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公开(公告)号：US20190207334A1
公开(公告)日：2019-07-04
申请号：US16125895
申请日：2018-09-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seung-wan KOH , Seok-heon LEE , Seok-jae Han
CPC classification number: H01R12/714 , H01R12/7005 , H01R13/2442 , H05K1/11 , H05K2201/094 , H05K2201/09409 , H05K2201/09445 , H05K2201/09827 , H05K2201/09863 , H05K2201/10159
Abstract: A memory card includes a substrate, first row terminals and second row terminals. The substrate has a first pair of side edges extending in a first direction and a second pair of side edges extending in a second direction perpendicular to the first direction. The first row terminals are arranged adjacent to an insertion side edge of the substrate, the first row terminals including a first power terminal, the insertion side edge being one of the first pair of side edges. The second row terminals are arranged further from the insertion side edge than the first row terminals, the second row terminals including a second power terminal. At least one terminal among the first and second row terminals includes a recess area in an exposed surface of the at least one terminal.
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公开(公告)号：US20190124769A1
公开(公告)日：2019-04-25
申请号：US16053275
申请日：2018-08-02
Applicant: JOLED INC.
Inventor： Hirofumi MIYASHITA
CPC classification number: H05K1/117 , G09F9/00 , H05K1/147 , H05K1/189 , H05K3/0097 , H05K3/365 , H05K3/368 , H05K2201/09027 , H05K2201/09145 , H05K2201/09409 , H05K2201/10128 , H05K2201/10136 , H05K2201/10962 , H05K2203/04
Abstract: A printed board has an elongated shape and is to be electrically coupled to a display panel via a flexible board. The printed board includes a first board section; and a second board section shorter in length than the first board section in a substantially perpendicular direction to a longitudinal direction of the printed board. The first board section and the second board section are disposed in a row in the longitudinal direction, each of the first board section and the second board section has a first end in the substantially perpendicular direction to the longitudinal direction, the first end of the first board section projects further than the first end of the second board section in the substantially perpendicular direction, and a connection portion to be connected to the flexible board is disposed at the first end of each of the first board section and the second board section.
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公开(公告)号：US20180295719A1
公开(公告)日：2018-10-11
申请号：US15570879
申请日：2015-06-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Charles Nathan Logan , Adrian Rothenbuhler , Christine m. Wells
CPC classification number: H05K1/0275 , H05K1/0298 , H05K1/09 , H05K1/111 , H05K1/112 , H05K3/4007 , H05K3/4038 , H05K2201/09227 , H05K2201/094 , H05K2201/09409 , H05K2201/09781
Abstract: In one implementation, a printed circuit board (PCB) includes a plurality of pads that form a pad pattern on the PCB. In that implementation, the plurality of pads include a group of load pads, a dummy pad, and a false pad. The group of load pads act as contact points to establish an electrical path between a first circuitry and a second circuitry. The dummy pad is coupled to a via that floats electrically and the false pad is coupled to a third circuitry.
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公开(公告)号：US20180130505A1
公开(公告)日：2018-05-10
申请号：US15808390
申请日：2017-11-09
Applicant: INTEL CORPORATION
Inventor： Bruce QUERBACH , Pete D. VOGT
CPC classification number: G11C5/06 , G06F1/18 , G11C5/04 , G11C5/063 , G11C5/066 , H01R12/716 , H05K1/0295 , H05K1/141 , H05K1/181 , H05K2201/09409 , H05K2201/10159
Abstract: Electronic devices and methods including a printed circuit board configured to accept CPUs and memory modules are described. One apparatus includes a printed circuit board that includes a first row of elements including a first CPU positioned between first and second groups of dual in-line memory modules (DIMMs). The printed circuit board also includes a second row of elements including a second CPU positioned between third and fourth groups of DIMMs. The apparatus also includes a third row of elements including a fifth group of DIMMs, wherein the second row of elements is positioned between the first row of elements and the third row of elements. Other embodiments are described and claimed.
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公开(公告)号：US09936591B2
公开(公告)日：2018-04-03
申请号：US15290894
申请日：2016-10-11
Applicant: Samsung Display Co., Ltd.
Inventor： Byoungyong Kim , Inseok Yeo , Seung-hwa Ha
CPC classification number: H05K5/0017 , H05K1/113 , H05K1/116 , H05K1/181 , H05K3/3436 , H05K2201/094 , H05K2201/09409 , H05K2201/09709 , H05K2201/10128
Abstract: A display device includes a printed circuit board (PCB), two sides of the PCB extending in first and second directions, respectively, the first and second directions crossing each other, pad group areas being defined in the PCB and arranged along the first direction; and a display panel electrically connected to the PCB through the pad group areas, the PCB including: first pads in each of the pad group areas and arranged along a third direction crossing the first and second directions; and second pads in each of the pad group areas, arranged along the third direction, and spaced apart from the first pads, wherein a portion of the first pads is in the first pad area, an other portion of the first pads and a portion of the second pads are in the second pad area, and an other portion of the second pad is in the third pad area.
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Patent Agency Ranking
公开(公告)号：US09923309B1
公开(公告)日：2018-03-20
申请号：US15417383
申请日：2017-01-27
Applicant: TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
Inventor： Masayuki Aizawa , Chad William Morgan , Hiroshi Shirai
IPC: H01R13/648 , H01R13/6587 , H01R12/70 , H05K1/11 , H05K1/02
CPC classification number: H01R13/6587 , H01R13/6471 , H05K1/113 , H05K1/184 , H05K2201/09409 , H05K2201/09609 , H05K2201/10189 , H05K2201/10303
Abstract: A PCB includes a substrate having a connector surface with a PCB connector footprint defined along a longitudinal axis and a lateral axis and subdivided into PCB column grouping footprints extending generally parallel to the longitudinal axis. The PCB includes signal vias arranged in pairs along a signal pair axis with a plurality of pairs of signal vias in each PCB column grouping footprint. The signal pair axis is non-parallel to the longitudinal axis, non-parallel to the lateral axis and intersects the longitudinal axis at a lesser angle than the signal pair axis intersects the lateral axis. The PCB includes ground vias at least partially through the substrate. The ground vias are arranged around each of the pairs of signal vias to provide electrical shielding around each of the pairs of signal vias.
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17.发明申请公开(公告)号：US20180035535A1
公开(公告)日：2018-02-01
申请号：US15661085
申请日：2017-07-27
Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Inventor： Walter S. Wall , James H. Schaffner , Hyok Jae Song , David S. Hammon , Timothy J. Talty , Duane S. Carper , Eray Yasan
CPC classification number: H05K1/0243 , H01Q1/3275 , H01Q1/42 , H01Q1/425 , H01Q15/0006 , H03H7/0138 , H05K1/0236 , H05K1/189 , H05K3/0058 , H05K3/06 , H05K3/284 , H05K3/30 , H05K2201/09409 , H05K2201/0999
Abstract: The present application electromagnetic signal filtering. More specifically, the application teaches a system and method for affixing a frequency selective surface to an existing antenna radome, such that unwanted signals are attenuated before reaching an antenna stucture within the antenna radome.
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公开(公告)号：US20170207589A1
公开(公告)日：2017-07-20
申请号：US15408752
申请日：2017-01-18
Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
Inventor： JERRY WU , JUN CHEN , FAN-BO MENG
CPC classification number: H01R24/60 , H01R12/53 , H01R13/6471 , H01R13/6591 , H05K1/111 , H05K2201/09409 , H05K2201/10189 , Y02P70/611
Abstract: A cable includes: plural wires including plural pairs of differential signal wires, a detection signal wire, at least one auxiliary signal wire, a plurality of low speed signal wires, and two power wires arranged adjacent to the low speed signal wires; and a jacket enclosing the plurality of wires; wherein the differential signal wires, the detection signal wire, and the at least one auxiliary signal wire are arranged at an outer periphery of and enclosing the low speed signal wires and the two power wires, and every two adjacent differential signal wire pairs are separated by one of the detection signal wire and the at least one auxiliary signal wire.
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公开(公告)号：US20170207190A1
公开(公告)日：2017-07-20
申请号：US15324759
申请日：2015-07-22
Applicant: DEXERIALS CORPORATION
Inventor： Reiji TSUKAO
IPC: H01L23/00 , H01L23/498
CPC classification number: H01L24/73 , G02F1/13458 , G02F2202/28 , H01L22/14 , H01L23/49811 , H01L23/49838 , H01L24/14 , H01L24/17 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/13017 , H01L2224/13019 , H01L2224/13144 , H01L2224/13147 , H01L2224/16012 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29357 , H01L2224/29371 , H01L2224/32225 , H01L2224/73204 , H01L2224/81132 , H01L2224/81191 , H01L2224/81203 , H01L2224/83132 , H01L2224/83192 , H01L2224/83203 , H01L2224/9211 , H01L2924/1426 , H01R4/04 , H01R12/7076 , H01R13/2414 , H05K1/111 , H05K3/323 , H05K2201/0269 , H05K2201/09409 , H01L2924/00
Abstract: A connection body includes a circuit board terminals arranged into terminal rows, the terminals rows being arranged in parallel to one another in a widthwise direction orthogonal to a direction in which the terminals are arranged, and an electronic component including bumps arranged into bump rows corresponding to the terminal rows, the bumps being arranged in parallel to one another in a widthwise direction orthogonal to a direction in which the bumps are arranged. The electronic component is connected upon the circuit board interposed by an anisotropic conductive adhesive including electrically conductive particles arranged therein. A distance between mutually opposing terminals of the terminals and bumps of the bumps arranged toward the outer sides of the circuit board and the electronic component is greater than a distance between mutually opposing terminals of the terminals and bumps of the bumps arranged toward their inner sides.
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公开(公告)号：US20170176700A1
公开(公告)日：2017-06-22
申请号：US15394642
申请日：2016-12-29
Applicant: FINISAR CORPORATION
Inventor： Yan yang Zhao , Bernd Huebner , Tengda Du , Yuheng Lee
CPC classification number: G02B6/4279 , G01J1/0425 , G02B6/4246 , G02B6/428 , G02B6/4292 , H05K1/0219 , H05K1/0224 , H05K1/0243 , H05K1/0274 , H05K1/0284 , H05K1/0298 , H05K1/115 , H05K1/117 , H05K1/147 , H05K2201/09227 , H05K2201/09409 , H05K2201/0949 , H05K2201/09618 , H05K2201/09672 , H05K2201/10121
Abstract: Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.
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