以及用于将整个半导体芯片整体封装在模塑料中的制造方法。 在半封装器件封装中，通过利用再分配技术，分布在芯片顶部的焊盘重新分布到位于介质层中的再分布焊盘的阵列中。 半导体芯片的顶部上的电极或信号端子通过填充在半导体晶片的硅衬底中形成的通孔中的导电材料连接到芯片底部的电极金属段。 此外，顶部模制部分和底部模制部分完全密封半导体芯片，从而提供最佳的机械和电气保护。