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    Ultra Low Loss Dielectric Thermosetting Resin Composition And High Performance Laminates Manufactured Therefrom
    12.
    发明申请
    Ultra Low Loss Dielectric Thermosetting Resin Composition And High Performance Laminates Manufactured Therefrom 审中-公开
    超低损耗介电热固性树脂组合物和高性能层压板

    公开(公告)号：US20160360614A1

    公开(公告)日：2016-12-08

    申请号：US15240958

    申请日：2016-08-18

    Applicant: NOVOSET, LLC

    Inventor： Sajal Das ,  Patrick Shipman

    IPC: H05K1/03 ,  C08J5/24 ,  B32B15/20 ,  B32B15/06 ,  B32B25/02 ,  C08F279/02 ,  C08F283/12

    CPC classification number: H05K1/0326 ,  B32B15/06 ,  B32B15/20 ,  B32B25/02 ,  B32B2307/204 ,  B32B2457/08 ,  C08F279/02 ,  C08F283/12 ,  C08J5/24 ,  C08J2351/00 ,  C08J2351/08 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0162

    Abstract: An ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W-(Z)f/(H)1-f-W]n−1-[W-(Z)f/(H)1-f-(OCN)f/(R)1-f]n+2, wherein T is a 1, 3, 5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A); H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.

    Abstract translation: 超低损耗介电热固性树脂组合物具有至少一种能够与所述组分（A）共聚的氰酸酯组分（A）和至少一种反应性中间组分（B）。 本发明是以下形式的氰酸酯树脂：Tn- [W-（Z）f /（H）1-fW] n-1- [W-（Z）f /（H）1-f-（OCN） f /（R）1-f] n + 2，其中T是1,3,5-取代三嗪部分（C 3 N 3）; W是三嗪与组分A或组分B之间的连接原子; Z是组分（A）; H是组分（B）; OCN是氰酸酯端基; R是组分B的反应性端基; n是大于或等于1的整数; 并且f是组分A的重量或摩尔分数。组合物显示出优异的介电性能并产生用于高层计数，多层印刷电路板（PCB），预浸料，树脂涂层铜（RCC），膜粘合剂 ，高频雷达，射频（RF）层压板和各种复合材料。

    Printed Circuits With Laser Ablated Conformal Coating Openings
    15.
    发明申请
    Printed Circuits With Laser Ablated Conformal Coating Openings 审中-公开
    具有激光烧蚀保形涂层开口的印刷电路

    公开(公告)号：US20160262261A1

    公开(公告)日：2016-09-08

    申请号：US15056291

    申请日：2016-02-29

    Applicant: Apple Inc.

    Inventor： Ferdinand S. Toting ,  Arpit K. Akkinepalli ,  Goran S. Diminich ,  Xiaoyi Zhou

    IPC: H05K1/02 ,  H05K3/00 ,  H05K3/30 ,  H05K3/28 ,  H05K1/18 ,  H05K1/11

    CPC classification number: H05K3/288 ,  H05K3/0026 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2203/107

    Abstract: Electrical components may be mounted on a printed circuit or other substrate. The electrical components may be covered with a conformal coating containing a wavelength-tuned-light-absorption-enhancement additive. The additive may be a dye or other additive that creates a light absorption peak at a given wavelength. To form openings in the conformal coating in alignment with the electrical components without damaging the components, a laser ablation tool may apply laser light at the given wavelength to the conformal coating. Openings may also be formed by placing tape over the components before the con form at coating is applied. The tape may have a color with a light absorption peak at the given wavelength to facilitate the formation of openings without damaging sensitive components.

    Abstract translation: 电气部件可以安装在印刷电路或其它基板上。 电气部件可以用包含波长调谐光吸收增强添加剂的保形涂层覆盖。 添加剂可以是在给定波长处产生光吸收峰的染料或其它添加剂。 为了在保形涂层中形成与电气部件对准的开口而不损坏部件，激光烧蚀工具可以将给定波长的激光施加到保形涂层。 开口也可以通过在施加涂层之前将带放置在构件上而形成。 带可以具有在给定波长处具有光吸收峰的颜色，以便于形成开口而不损坏敏感组件。

    High-Density Soft-Matter Electronics
    16.
    发明申请
    High-Density Soft-Matter Electronics 审中-公开
    高密度软质电子学

    公开(公告)号：US20160234931A1

    公开(公告)日：2016-08-11

    申请号：US15019786

    申请日：2016-02-09

    Applicant: CARNEGIE MELLON UNIVERSITY, a Pennsylvania Non-Profit Corporation

    Inventor： Carmel Majidi ,  Burak Ozdoganlar ,  Arya Tabatabai ,  Bulent Arda Gozen

    IPC: H05K1/02 ,  H05K3/10 ,  H05K1/18 ,  B22D25/02 ,  B22D23/00

    CPC classification number: H05K3/107 ,  H05K1/0283 ,  H05K1/162 ,  H05K3/281 ,  H05K2201/0162 ,  H05K2201/10015 ,  H05K2203/0108 ,  H05K2203/0156

    Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.

    Abstract translation: 本公开描述了具有微米尺度特征的软质电子器件以及制造电子器件的方法。 在一些实施例中，该装置包括具有微通道的弹性体模具，其填充有共晶合金以产生导电元件。 微通道用聚合物密封以防止合金逸出微通道。 在一些实施例中，使用微转印技术将合金拉入微通道。 另外，可以使用软光刻或其他制造技术来制造模具。 本文描述的方法允许创建微米级电路特征，其线宽和间距比先前证明的小一个数量级。

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